YesAX V3.1.2 - Software User Manual - 第128页

10 - 34 General Inspecti on Methodolo gy X-Ray Inspection for BGA device is also conducted in two processing steps: Preprocessing and Decision. The Preprocessing step prepares the image and the Decision step determines t…

General Inspection Methodology 10-33

The To Lead Align button changes the focus from the Solder Alignment dialog box to the Lead

Alignment box.

The Help button launches internal help for this dialog.

10.5 X-Ray Inspection for BGA Device

YesAX software organizes inspections into three types: Marking, Lead Bank and Solder. Each

part can have any number and combination of these three types of inspections. When applying

X-Ray inspection methodologies for BGA devices, normally there is no marking inspection. The

available inspections are: lead bank and solder inspections. A BGA352 may have six lead banks

and 352 solder inspections.

There is only one light and one view for X-Ray inspection: Side light and X-Ray View. There

are several FOV (field of view) choices for X-Ray inspection: 1”, 0.5” and 0.25” FOV.

 NOTE

0.25” FOV is not available for X3 AXI system inspections.

For each FOV there are several X-Ray power levels. Each power level has its own X-Ray tube

voltage, current and spot size settings.

To change the FOV, press the right mouse button while pointing inside the Video area.

Select Move Z Axis to launch the Move Z dialog.

10-34 General Inspection Methodology

X-Ray Inspection for BGA device is also conducted in two processing steps: Preprocessing and

Decision. The Preprocessing step prepares the image and the Decision step determines the

Pass/Fail. The two steps use various machine vision algorithms to accomplish the task.

10.5.1 Preprocessing

Since X-Ray images are gray scale images, normally there is no preprocessing step needed for

inspection. The preprocessing step for X-Ray is defaulted to NONE.

NONE - No preprocessing (default)

Red Filter - Pass the image through red color filter.

Green Filter - Pass the image through green color filter.

Blue Filter - Pass the image through blue color filter.

Binarize - Binarize the image into two gray levels, black and white.

General Inspection Methodology 10-35

10.5.2 Lead Bank Inspection

BGA Lead Bank inspection checks for bridges between BGA balls, missing balls, and ball off-

position cases. The default algorithm for BGA lead bank inspection is BGA Group. Currently

there are two algorithms for BGA lead inspection, BGA Group and Image Subtraction.

After a lead bank inspection box is created, you can display the Lead Bank pop-up menu by

clicking the right mouse button while pointing at the inspection box.

Edit Lead Params..

Launches the Lead Parameters dialog. See 10.3.1 Edit Lead

Bank Parameters.

BGA Group Parameters

Launches the Lead Blob Analysis Parameter dialog. See

10.3.2 Lead Blob Analysis Parameter.

Align..

Launches the Lead Bank Alignment dialog to allow

alignment of lead bank inspection box. See 10.3.3 Lead

Bank Alignment.

Train Solder

Trains the solder inspection within the lead bank.

Move/Resize

Moves or resizes the lead bank inspection box.

Break into Sectors

Breaks up a long lead bank into smaller sectors. See 10.3.4

Break Lead Bank into Sectors.

Delete

Deletes the inspection box.

Update

Uses the current lead bank as reference to update the

parameters of other lead banks.

Test

Tests the lead bank inspection on the current image.