【IPC-7095C】_BGA设计与组装工艺的实施_（IPC标准）.pdf - 第4页
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IPC-7095C CN
BGA设计与组装⼯艺的实施
由IPC组装&连接工艺委员会（5-20）的IPC球栅阵列工作
组（5-21f）开发，由IPC TGAsia 5-21fC技术组翻译
鼓励本标准的使用者参加未来修订版的开发。
联系方式：
IPC
3000 Lakeside Drive
Suite 105N
Bannockburn, Illinois
60015-1249
Tel 847 615.7100
Fax 847 615.7105
IPC 中国
电话：400-621-8610
邮箱：BDAChina@ipc.org
网址：www.ipc.org.cn
青岛 上海深圳北京苏州成都
取代：
IPC-7095B - 2008年3月
IPC-7095A - 2004年10月
IPC-7095 - 2000年8月
If a conflict occurs
between the English
and translated versions
of this document, the
English version will
take precedence.
本文件的英文版本与翻
译版本如存在冲突, 以
英文版本为优先。
®
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鸣谢
任何包含复杂技术的标准都要有大量的资料来源。我们不可能罗列所有参与和支持本标准开发的个人和单位，下面
仅列出了IPC组装&连接工艺委员会（5-20）下的IPC球栅阵列工作组（5-21f）的主要成员。然而我们不得不提到IP
C TGAsia 5-21fC技术组的成员，他们力求译文文字的信达雅，为此标准中文版的翻译、审核付出了大量的时间和
艰苦的劳动。我们在此一并对上述各有关组织和个人表示衷心的感谢。
组装&连接⼯艺委员会 球栅阵列技术组 IPC董事会技术联络员
主席
Leo P. Lambert
EPTAC Corporation
主席
Ray Prasad
Ray Prasad Consultancy Group
Bob eves
Microtek Laboratories
Dongkai Shangguan
Flextronics International
球栅阵列技术组
David Adams, Rockwell Collins
Syed Sajid Ahmad, orth Dakota
State University
Dudi Amir, Intel Corporation
Raiyomand Aspandiar, Intel
Corporation
Elizabeth Benedetto, Hewlett-Packard
Company
Gerald Leslie Bogert, Bechtel Plant
Machinery, Inc.
Richard Bradford, Raytheon Company
Lyle Burhenn, BAE Systems Platform
Solutions
Stephen Butkovich, Cisco Systems,
Inc.
Scott Buttars, Intel Corporation
Calette Chamness, U.S. Army
Aviation & Missile Command
Beverley Christian, Research In
Motion Limited
Terence Collier, Collier Ventures, Inc.
Richard Davidson, Honeywell
Aerospace
William Dieffenbacher, BAE Systems
Platform Solutions
Harold Ellison, Quantum Corporation
Gary Ferrari, FTG Circuits
Joe Fjelstad, Verdant Electronics
Lionel Fullwood, WKK Distribution
Ltd.
Mahendra Gandhi, orthrop
Grumman Aerospace Systems
Reza Ghaffarian, Jet Propulsion
Laboratory
Constantino Gonzalez, ACME
Training & Consulting
Michael Green, Lockheed Martin
Space Systems Company
Hue Green, Lockheed Martin Space
Systems Company
Gaston Hidalgo, Samsung
Telecommunications America
David Hillman, Rockwell Collins
Robert Hills, Tait Communications
Constantin Hudon, Varitron
Technologies Inc.
Bruce Hughes, U.S. Army Aviation &
Missile Command
Greg Hurst, BAE Systems
Jennie Hwang, H-Technologies Group
Joseph Kane, BAE Systems Platform
Solutions
Lilia Kondrachova, Intel Corporation
Dale Kratz, Plexus Corporation
George Liu, Flextronics Mfg. (Zhuhai)
Co. Ltd.
Helen Lowe, Celestica
Chris Mahanna, Robisan Laboratory
Inc.
Karen McConnell, orthrop
Grumman Corporation
Mradul Mehrotra, Raytheon Missile
Systems
Jay Messner, Boeing Company
Roger Miedico, Raytheon Company
George Milad, Uyemura International
Corp.
Barry Morris, Advanced Rework
Technology
Paul eathway, Jabil Circuit, Inc.
(HQ)
David elson, Adtran Inc.
Lei ie, Intel Corporation
Mark orthrup, IEC Electronics Corp.
Deassy ovita, Intel Corporation
Jack Olson, Caterpillar Inc.
William Ortloff, Raytheon Company
George Oxx, Jabil Circuit, Inc. (HQ)
Agnes Ozarowski, BAE Systems
Deepak Pai, General Dynamics Info.
Sys., Inc
Mel Parrish, STI Electronics, Inc.
Dawn Patterson, orthrop Grumman
Corporation
Sam Polk, Lockheed Martin Missiles
& Fire Control
Ray Prasad, Ray Prasad Consultancy
Group
Jagadeesh Radhakrishnan, Intel
Corporation
John Radman, Trace Laboratories -
Denver
2013年1月 IPC-7095C-C
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