Detailed Circuit Diagram Folder SIPLACE F5 - 第131页

4 Printed Circui t Boards 131 I 0033064 8-050 101ND4 SP6-1 2 inter m ed. distr ibutio n board, d igita l (Sh. 1 o f 2) = Sheet SIEMENS AG Sh. + 1 4 B 8 6 F 5 6 45 D E E 23 78 C B A 3 2 D C F A 7 1 01. 01. 05. PL E A MUEN…

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4 Printed Circuit Boards 130
I
00330647-070101ND3 SP6_12 head board, digital (Sh. 2 of 2)
COMPONENT MOUNTING DIAGRAM, COMPONENT SIDE
All diagrams viewed from component side
SP6_12 HEAD BOARD
G32918-J0005-B001-*-0017
828 PCB
4-layer PC board
00330647-070101ND3
54
52
53
55
Change noticeStatus
30.07.97
12.05.97
23.04.97
30.07.97
Date
FE
FE
FE
FE
Name
ANL TD E E
SIEMENS AG
FettichName
24.02.97
Date
1 : 1Scale Mentor
Sheet
2 -
4 Printed Circuit Boards 131
I
00330648-050101ND4 SP6-12 intermed. distribution board, digital (Sh. 1 of 2)
=
Sheet
SIEMENS AG
Sh.
+
1 4
B
8
6
F
5
645
D
E E
23 78
C
B
A
32
D
C
F
A
71
01.
01.
05.
PL EA MUENCHEN
00330648-050101ND4
#
1
2
Product status
Doc. status
Function status
12.10.00 PIB
Intermed. distributor, SP6-12, digital SP6-12 Head
Bestueckungsplan / Components
Status Modified Date Name
Date
Author
Check.
Stand. Orig. Creat. f. Creat. by
4 Printed Circuit Boards 132
I
00330648-050101ND4 SP6-12 intermed. distribution board, digital (Sh. 2 of 2)
=
Sheet
SIEMENS AG
Sh.
+
1 4
B
8
6
F
5
645
D
E E
23 78
C
B
A
32
D
C
F
A
71
01.
01.
05.
PL EA MUENCHEN
00330648-050101ND4
#
2
2
Product status
Doc. status
Function status
Intermed. distributor, SP6-12, digital SP6-12 Head
12.10.00 PIB
Bestueckungsplan / Components
Status Modified Date Name
Date
Author
Check.
Stand. Orig. Creat. f. Creat. by