pressurecureoven - 第2页
System Overview Pressure Cure Oven (PCO) or Autoclave is used to minimize voiding and increase adhesion strength for bonding processes t ypically used in die attach and underfill applications PCO pressurizes air into…
Pressure Cure Oven (PCO)
System Overview
Pressure Cure Oven (PCO) or Autoclave is used to
minimize voiding and increase adhesion strength for
bonding processes typically used in die attach and
underfill applications
PCO pressurizes air into a rigid vessel and heats & cools
with forced convection
¬ Heaters, heat exchangers and blowers are internal to
the pressure vessel
When the curing process is complete, the pressure oven
automatically relieves its pressure to 1atm and cools
Pressure Cure Applications
Underfill
Curing
Die Attach
Curing
Wafer
Lamination
Film & Tape
Bonding
PCO