【IPC-7095C】_BGA设计与组装工艺的实施_（IPC标准）.pdf - 第162页
UUT Unit Under T est 被 测单 元 UV Ultraviolet 紫 外线 VFBGA V ery Thin-Profile Fine-Pitch Ball Grid Array 极 薄 外形细节距 球栅阵列 WEEE W aste in Electrical and Electronic Equipment 废 弃 电子电 器设备 ZIF Zero Insertion Force 零 插 拔 力 IPC-7095C…
PCM Phase Change Materials
相变材料
PCMCIA Personal Computer Memory Card
International Association
个人计算机存储卡国际协会
PGA Pin Grid Array
针栅阵列
PLCC Plastic Leaded Chip Carrier
塑料有引线芯片载体
PSA Pressure Sensitive Adhesives
压敏粘合剂
PTH Plated Through-Hole
镀通孔
QFP Quad Flat Pack
方形扁平封装
RDS Rectangular Die Size
矩形芯片尺寸
RF Radio Frequency
射频
RFID Radio Frequency Identification
射频识别
RMS Root Mean, Square
均方根
RoHS Restriction of Hazardous Substances
有害物质限制
RSS Ramp-Soak-Spike
升温-保温-峰值
RTS Ramp-to-Spike
升温至峰值
SAC Sn/Ag/Cu
锡/银/铜
SDRAM Synchronous Dynamic Random
Access Memory
同步动态随机访问存储器
SGA Solder Grid Array
焊料栅格阵列
SIR Surface Insulation Resistance
表面绝缘电阻
SMD Solder Mask Defined
阻焊膜限定
SMOBC Solder Mask Over Bare Copper
裸铜覆阻焊膜
SMT Surface Mounting Technology
表面贴装技术
SO-
DIMM
Small Outline Dual In-Line
Memory Module
小外形双列直插存储模块
SOIC Small Outline Integrated Circuit
小外形集成电路
SPC Statistical Process Control
统计过程控制
SRAM Static Random Access Memory
静态随机存取存储器
SSO Simultaneously Switching Output
同步开关输出
STII Soldering Temperature Impact Index
焊接温度影响指数
TAB Tape-Automated Bonding
载带自动键合
TAL Time Above Liquidus
液相线上时间
TBBPA Tetrabromobisphenol A
四溴双酚A
TBGA Tape Ball Grid Array
载带球栅阵列
Td Decomposition Temperature
分解温度
TFBGA Thin Profile Fine Pitch Ball Grid Array
薄外形细节距球栅阵列
T
g
Transition Temperature
转变温度
TIM Thermal Interface Materials
热界面材料
TMA Thermal Mechanical Analysis
热机械分析
UFPT Ultra Fine Pitch Technology
超密节距技术
UtRAM Uni-transistor Random Access Memory
单一晶体管随机存取存储器
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UUT Unit Under Test
被测单元
UV Ultraviolet
紫外线
VFBGA Very Thin-Profile Fine-Pitch Ball
Grid Array
极薄外形细节距球栅阵列
WEEE Waste in Electrical and Electronic
Equipment
废弃电子电器设备
ZIF Zero Insertion Force
零插拔力
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11 参考书⽬与参考⽂献
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