X service技术参数 - 第6页

6 Placement principl e Collect & Place Machine Description Extensions Extensions The following opti ons are available to extend th e machine's functionalit y: • Additional component changeover ta bles increase m…

Machine Description

Overview

Description

Three variants of the SIPLACE

X-series placement machines

are available:

SIPLACE X2, the placement

machine with 2 gantries,

SIPLACE X3, the placement

machine with 3 gantries and

SIPLACE X4, the placement

machine with 4 gantries

Two placement methods are

used:

•the Collect&Place

method for high-speed

placement of standard

components (see illustra-

tion on page 6)

•the Pick&Place method

for fast placement of spe-

cial fine-pitch and super-

fine pitch components

The gantries driven by linear

motors can be positioned

quickly and accurately in the

X and Y directions. There is a

placement head on each gan-

try.

The head modularity princi-

ple allows the placement

heads to be reconfigured to

suit changing requirements.

Table "Technical Data“ on

page 7 contains a list of the

possible placement head

configurations and the

resulting placement rate.

The moving head picks up

the components from their

stationary feeder, and places

them on the PCB, which is

also stationary. This proven

SIPLACE principle has many

advantages:

• Short down times for refill-

ing or splicing

• Even the smallest compo-

nents are picked up reli-

ably

• The components cannot

slip on the PCB

• Minimal traversing paths

High flexibility, cost-effec-

tiveness and set-up reliability

guarantee that the SIPLACE X

placement systems will be

highly productive. The mini-

mal down times increase

utilization, thus further

increasing productivity.

SIPLACE X2

SIPLACE X3

SIPLACE X4

Placement principle

Collect&Place

Machine Description

Extensions

The following options are

available to extend the

machine's functionality:

• Additional component

changeover tables

increase machine utiliza-

tion since set-up times can

be reduced by carrying out

preliminary set-up off the

machine.

• Large and sensitive fine-

pitch components can be

supplied in trays by a

matrix tray changer.

• The dual conveyor also

increases machine utiliza-

tion by eliminating non-

productive PCB transport

times.

• Automatic nozzle chang-

ers speed up and optimize

the nozzle configuration

process.

• PCB barcode scanners

allow the production set-

up to be changed over

when triggered by a new

product.

• Component barcode scan-

ners optimize the set-up

and refill checks.

• The productivity lift imple-

ments the concept of par-

allel placement, and thus

improves the ratio be-

tween productive and

non-productive times.

Machine Description

Technical Data

Types of placement head 20-nozzle Collect & Place head (C&P20)

12-nozzle Collect & Place head (C&P12)

6-nozzle Collect & Place head (C&P6)

SIPLACE TwinHead (TH)

SIPLACE X4 placement system

Number of gantries 4 (see Fig. page 10)

Placement head configuration

and placement rate

(Benchmark test)

Placement area 1 Placement area 2 Placement rate

C&P20 / C&P20 C&P20 / C&P20 80.000 cph

C&P20 / C&P20 C&P12 / C&P12 66.400 cph

C&P20 / C&P20 C&P12 / C&P6 60.300 cph

C&P20 / C&P20 C&P6 / C&P6 58.300 cph

C&P12 / C&P12 C&P12 / C&P12 52.800 cph

C&P12 / C&P12 C&P12 / C&P6 46.700 cph

C&P12 / C&P12 C&P6 / C&P6 44.700 cph

C&P12 / C&P6 C&P12 / C&P6 40.600 cph

C&P12 / C&P6 C&P6 / C&P6 38.600 cph

C&P6 / C&P6 C&P6 / C&P6 36.600 cph

SIPLACE X3 placement system

Number of gantries 3 (see Fig. page 10)

Placement head configuration

and placement rate

(Benchmark test)

Placement area 1 Placement area 2 Placement rate

C&P20 / C&P20 C&P20

60.000 cph

C&P20 / C&P20 C&P12 54.000 cph

C&P20 / C&P20 C&P6 49.300 cph

C&P20 / C&P20 TH 43.700 cph

C&P12 / C&P12 C&P12 40.400 cph

C&P12 / C&P12 C&P6 35.700 cph

C&P12 / C&P12 cph 30.100 cph

C&P12 / C&P6 C&P6 29.600 cph

C&P12 / C&P6 TH 24.000 cph

C&P6 / C&P6 C&P6 27.600 cph

C&P6 / C&P6 TH 22.000 cph

*) This combination is only available on request

SIPLACE X2 placement system

Number of gantries 2 (see Fig. page 10)

Placement head configuration

and placement rate

(Benchmark test)

Placement area 1 Placement area 2 Placement rate

C&P20 C&P20

40.000 cph

C&P20 C&P12

34.000 cph

C&P20 C&P6

29.300 cph

C&P20 TH

23.700 cph

C&P12 C&P12 28.000 cph

C&P12 C&P6 23.300 cph

C&P12 TH 17.700 cph

C&P6 C&P6 18.600 cph

C&P6 TH 13.000 cph

TH TH 7.400 cph

*) This combination is only available on request

Placement positions 3.500 / gantry for the Collect & Place head

Range of components 0.6 x 0.3 mm² (0201)

**)

to 85 x 85 mm² / 125 x 10 mm² max. 200 x

125 mm² (with restrictions)

**) Smaller components, e.g. 01005 available on request