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WEST•BOND MODEL 454647E SER IES INSTRUCTION MANUAL Rev: 6 January, 2012 vi TROUBLESHOOTING ................................................................................................................ .9 9 Poor Bond Q…

WEST•BOND MODEL 454647E SERIES INSTRUCTION MANUAL

Rev: 6 January, 2012 v

Ultrasonic Power During Feed........................................................................................63

Ultrasonic Power During Thread.....................................................................................64

Ultrasonic Diagnostic Test ..............................................................................................65

Wire Break Z Offset.........................................................................................................66

Ultrasonic Positioning Utility (UPU).................................................................................67

Device Edit Menu............................................................................................................68

Erase Device...................................................................................................................69

Copy Device....................................................................................................................70

Wire Type Edit Menu.......................................................................................................71

Delete Type.....................................................................................................................72

Edit Type.........................................................................................................................73

Edit Number of Wires......................................................................................................74

Edit Critical Bond.............................................................................................................75

Add Type.........................................................................................................................76

Copy Type.......................................................................................................................77

Bond Edit Menu...............................................................................................................78

Edit Bond.........................................................................................................................79

Edit Ultrasonic Power......................................................................................................80

Edit Ultrasonic Time........................................................................................................81

Edit Bond Force ..............................................................................................................82

Edit Bond Depth..............................................................................................................83

Edit Inhibit Auto Mode.....................................................................................................84

Edit Speed.......................................................................................................................85

Edit Pre-Bond Delay........................................................................................................86

Edit Number of Bonds.....................................................................................................87

Edit Loop Motion.............................................................................................................88

Edit Loop Menu...............................................................................................................89

Search.............................................................................................................................90

Z-Before-Y.......................................................................................................................91

Backbend........................................................................................................................92

Loop Elevation ................................................................................................................93

Y-Offset...........................................................................................................................94

Close Clamp at Loop Height...........................................................................................95

Close Clamp at Search...................................................................................................96

ADVANCED PROGRAMMING....................................................................................................97

Loop Pull.........................................................................................................................97

Nudge Up........................................................................................................................98

WEST•BOND MODEL 454647E SERIES INSTRUCTION MANUAL

Rev: 6 January, 2012 vi

TROUBLESHOOTING.................................................................................................................99

Poor Bond Quality...........................................................................................................99

Inconsistent Looping.......................................................................................................100

Ultrasonic Board (P/N A-10345) .....................................................................................101

TOOL HEAD CONVERSION.......................................................................................................102

45° to 90° Tool Head Conversion ...................................................................................102

90° to 45° Tool Head Conversion ...................................................................................103

Wedge to Ball Bonder Tool Head Conversion................................................................104

Change Model Number of Machine................................................................................105

CLAMP ADJUSTMENT................................................................................................................106

Vertical Positioning..........................................................................................................106

Horizontal Positioning .....................................................................................................106

Testing ............................................................................................................................106

RADIANT HEATER CHARTS......................................................................................................107

Dial Settings for 0.750” Tools..........................................................................................107

Dial Settings for 0.625” Tools..........................................................................................108

APPLICATION AND BOND SCHEDULE.....................................................................................109

WARRANTY.................................................................................................................................111

Patent Information...........................................................................................................111

SPARE PARTS............................................................................................................................112

TECHNICAL INFORMATION.......................................................................................................114

PCB’s and Power Supplies.............................................................................................114

Motor Drivers...................................................................................................................115

AC to DC Converter........................................................................................................115

DC to DC Converter........................................................................................................116

Solenoids ........................................................................................................................117

Motor Driver Boards........................................................................................................117

X-Y-Z Head Assembly.....................................................................................................118

Ultrasonic Power Supply.................................................................................................119

SCHEMATIC INFORMATION......................................................................................................120

WEST•BOND MODEL 454647E SERIES INSTRUCTION MANUAL

INTRODUCTION

WEST•BOND’S new “E” Version starts the twentieth year of the Model 4500 tradition. This machine was

revolutionary at its inception as the first to make a wire bond connection fully under programmable

software control executed digitally by motors, thus making possible the manufacture of high frequency,

high power semiconductor devices where connections must be identical. The original design, with digi-

switches for input and with LED’s to display individual data lines by binary value, remained unchanged by

customer insistence until finally supplanted by the current 4500 Model of the “B” Series. Now, Model

454647E brings forward the new advances of the “E” Series, notably the placement of all machine

mechanism above the work plane to allow unlimited access, and the setting of axis brakes to lock on

target. In this model the tool, rather than the work, is moved, both for alignment and for bonding, with the

work pre-rotated. There is choice of alignment by either microscope or video. Bond heads are built

around a 63 kHz ultrasonic transducer and provide full three-way convertibility.

When operating in the 4500E mode, the 454647E is an ultrasonic wedge-wedge wire bonder designed to

interconnect wire leads to semi-conductor, hybrid, or microwave devices. The machine bonds aluminum

or gold wires ranging from 0.0007 in. to 0.002 in. Bonds are by the wedge-wedge technique using

ultrasonic energy to attach aluminum wire at room temperature and adding work piece heat for gold wire.

Wire is clamped and threaded diagonally under the bonding wedge, allowing independent feeding action

but requiring front-to-back bonding direction.

When operating in the 4600E mode, the 454647E is a thermosonic wedge-wedge wire bonder designed

to interconnect wire leads to semiconductor, hybrid, or microwave devices. The machine bonds aluminum

or gold wires ranging from 0.0007 in. to 0.002 in. and aluminum or gold ribbon ranging from 0.0005 in. x

0.002 in. to 0.001 in. x 0.01 in. Bonds are made by the wedge-wedge technique using ultrasonic energy

and work piece heat. Wire is clamped and threaded vertically through a hollow wedge, allowing

independent feeding action but requiring front-to-back bonding direction.

When operating in the 4700E mode, the 454647E is a thermosonic ball-wedge wire bonder designed to

interconnect wire leads to semiconductor, hybrid, or microwave devices. The machine bonds gold wires

ranging from 0.0007 in. to 0.002 in. Bonds are made by the ball-to-wedge technique using ultrasonic

energy and work piece heat. Wire is clamped and threaded vertically through a hollow capillary, allowing

independent feeding action. The connection is begun with a ball formed on the end of the wire stock by

electric discharge, and completed by a wedge bond under the end of the capillary tool. The bonding tool

is guided manually by the operator using hand/eye reference to bond targets and elevations.