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SIPLACE 80S/F/G User’s Manual 10 SIPLACE G Edition 07/97 from S oftware Version SR.010.xx 10.8 Gluing Tips and Tricks 10 - 55 You are us ing a new adhesiv e and hav e entered th e parame- ters in the MA dat a, but the qu…

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10 SIPLACE G SIPLACE 80S/F/G User’s Manual
10.8 Gluing Tips and Tricks Edition 07/97 from Software Version SR.010.xx
10 - 54
The adhesive points
are smeared
The outside of the nozzle is dirty. Check the nozzle diameter and, if the glue
cleaning pad is approached cyclically, reduce
the number of large adhesive points.
The point volume is too large. Adjust the point volume.
You are using the wrong spacer. Compare the spacer against the correct val-
ues.
Adhesive points are
missing
The nozzle is clogged.
(See below for possible causes)
Clean the nozzle.
The spacer is too large. Fit a spacer that matches the reference value.
The spacer ran into an obstacle (clinch, raised
galvanized pad, etc.)
Change the spacer angle and enter the values
in the program under ’Gluing parameters’. The
new values will not take effect until you restart
the software.
You have used a poor quality adhesive.
This means that the adhesive becomes irregu-
lar and stringy during continuous application
- They break off early and are puckered,
or
- when the solenoid valve is manually actu-
ated, a drop of adhesive forms on the nozzle
and is then pulled back again.
Check the shelf life of the adhesive.
Follow the manufacturer’s storage instructions
on the data sheet.
Replace the glue cartridge.
The temperature of the adhesive is too low. Increase the temperature.
The PCB is contaminated (by fingerprints,
grease, dust or environmental influences, for
example).
Use clean PCBs.
Eliminate the cause of contamination during
the production sequence.
The z-axis moves jerkily. Clean the cam disc with ethyl alcohol and
notify the Service department.
The first adhesive point
is missing
The ’use by’ date of the adhesive has passed. Use a new cartridge.
The sealing ring on the cartridge seal is miss-
ing or worn.
Insert a new sealing ring and grease lightly
with Unisilkon.
The glue cleaning pad is not approached. Activate the glue cleaning pad in the machine
options.
Software error mes-
sage: ’Spacer in con-
tact with glueing point’
The adhesive point sequence has been opti-
mized with respect to speed, but not with
respect to the spacer angle.
Change the spacer angle and enter the values
in the program under ’Gluing parameters’. The
new values will not take effect until you restart
the software.
The spacer is touching
the adhesive point
The mechanically set spacer angle does not
correspond to the data in the gluing parame-
ters.
Correct the angle and enter the values in the
program under ’Gluing parameters’. The new
values will not take effect until you restart the
software.
The adhesive point diameter is not included in
the computer model.
Change the spacer angle and enter the values
in the program under ’Gluing parameters’. The
new values will not take effect until you restart
the software.
Large points lead to
incorrect measure-
ments in the adhesive
point check
The adhesive points are smeared. Clean the nozzle, carry out the adhesive point
check with adhesive point volume factor -4 (-5),
accept the proposed measurement and do not
carry out any further measurements.
Metering stage 20
causes ’mounds’ to
form on the PCBs and
the points smear on
the paper roll
The adhesive properties have changed. Reduce the volume.
Increase the size of the spacer.
Malfunction Cause Remedy
SIPLACE 80S/F/G User’s Manual 10 SIPLACE G
Edition 07/97 from Software Version SR.010.xx 10.8 Gluing Tips and Tricks
10 - 55
You are using a new
adhesive and have
entered the parame-
ters in the MA data, but
the quality is poor and
the points are smeared
See ’Smeared points’
The new adhesive has very different flow prop-
erties
Select a larger spacer than the one specified.
The diameters differ
greatly within a charac-
teristic curve
You are using the wrong spacer. Insert the correct spacer.
If the compressed air is switched over, the
metering pressure between two successive
point sizes will change.
The different metering pressure has caused
the point to be built up slightly differently. This
may cause the diameter of a larger metering
stage to be smaller than that of the previous
metering stage.
The PCB flexes when the adhesive points are
applied.
Insert the PCB support.
The adhesive characteristic curve is incorrect. Load the correct characteristic curve and
restart the machine. In the Single functions, set
the cartridge to ’full’. PLEASE NOTE: If the
cartridge is no longer full, you must insert a
new cartridge.
You have loaded a new
characteristic curve,
but the point sizes are
still incorrect
You did not set the cartridge to ’full’ after load-
ing the characteristic curve.
Insert a new, full cartridge and confirm using
the ’New cartridge’ function.
You must not confirm a ’New cartridge’ after
changing the spacer angle.
The z axis causes a
crash
The clamping rails is bent. Check the clamping rail and straighten or
replace it, if necessary.
The zero point correction for the z axis is incor-
rect.
Check the zero point correction and reset, if
necessary.
The motor or tacho is defective. Notify the Service department.
The adhesive point
positions migrate on
the PCB
The PCB is not clamped sufficiently because
the clamping rail is bent.
Check the conveyor belt and set the PCB
transport width.
The PCB has not been set down correctly. Check the conveyor belt and set the PCB
transport width.
The x/y scale is dirty. Clean the scale with alcohol.
The connection between the incremental
encoder and mini gantry motor is defective
Visually inspect the motor,
notify the Service department.
The nozzle has been
damaged
The nozzle is colliding with defects on the
PCB.
Check the PCB for defects (screws, bent
leads).
The nozzle is colliding with hard objects (the
nozzle is made of aluminum).
Check the storage conditions and handling
when the nozzle is inserted.
The clamping rail is bent. Check the clamping rail and straighten or
replace it, if necessary.
The nozzle is clogged You have stored the nozzle in alcohol / spirit. If you clean the nozzle with alcohol / spirit, sim-
ply rinse it out afterwards. Then immediately
blow the nozzle out with compressed air.
(Long-term contact with alcohol will cause the
adhesive to harden, even at room tempera-
ture).
We recommend that you use the cleaning
agent Zestron HC.
Replace any nozzles with hardened-on adhe-
sive residues.
Malfunction Cause Remedy
10 SIPLACE G SIPLACE 80S/F/G User’s Manual
10.8 Gluing Tips and Tricks Edition 07/97 from Software Version SR.010.xx
10 - 56
The nozzle has been in use for too long. Clean the nozzle as described in the mainte-
nance instructions.
Replace any nozzles with hardened-on adhe-
sive residues.
’Error in DP from the
line computer’
The programmed metering stages cannot be
used with the specified characteristic curve.
Adjust the characteristic curve and the range of
metering stages. Reprogram the metering
stages, if necessary.
The data in the placement program is incor-
rect.
Press <F1> to switch screens and read the
detailed error message.
Malfunction Cause Remedy