Detailed Circuit Diagram Folder SIPLACE F5 - 第114页
4 Printed Circui t Boards 114 I 00321525-020102ND4 Component illumination 0032210 0-030 102ND 4 Anti-crash board 02.09.1 992 Golle r 00322100-030 102ND4 Ant i-c ra sh bo ard MSTB 3. 04.03. 97 Sz 1. 2. 04.03. 97 05.06. 97…
4 Printed Circuit Boards 113
I
00321523-040202ND4 IC head board
00321524-040101ND4 Sensor, Z-axis down
V1
3344
* : refer to 00321524-040101LD4
3. Funct. status 06.05.96 TE
4. Funct. status 01.04.98 bmk
Stat. Modified Date
Date
Author
Check.
Stand.
Mat.-Nr.:
Scale
06.05.1996
Siemens AG
The following labels have to be stuck on!
Maximum component height: 7 mm
Solder cable from mounting side and do not bend.
V1
360 mm
Splice 25 mm
210mm
EE
DD
1.
1.
321524
06.05.96
06.05.96Prod. status
Doc. status
TE
TE
Name
TE - Ne
AUT-BSM
X11
12783
KEY
KEY
B
A
CC
AA
BB
Silicone hose
TE
A: Identification label
B: Inspection label
1122
00321524-040101ND4
View onto cable side
= KEY
SMD Placement System Siplace 80S/20
Sensor z axis bottom
2:1
20 mm
1
1
2
Sheet
1
1
Sh.
7
X11
X11
*
BAU
The following labels have to be applied!
V6V5
Mount J6 on spacer
C: ESD label
A: Identification label
B: Inspection label
Maximum component height: 13 mm
2.
2.
4.
EE
DD
x = key
Siemens AG
R6
X3
C7
A
C5
R5
L1
C15
J4
C10
V7
R26
X1
R25
C26
R8
C29
P2
R9
R23
P1
R7
J2
C25
C
V2
V1
C1
R1
B
R4
C14
R3
R2
C6
C4
C3
C17
C13
C12
C16
C9
C8
C2
J3
14.11.96 TE
14.11.96 TE
18.03.96 TE
AUT-BSM
14.11.1996
TE - Ne
X12
X10
X9
V8
CC
BB
C22
R14
R13
J6
R12
C18
AA
11
R24
R17
R16
R15
C24
C28
J7
C27
J1
C23
X11
X8
V12
J5
C11
V10
V11
V9
X6
22
00321523-040202ND4
Warning !!
Compare pressure sensor coding and solder connection (JP1,
JP2) with values RB25, RB125 in measurement values table:
RB25 < RB125: jumper 1-2
RB25 > RB125: jumper 2-3
IC head board
X3
Sheet
Sh.
X5
R21
R18
R10
C19
R11
C21
R19
C20
V4
R20
P3
V3
R22
X7
X4
33
±3mm
190mm
44
Function status
SMD Placement System Siplace 80S20
Doc. status
1
1
Product status
Stat. Modified Date Name
Date
Author
Check.
Stand.
4 Printed Circuit Boards 114
I
00321525-020102ND4 Component illumination
00322100-030102ND4 Anti-crash board
02.09.1992
Goller
00322100-030102ND4
Anti-crash board
MSTB
3. 04.03.97 Sz
1.
2.
04.03.97
05.06.97
Sz
Tek
A
B
C
D
E
1234
AUT5-BSM
Siemens AG
00322100-030102ND4
C = ESD label
B = Inspection label
A = Identification label
IC12
IC11 IC13 IC15 IC17
IC14 IC16 IC18
IC19
X1
A
B
EGB
C
TP1 TP2 TP10
V14 V15 V16 V17 V18
TA1
R8 R9 R10 R11 R12
C25
C11
IC5
IC6
IC7
IC8
IC10
IC9
V1 V3 V6 V5 V8 V9 V11 V12
V13V10V2 V4 V7
R76
R58
R78
R77
R79
R16
R19
R20
R21
R22
R64
R71
R17
R59
IC2
IC3
IC1
TP7
TP8TP6
TP4
TP5
TP3
R56
R57
R15
R70
R85
R72
R30
R29
R91
R90
R75
R40
R38
R39
R7
R42
R6
R31
R32
R34
R35
R3
R5
R4
R23
R24
R2
R26
R27
R82
R83
R84
R73
R37
R74
R89
R88
R60
R61
R13
R92
R14
R47
R41
R43
R33
R48
R50
R66
R67
R68
R49
R45
R46
R65
R18
R86
R87
R80
R81
R63
R25
R52
R99
R98
R28
R53
R97
R96
R36
R54
R44
R55
R62
R51
R93
R1
R69
R95
R94
V26
C3
C10 C15 C14 C19 C18
C1C2
V19
V21
V24
V25
V23
V22
V20
C8
C9
C12
C13
C16
C17
C20
C21
C22 C23C24
TP9
V27
+++++
Function status
SMD Placement System Siplace 80S
Doc. status
1
1
Product status
CAD file:
Date
Author
Check.
Stand.
Status Modified Date Name
Sh.
Sh.
Scale
Status Modified Date Name
Date
Author
Check.
Stand.
Sheet
Sh.
Scale
Status Date Name
Date
Author
Check.
Stand.
Sheet
Sh.
Maximum component height: on top 12 mm, on bottom 10 mm
CC
X3
BB
Top side
= KEY
X4
J2
C9
V1
V4 V6
V7
R1
R2
X5 X4
A: Identification label
C: ESD label
AA
1122
B: Inspection label
3344
DD
Siemens AG
06.09.1995
WMW-Muenchen
TE-
EE
Bottom side
C3
C1
C5
C7
X2
COMPONENT ILLUMINATION
1
1
1,5:1
00321525-020102ND4
SMD PLACEMENT SYSTEM SIPLACE 80S/20
C2
C4 C8
J1
J3
C6
V3V5
X1
R3
R4
V2
4 Printed Circuit Boards 115
I
00323146-010101ND3 IC-illumination motherboard, component layout
BSE 45
B
X5
A: Identification label
The following labels have to be stuck on!
TE - WG
28.09.95
C: ESD label
B: Inspection label
A
SE 11,25 BSE 22,5
C9
C1
C17
C5
C7
I6
C8
R1
JP1
X8
C4
X3
C10
BSE 45
C3
X2
C11
I7
I1
X6
C12
C13
G1
C21
C2
I3
C6
R5
R6
C22
C15
R7
C14
R4
I2
Status Modified Date Name Stand.
Check.
Author
Date
Sheet
Sh.
A1
R2
JP3JP2
A1
X4
M3x6
SIPLACE 80F4
Motherboard IC illumination
Component layout
Use soldering tin to hard-wire JP1, JP2, JP3.
AUT WMW SMD E
SIEMENS AG
1
1
00323146-010101ND3
Keep holes X4, X5, X8 clean of soldering tin.
Maximum component height: 16 mm
C
SE 11,25
X1
= Key
X7
C16
I5
R3
G2
JP4
C20
C18
I4
C19
Distance bolts
A1
Spacer