2026 Ersa-Electronics-Production-Overview.pdf - 第18页
i - CO N 1 C MK 2 R o bo t R ead y Hand soldering meet s automa tion Simple, reliable integration in robotic en vironments Safe, repr oducible soldering processes Safe tip e xchange within record time due to Tip&ap…
REWORK
printed circuit boards. With an active
heating surface of 625 × 625 mm
(24 × 24 inches) and a maximum PCB
thickness of 10 mm, it is ideal for tele-
communications, network technology, IT,
and AI infrastructure.
HR 600 XL - Automated
Rework in X(X)L
The HR 600 XL is designed for the
professional rework of BTC (bottom-ter-
minated components) using selective re-
flow soldering processes on large-format
Processing of giant components
Four different heating heads are available
for the largest Kurtz Ersa rework system,
which can process components with an
edge length of up to 160 x 160 mm. The
“Click to Place” feature integrated into
the software, together with a high-reso
-
lution camera, ensures fast and error-free
component placement.
Placement result of a BGA 7400, edge length
134 x 134 mm, with overlay of X-ray inspection result
Large-format BGA under the XXL heating head
Automatic residual solder removal
The integrated AUTO SCAVENGER
removes residual solder remaining on
the circuit board after desoldering in
a non-contact and gentle automated
process. For optimal suction results, the
parameters can be individually adjusted to
the application.
Cleaned pads with less than 20 μm of residue
(3D image)
Removal of residual solder
Highlights
n
High-performance hybrid
heating heads from 60 x 60 mm
to 160 x 160 mm, 800 to 4,800 W
n
IR Matrix™ bottom heater (25
elements), 15 kW, expandable
n
Process monitoring with up to
8 thermocouples
n
Precise component alignment
via image processing
n
Motorized axis system for com-
ponent placement (± 0.025 mm)
n
Residual solder removal via
integrated AUTO SCAVENGER
n
User-independent, reproducible
rework results guaranteed
n
Process control and
documentation via HR Soft 2
n
Fully or semi-automatic operation
n
Optional Dip&Print Station
16 17
SURFACE-MOUNT TECHNOLOGY
i-CON 1C MK2 Robot Ready
Hand soldering meets automation
Simple, reliable integration in robotic
environments
Safe, reproducible soldering processes
Safe tip exchange within
record time due to Tip'n'Turn
Fast heat-up/reheat
Up to 20 % more performance
The i-CON 1C MK2 ROBOT READY automates
manual soldering processes and can be
flexibly integrated into robotic systems.
Poka-Yoke prevents assembly defects, and
the tool-free tip change using the Tip’n’Turn
principle minimizes downtime. QR codes
enable automated identification.
i-TIP CLEANER
Tip cleaning in record time.
The i-TIP CLEANER removes solder, flux, and oxide residues in less than a second - quickly
and gently. This ensures consistently high soldering quality, increased process reliability,
longer service life for soldering and desoldering tips, and thereby increases productivity.
NEW
Increases productivity
Improves soldering quality
Extends tip life
Automatic activation
Easy maintenance
Further
information:
18 1918 1918
SMART SOLDERING
STARTS NOW!
HAND SOLDERING
i-CON TRACE
The world's most connected soldering station.
100% connectivity through easy access via web browser
Comprehensive documentation/MES connection
Seamless traceability
Tip change in record time with Tip'n'Turn
Easy operation thanks to intuitive LED interface
Outstanding performance & minimal costs
Further
information:
The i-CON TRACE is the world's first fully connected soldering station. Thanks to
integrated Wi-Fi, Bluetooth, and network card, the IoT soldering station can even
be integrated into MES-controlled production processes, making the entire manual
soldering process traceable and documentable.
18 19
SURFACE-MOUNT TECHNOLOGY
THROUGH-HOLE TECHNOLOGY
18 1919