SG_FSE_SiplaceHF_HF3_00193901-05_eng - 第57页
1 - 31 S tudent Guide SIPLACE HF/HF3 Edition 09/2005 2 Overview 31 2.2.12.4 Finepitch-camera for T win head 2 Fig. 2.2 - 20 Finepitch-camera T echnical dat a 2 2 Option: Flip chip camera available.(Camera type 20.sst) 2 …
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Student Guide SIPLACE HF/HF3
2 Overview Edition 09/2005
30
2.2.12.3 Component camera 6 segments C&P head
2
Fig. 2.2 - 19 Component camera standard on the 6-segment-Collect&Place-head
1. Component camera optics and illumination
2. Camera amplifier
3. Illumination control
Technical data 2
2
Option: DCA camera available (Camera type 14.sst) 2
Component size 1,6 mm x 0,8 mm bis 32 mm x 32 mm
Components 0603 bis 32 mm x 32 mm
PLCC, SO, QFP, TSDP, SOT, MELF, CHIP, IC BGA
Min. pitch 0,5 mm
Min. Bump-Raster 0,56 mm
Min. Ball-/Bump-Raster 0,32 mm
Field of view 39 mm x 39 mm
Kind of illumination from above (3 level free programmable)
Camera type .sst 13.sst
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Student Guide SIPLACE HF/HF3
Edition 09/2005 2 Overview
31
2.2.12.4 Finepitch-camera for Twin head
2
Fig. 2.2 - 20 Finepitch-camera
Technical data 2
2
Option: Flip chip camera available.(Camera type 20.sst) 2
1. Camera frame with integrated camera and cam-
era amplifier
2. inside the illumination and optics levels
Component size bis 40 mm x 50 mm by single measuring mode
Components 0603, MELF, SO, PLCC, QFP, Electrolytcapacitors, BGA
Min. pitch 0,4 mm
Min. Bump diameter 0,4 mm
Field of view 45 mm x 60 mm
Kind of illumination from bottom side (4 level free programmable)
Camera type .sst 22.sst
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Student Guide SIPLACE HF/HF3
2 Overview Edition 09/2005
32
2.2.13 Head modularity HF
A very useful feature in the SIPLACE family is its head modularity. For the HF machine, we
have the following possibilities:
Gantry 1
– 12-Segment Collect&Place-head or
– 6-Segment Collect&Place-head or
– SIPLACE TwinHead)
Gantry 3
– SIPLACE TwinHead or
– 12-Segment Collect&Place-head (with SW 505) or
– 6-Segment Collect&Place-head (with SW 505)
A simple handling to change the head, the machine can be fit to the current production require-
ments.
Fig. 2.2 - 21 Head modularity HF