MPM全自动印刷机中文操作手册 - 第44页
44 3. Device Layout 做 2D( 錫膏覆蓋率 ) 檢查時 , 所要檢查零件 About to begin Device Layout TEACH. ( 即將開始做 2D 檢查的零件之設定 ) Pr ess NEXT to Continue, or EXIT to Quit. ( 按 NEXT 繼續 , 按 EXIT 離開 ) 按 NEXT 之後 , 出現下列視窗畫面 ADD or DELETE Device ( 新增或…
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ADD or DELETE targets to change the(新增或刪除,所指 Mark 點位置或變更目
current vision layout.前 Mark 點位置)
Press EXIT when you are FINISHED. (當你已完成 Teach vision 按 EXIT)
按 EXIT 之後,出現存入檔案鍵盤畫面
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3. Device Layout
做 2D(錫膏覆蓋率)檢查時,所要檢查零件
About to begin Device Layout TEACH. (即將開始做 2D 檢查的零件之設定)
Press NEXT to Continue, or EXIT to Quit. (按 NEXT 繼續, 按 EXIT 離開)
按 NEXT 之後,出現下列視窗畫面
ADD or DELETE Device(新增或刪除,所指 2D 零件點位置或變更目前位置)
To change the current .
About to begin Device Layout TEACH.
Press NEXT to Continue, or EXIT to Quit.
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Press EXIT when you are FINISHED. (當你已完成 Device Layout 按 EXIT)
增加一個 2D 檢查點
刪除一個 2D 檢查點
將點選到位置放大與縮小
你按 ADD 之後，出現下列訊息視窗：
Please SELECT the type of device to be added . (請選擇新增 2D 零件型式)
Press EXIT to quit. (按 EXIT 離開)
ADD
DELETE
ZOOM IN