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7 Vision Systems SIPLACE 80S /F/G User’s Manual 7.1 Survey of the Vision Systems of the SIPLACE 80 S/F/G Machines Ed ition 07/97 from Software Version SR.010.xx 7 - 6 Line engine er 7.1.2 Vision Systems in the SIPLACE 80…
SIPLACE 80S/F/G User’s Manual 7 Vision Systems
Edition 07/97 from Software Version SR.010.xx 7.1 Survey of the Vision Systems of the SIPLACE 80 S/F/G Machines
Line engineer 7 - 5
Fig. 7.1.3 Evaluation units for gantry 1 and gantry 2 of the SIPLACE 80S placement systems
7 Vision Systems SIPLACE 80S/F/G User’s Manual
7.1 Survey of the Vision Systems of the SIPLACE 80 S/F/G Machines Edition 07/97 from Software Version SR.010.xx
7 - 6 Line engineer
7.1.2 Vision Systems in the SIPLACE 80F Placement Machine
The single gantry system of the SIPLACE 80F machine (see Fig. 7.1.4) includes a revolver placement head
and an IC placement head. The revolver placement head is equipped with two camera systems: one for PCB
and the other for component position recognition (see Fig. 7.1.2). The camera systems (up to two) for compo-
nent position recognition for the IC placement head are attached to the machine base (see Fig. 7.1.5).
Fig. 7.1.4 Location of the revolver head and IC head on the SIPLACE 80F placement system
While the revolver placement head optically centers and mounts components up to a size of 14 mm x 18 mm,
the IC head covers the component range up to a size of 55 mm x 55 mm.
The camera system for PCB position recognition is fitted to the revolver placement head. As a standard fea-
ture it centers boards sized from a minimum of 50 mm x 50 mm up to 508 mm x 460 mm, and as an option up
to 610 mm x 460 mm. The board thickness may vary here within the range between 0.5 mm and 3 mm.
IC placement head
Revolver
head
SIPLACE 80S/F/G User’s Manual 7 Vision Systems
Edition 07/97 from Software Version SR.010.xx 7.1 Survey of the Vision Systems of the SIPLACE 80 S/F/G Machines
Line engineer 7 - 7
Fig. 7.1.5 Location of the component camera systems for the IC head
Key to Fig. 7.1.5:
➀
IC sensor system
➁
FC (flip chip) sensor system
The vision evaluation unit (ICOS-MVS system), which is accommodated in the control unit of the machine
(see Fig. 7.1.6), processes and evaluates the signals of the PCB and component camera systems of the
revolver and IC placement heads. From the setpoint deviations correction values are determined, which are in
turn used in the recalculation of the placement positions and angle of rotation of the components which are to
be mounted.
1 2