pressurecureoven - 第4页

Process Specific ation • Process t ime: Generally 120 min or User’s spec • Operating temp: 60 o C ~ 200 o C • Maximum temp: 220 o C • Operating pressure: 1 bar – 10 bar • Capacity: 24 Magaz ines (typical) • Cooling metho…

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Pressure Cure Applications
Underfill
Curing
Die Attach
Curing
Wafer
Lamination
Film & Tape
Bonding
PCO
Process Specification
• Process time: Generally 120 min or User’s spec
• Operating temp: 60
o
C ~ 200
o
C
• Maximum temp: 220
o
C
• Operating pressure: 1 bar – 10 bar
• Capacity: 24 Magazines (typical)
• Cooling method: PCW (17
o
C - 23
o
C)
• Cooling water pressure: 25 – 40 psi
200℃
60℃
0
Temp.
30min 90min 120min Time
10 bar
0
20min 90min 110min Time
Cooling
process
Curing
process
Rising
process
Pressure.
Representative Pressure/Temp Profiles (User Configurable)
PCO System Dimensions
1700mm
1700mm
2200mm