【IPC-7095C】_BGA设计与组装工艺的实施_（IPC标准）.pdf - 第163页
11 参考书⽬与参考⽂献 ASI / IPC-MF-150F , “Metal Foil for Printed W iring Applications,” The Institute for Interconnecting and Packaging Electronic Circuits, Lincolnwood, IL, October 1991. Attarwala, A. I., and R. Stierman, “Fai…
UUT Unit Under Test
被测单元
UV Ultraviolet
紫外线
VFBGA Very Thin-Profile Fine-Pitch Ball
Grid Array
极薄外形细节距球栅阵列
WEEE Waste in Electrical and Electronic
Equipment
废弃电子电器设备
ZIF Zero Insertion Force
零插拔力
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11 参考书⽬与参考⽂献
ASI/IPC-MF-150F, “Metal Foil for Printed Wiring
Applications,” The Institute for Interconnecting and
Packaging Electronic Circuits, Lincolnwood, IL, October
1991.
Attarwala, A. I., and R. Stierman, “Failure Mode Analysis
of a 540 Pin Plastic Ball Grid Array,” Proc. Surface
Mount International Conf., San Jose, CA, August-
September 1994, pp. 252-257.
Bogatin, E., “BGAs for Workstation Application,” Proc.
Ball Grid Array at. Symp., Dallas, TX, March 1995.
Davignon, John, and Gray, Foster. “An evaluation of via
hole tenting with solder mask designed to pass Mil-P-
55110D thermal shock requirements.” Proceedings of
Technical Program SMI 91, San Jose, August 25-29,
1991, pp. 905-921.
Denkler, J. D. “The speed of liquid.” Circuits Manufac-
turing, May 1986, pp. 21-24.
D. Hillman, D. Adams, T. Pearson, B. Williams, B.
Petrick, R. Wilcoxon, Rockwell Collins; and D. Bernard,
J. Travis, E. Krastev, V. Bastin, ordson Dage, “The Last
Will and Testament of the BGA Void,” SMTA Interna-
tional 2011.
Engelmaier, W., and B. Fuentes, “Alloy 42: A Material to
be Avoided for Surface Mount Solder Component Leads
and Lead Frames,” Proc. Surface Mount International
Conf., San Jose, CA, August-September 1994, pp. 644-
655; also in Proc. Int. Electronics Packaging Conf.
(IEPS), Atlanta, September 1994, pp. 503-516.
Engelmaier, W., “Reliability Figures of Merit for Surface
Mount Solder Attachments of Components: 2nd Genera-
tion Generic Design Tools,” Proc. Surface Mount Interna-
tional Conf., San Jose, CA, August 1991, pp. 1239-1243.
Engelmaier, W., “Solder Joint Reliability for BGAs and
Other Advanced Electronic Components,” Workshop
otes, Engelmaier Associates, L.C., Ormond Beach, FL,
1999.
Greg Hillman, DfR Solutions, Long-term reliability of
Pb-free electronics (Kirkendall Voiding) hhtp://
www.electronicproducts.com/rohs/?filename+dfr.sep
2005. html
Hines, L. L., “SOT-23 Surface Mount Attachment Reli-
ability Study,” Proc. 7th Annual Int. Electronics Packag-
ing Conf. (IEPS), Boston, MA, ovember 1987, pp.
613-629.
Hwang, J. & Kho, V., “Lead-free Implementation:
Drop-In Manufacturing,” APEX Conference Proceed-
ings, 2004, pp. S40-2-1 to S-40-2-13.
Hwang, J., “Environment-Friendly Electronics: Lead-
free Technology,” ISB 0 901150 401, Electrochemical
Publications LTD, 2001, p. 242 and pp. 64-105.
IPC-TR-462, “Solderability Evaluation of Printed Boards
with Protective Coatings over Long Term Storage,” Octo-
ber 1987, IPC Publications.
John Lau, “Ball Grid Array Technology” 1995. p.122.
Shows a graph of relative PCB cost per layer count.
Katchmar, R., “Position Dependence of CTE in Plastic
Ball Grid Arrays,” Proc. Int. Electronics Packaging Conf.
(IEPS), Atlanta, September 1994, pp. 271-283.
Lebonheur, C. Matayaba, S. Houle, and Y. Xu, Thermal
Interface Material Development, Intel Assembly & Test
Technology Journal, Vol 3, 2000.
Mawer, A. J., S. C. Bolton, and E. Mammo, “Plastic BGA
Solder Joint Reliability Considerations,” Proc. Surface
Mount International Conf., San Jose, CA, August-
September 1994, pp. 239-251.
CMS, Lead-free Solder Project Final Report, August
1997, www.ncms.org.
Orsten, G. S. F., “The Problems Associated with Adhesive
Bonding of Components on Surface Mount Assemblies,”
Proc. 19th Ann. Electronics Manufacturing Seminar,
China Lake, CA, February 1995, pp. 153-163.
Orsten, G. S. F., W. ew, Y. Wang, and M. L. Peloquin
“SMT Considerations in Spaceflight and Critical Military
Applications,” Proc. 18th Ann. Electronics Manufactur-
ing Seminar, China Lake, CA, February 1994, pp. 75-89.
Phelan, G., and S. Wang, “Solder Ball Connection Reli-
ability Model and Critical Parameter Optimization,”
Proc. 43rd Electronic Components and Technology
Conf., Orlando, FL, June 2-4, 1993, pp. 858-862.
Ref: Robert Crowley, Chip Scale Review, May 1998,
p. 37).
Rukavina, J., “Ball Grid Array Attachment Methodolo-
gies,”Proc. Ball Grid Array at. Symp., Dallas, TX,
March 1995.
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Theo I. Eijm, Albert Holliday, Frank E. Bader and Steven
Gahr. AT&T Bell Laboratories, Princeton, J. “Designed
Experiment to Determine Attachment Reliability Drivers
for PBGA Packages.”
‘‘Thermal and Power Cycling Limits of Plastic Ball Grid
Array (PBGA) Assemblies,” Robert Darveaux and
Andrew Mawer, Motorola.
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