【IPC-7095C】_BGA设计与组装工艺的实施_（IPC标准）.pdf - 第6页
Guy Ramsey ,R&D Assembly T eresa Rowe, AAI Corporation Robert Rowland, RadiSys Corporation Manny Sanchez, Boeing Company Christopher Sattler , AQS - All Quality & Services, Inc. Martin Scionti, Raytheon Missile S…
鸣谢
任何包含复杂技术的标准都要有大量的资料来源。我们不可能罗列所有参与和支持本标准开发的个人和单位，下面
仅列出了IPC组装&连接工艺委员会（5-20）下的IPC球栅阵列工作组（5-21f）的主要成员。然而我们不得不提到IP
C TGAsia 5-21fC技术组的成员，他们力求译文文字的信达雅，为此标准中文版的翻译、审核付出了大量的时间和
艰苦的劳动。我们在此一并对上述各有关组织和个人表示衷心的感谢。
组装&连接⼯艺委员会 球栅阵列技术组 IPC董事会技术联络员
主席
Leo P. Lambert
EPTAC Corporation
主席
Ray Prasad
Ray Prasad Consultancy Group
Bob eves
Microtek Laboratories
Dongkai Shangguan
Flextronics International
球栅阵列技术组
David Adams, Rockwell Collins
Syed Sajid Ahmad, orth Dakota
State University
Dudi Amir, Intel Corporation
Raiyomand Aspandiar, Intel
Corporation
Elizabeth Benedetto, Hewlett-Packard
Company
Gerald Leslie Bogert, Bechtel Plant
Machinery, Inc.
Richard Bradford, Raytheon Company
Lyle Burhenn, BAE Systems Platform
Solutions
Stephen Butkovich, Cisco Systems,
Inc.
Scott Buttars, Intel Corporation
Calette Chamness, U.S. Army
Aviation & Missile Command
Beverley Christian, Research In
Motion Limited
Terence Collier, Collier Ventures, Inc.
Richard Davidson, Honeywell
Aerospace
William Dieffenbacher, BAE Systems
Platform Solutions
Harold Ellison, Quantum Corporation
Gary Ferrari, FTG Circuits
Joe Fjelstad, Verdant Electronics
Lionel Fullwood, WKK Distribution
Ltd.
Mahendra Gandhi, orthrop
Grumman Aerospace Systems
Reza Ghaffarian, Jet Propulsion
Laboratory
Constantino Gonzalez, ACME
Training & Consulting
Michael Green, Lockheed Martin
Space Systems Company
Hue Green, Lockheed Martin Space
Systems Company
Gaston Hidalgo, Samsung
Telecommunications America
David Hillman, Rockwell Collins
Robert Hills, Tait Communications
Constantin Hudon, Varitron
Technologies Inc.
Bruce Hughes, U.S. Army Aviation &
Missile Command
Greg Hurst, BAE Systems
Jennie Hwang, H-Technologies Group
Joseph Kane, BAE Systems Platform
Solutions
Lilia Kondrachova, Intel Corporation
Dale Kratz, Plexus Corporation
George Liu, Flextronics Mfg. (Zhuhai)
Co. Ltd.
Helen Lowe, Celestica
Chris Mahanna, Robisan Laboratory
Inc.
Karen McConnell, orthrop
Grumman Corporation
Mradul Mehrotra, Raytheon Missile
Systems
Jay Messner, Boeing Company
Roger Miedico, Raytheon Company
George Milad, Uyemura International
Corp.
Barry Morris, Advanced Rework
Technology
Paul eathway, Jabil Circuit, Inc.
(HQ)
David elson, Adtran Inc.
Lei ie, Intel Corporation
Mark orthrup, IEC Electronics Corp.
Deassy ovita, Intel Corporation
Jack Olson, Caterpillar Inc.
William Ortloff, Raytheon Company
George Oxx, Jabil Circuit, Inc. (HQ)
Agnes Ozarowski, BAE Systems
Deepak Pai, General Dynamics Info.
Sys., Inc
Mel Parrish, STI Electronics, Inc.
Dawn Patterson, orthrop Grumman
Corporation
Sam Polk, Lockheed Martin Missiles
& Fire Control
Ray Prasad, Ray Prasad Consultancy
Group
Jagadeesh Radhakrishnan, Intel
Corporation
John Radman, Trace Laboratories -
Denver
2013年1月 IPC-7095C-C
iii
Guy Ramsey,R&DAssembly
Teresa Rowe, AAI Corporation
Robert Rowland, RadiSys Corporation
Manny Sanchez, Boeing Company
Christopher Sattler, AQS - All Quality
& Services, Inc.
Martin Scionti, Raytheon Missile
Systems
Sundar Sethuraman, Jabil Circuit, Inc.
Gilbert Shelby, Raytheon Systems
Company
Jeff Shubrooks, Raytheon Company
Dana Smith, Lockheed Martin
Missiles & Fire Control
Vern Solberg, Solberg Technical
Consulting
Kerry Spencer, Lockheed Martin
Missile & Fire Control
Gregg Stearns, Emerson Climate
Technologies- Retail Solutions
Kristen Troxel, Hewlett-Packard
Company
Sharon Ventress, U.S. Army Aviation
& Missile Command
Joe Vo, Broadcom Corporation
Bill Vuono, Raytheon Company
Girish Wable, Jabil Circuit, Inc. (HQ)
Clint Wenthur, Plexus Manufacturing
Solutions - eenah 1
Dewey Whittaker, Honeywell Inc. Air
Transport Systems
Bob Willis, The SMART Group
Linda Woody, Lockheed Martin
Missile & Fire Control
Fonda Wu, Raytheon Company
Michael Yuen, Foxconn
CMMSG-VPD
Gil Zweig, Glenbrook Technologies
Inc.
要特别感谢下⾯的个⼈，正是他们的奉献才使得这个项⽬得以成功。此处我们想强调的是那些为本标准的发展做出
了重⼤贡献的个⼈。
Dudi Amir, Intel Corporation
Raiyomand Aspandiar, Intel
Corporation
Elizabeth Benedetto, Hewlett-Packard
Company
Scott Buttars, Intel Corporation
Michael Green, Lockheed Martin
Space Systems Company
David Hillman, Rockwell Collins
Bruce Hughes, U.S. Army Aviation &
Missile Command
Jennie Hwang, H-Technologies Group
Karen McConnell, orthrop
Grumman Corporation
Ray Prasad, Ray Prasad Consultancy
Group
Jagadeesh Radhakrishnan, Intel
Corporation
Robert Rowland, RadiSys Corporation
Vern Solberg, Solberg Technical
Consulting
Kristen Troxel, Hewlett Packard
Company
Linda Woody, Lockheed Martin
Missile & Fire Control
封⾯和封底照⽚由Wavelength Electronics and euralynx提供。
参与IPC-7095C中⽂版开发的5-21fC技术组成员：
李建江（主席）
任康
陈彦奇
邓奋
杨振英
肖慧
贺光辉
袁杰
徐朝晨
黄志宏
章阳春
王丽荣
潘祥虎
陈吉
刘枫
刘佳毅
雷红慧
梁靖民
项羽
殷国良
赵旸
上海忠麟电子企业有限公司
中航工业西安航空计算技术研究所
德凯宜特(昆山)检测有限公司
福特汽车工程研究（南京）有限公司
深圳市美信检测技术股份有限公司
工业和信息化部电子第五研究所(中国赛宝实验室)
工业和信息化部电子第五研究所(中国赛宝实验室)
上海快贴电子有限公司
四会富士电子科技有限公司
兢陆电子(昆山)有限公司
东莞爱电电子有限公司
北京鹏瑞中联科技有限公司
株洲中车时代电气股份有限公司
株洲中车时代电气股份有限公司
深南电路股份有限公司
杭州华三通信技术有限公司
欣强电子清远有限公司
捷普电子(广州)有限公司
深圳市同方电子新材料有限公司
北京航星科技有限公司
北京航星科技有限公司
IPC-7095C-C 2013年1月
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⽬录
1 范围 ........................................................................... 1
1.1 目的 ..................................................................... 1
1.2 意图 ..................................................................... 1
2 适⽤⽂件 ................................................................... 1
2.1 IPC ....................................................................... 1
2.2 JEDEC ................................................................. 2
3 标准选择和BGA实施管理 ...................................... 2
3.1 基础架构说明 ..................................................... 3
3.1.1 关于连接盘图形和电路板的考量 ..................... 3
3.1.2 技术比较 ............................................................. 5
3.1.3 组装设备影响 ..................................................... 7
3.1.4 模板要求 ............................................................. 8
3.1.5 检验要求 ............................................................. 8
3.1.6 测试 ..................................................................... 8
3.2 投放市场准备 ..................................................... 9
3.3 方法 ..................................................................... 9
3.4 工艺步骤分析 ..................................................... 9
3.5 BGA的局限性和问题 ......................................... 9
3.5.1
外观检验 ............................................................. 9
3.5.2
湿敏性 ............................................................... 10
3.5.3
热非平衡BGA设计 ........................................... 10
3.5.4
返工 ................................................................... 11
3.5.5
成本 ................................................................... 11
3.5.6
可获得性
........................................................... 12
3.5.7
BGA中的空洞 ................................................... 12
3.5.8
焊盘坑裂 ........................................................... 12
3.5.9
标准化问题 ....................................................... 12
3.5.10
可靠性问题 ....................................................... 13
3.5.11
无铅技术的驱动力 ........................................... 13
4 元器件考量 ............................................................. 14
4.1
半导体封装的比较及驱动因素 ....................... 14
4.1.1
封装特点比较 ................................................... 14
4.1.2
BGA封装驱动因素 ........................................... 15
4.1.3
成本问题 ........................................................... 15
4.1.4
元器件操作 ....................................................... 15
4.1.5
热性能 ............................................................... 15
4.1.6
空间 ................................................................... 17
4.1.7
电性能 ............................................................... 17
4.1.8
机械性能 ........................................................... 17
4.2 BGA封装中的芯片安装 ................................... 17
4.2.1 金属线键合 ....................................................... 17
4.2.2 倒装芯片 ........................................................... 18
4.3 标准化 ............................................................... 19
4.3.1 BGA行业标准 ................................................... 19
4.3.2 焊球节距 ........................................................... 20
4.3.3 BGA封装外形 ................................................... 21
4.3.4 焊球尺寸关系 ................................................... 21
4.3.5 叠装BGA ........................................................... 21
4.3.6 共面度 ............................................................... 22
4.4 关于元器件封装形式的考虑 ........................... 22
4.4.1 焊球合金 ........................................................... 23
4.4.2 焊球连接工艺 ................................................... 23
4.4.3 陶瓷BGA ........................................................... 24
4.4.4 陶瓷柱栅阵列 ................................................... 25
4.4.5 载带球栅阵列 ................................................... 25
4.4.6 多芯片封装 ....................................................... 26
4.4.7 系统级封装（SiP） .......................................... 26
4.4.8 3D折叠封装技术 .............................................. 27
4.4.9 焊球堆叠，封装叠装 ....................................... 27
4.4.10 折叠和堆叠的封装组合 ................................... 27
4.4.11 叠装封装 ........................................................... 28
4.4.12 多芯片封装的优势 ........................................... 28
4.4.13 极密节距阵列封装解决方案 ........................... 28
4.5
BGA连接器
和插座 ........................................... 29
4.5.1
BGA连接器材料考量 ....................................... 29
4.5.2
BGA连接器的连接考量 ................................... 29
4.5.3
BGA材料和插座类型 ....................................... 29
4.5.4
BGA插座连接考量 ........................................... 31
4.6
BGA构造材料 ................................................... 31
4.6.1
基板材料类型 ................................................... 31
4.6.2
基板材料性质 ................................................... 32
4.7
BGA封装设计考量 ........................................... 33
4.7.1
电源和接地层 ................................................... 33
4.7.2
信号完整性 ....................................................... 33
4.7.3
封装内置散热片 ............................................... 33
4.8
BGA封装的接收标准和运输方式 ................... 34
4.8.1
焊球缺失 ........................................................... 34
4.8.2
焊球空洞 ........................................................... 34
4.8.3
焊球连接完整性 ............................................... 34
4.8.4
封装和焊球共面度
........................................... 35
2013年1月 IPC-7095C-C
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