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19 Error Messages S IPLACE 80S/F/G User’s Manual 19.1 Error Mess ages Edition 12/96 from Software Vers ion SR.009.xx 19 - 134 1181 Z-axis, GU2: W hile raising, Bero not activate d CAUSE ● Z axis is not moving upwards (sl…

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SIPLACE 80S/F/G User’s Manual 19 Error Messages
Edition 12/96 from Software Version SR.009.xx 19.1 Error Messages
19 - 133
1174 WARNING: Fill cartridge before next PCB
CAUSE
Bero for "Empty cartridge" triggered; not enough glue left to glue the next board
REMEDY
Change cartridge and confirm
1175 Cartridge empty; PCB will not be processed
CAUSE
This was preceded by error 1174 and the cartridge was still not changed
REMEDY
Change cartridge and confirm
1176 Cleaning process must be started
CAUSE
One of the cleaning conditions has occurred. Not an error
REMEDY
The machine cleans itself automatically
1177 GU: Software error in RIO call
CAUSE
Software error
REMEDY
AUT 5 BSM 14 Development should be notified
1178 Actual temperature does not reach desired temperature
CAUSE
Glueing parameter controller did not reach the desired temperature
REMEDY
Hardware should be checked
1179 Glue cleaning pad finished
CAUSE
Glue cleaning pad finished
REMEDY
Insert new paper
1180 Z-axis, GU1: While raising, Bero not activated
CAUSE
Z axis is not moving upwards (sluggish); the bero is defective or set incorrectly
REMEDY
Check the mechanism; check the bero; check the incremental transducer.
19 Error Messages SIPLACE 80S/F/G User’s Manual
19.1 Error Messages Edition 12/96 from Software Version SR.009.xx
19 - 134
1181 Z-axis, GU2: While raising, Bero not activated
CAUSE
Z axis is not moving upwards (sluggish); the bero is defective or set incorrectly
REMEDY
Check the mechanism; check the bero; check the incremental transducer.
1182 Z-axis, GU3: While raising, Bero not activated
CAUSE
Z axis is not moving upwards (sluggish); the bero is defective or set incorrectly
REMEDY
Check the mechanism; check the bero; check the incremental transducer.
1183 Z-axis, GU1: When axis at bottom, Bero not released
CAUSE
Z axis is not moving downwards (sluggish); the bero is defective or set incorrectly
REMEDY
Check the mechanism; check the bero; check the incremental transducer.
1184 Z-axis, GU2: When axis at bottom, Bero not released
CAUSE
Z axis is not moving downwards (sluggish); the bero is defective or set incorrectly
REMEDY
Check the mechanism; check the bero; check the incremental transducer.
1185 Z-axis, GU3: When axis at bottom, Bero not released
CAUSE
Z axis is not moving downwards (sluggish); the bero is defective or set incorrectly
REMEDY
Check the mechanism; check the bero; check the incremental transducer.
1186 Pressure build-up faulty
CAUSE
The glue cartridge is missing; the compressed air supply to the dispenser unit is inadequate;
the valve (actuation) is defective
REMEDY
Insert cartridge; check the compressed air supply, hoses, valve
1187 Pressure reduction faulty
CAUSE
The venting valve (actuation) is defective
REMEDY
Check the valve and hoses
SIPLACE 80S/F/G User’s Manual 19 Error Messages
Edition 12/96 from Software Version SR.009.xx 19.1 Error Messages
19 - 135
1188 Glue spot check: error during meas. description generation
CAUSE
Target diameter of the glue spots in the VKL file are outside the permitted range (0 < or < 3 mm)
Camera data (MA data) conversion factor pixels => µm erroneous
REMEDY
Check data
1189 Glue spot check: error during measurement description loading
CAUSE
Transmission error with the MVS vision system; possibly incorrect Eprom version
REMEDY
Check Eprom version
1190 Glue spot check: error during visualization of results
CAUSE
Transmission error with MVS vision system
REMEDY
Check vision system
1191 Glue spot check: measurements start error
CAUSE
Transmission error with MVS vision system
REMEDY
Check vision system
1192 Glue spot check: error in measurement results
CAUSE
Possibly incorrect Eprom version; otherwise software error
REMEDY
Check Eprom version
1193 Glue spots too large for calculating volume adaption
CAUSE
The size of glue spots is outside the control range for volume adaption (-5....+5); incorrect gluing sta-
tion configuration
REMEDY
Check process parameters: nozzle diameter, spacer, temperature;
check gluing station configuration