德森印刷机说明书之使用手册2 - 第46页
德森精密机械设备有限公司 Shenzhen Shenzhen Shenzhen Shenzhen DeSen DeSen DeSen DeSen P re cision P re cision P re cision P re cision Machine Machine Machine Machine Co., Co., Co., Co., Ltd Ltd Ltd Ltd . . . . - 45 - 附 1 1 1 1 ： 推 荐使…
德森精密机械设备有限公司
Shenzhen
Shenzhen
Shenzhen
Shenzhen
DeSen
DeSen
DeSen
DeSen
Precision
Precision
Precision
Precision
Machine
Machine
Machine
Machine
Co.,
Co.,
Co.,
Co.,
Ltd
Ltd
Ltd
Ltd
.
.
.
.
- 44 -
第五章 附 录 Chapter
Chapter
Chapter
Chapter
5
5
5
5
Appendix
Appendix
Appendix
Appendix
附 1
推荐使用的铝合金网框 Appendix 1 the recommended aluminum alloy
mesh frame
附 2
印刷缺陷及原因分析表 Appendix 2 printing defects and causes
附 3
锡膏厚度不均的原因综合分析 Appendix 3 analysis on the unevenness
of tin solder
德森精密机械设备有限公司
Shenzhen
Shenzhen
Shenzhen
Shenzhen
DeSen
DeSen
DeSen
DeSen
Precision
Precision
Precision
Precision
Machine
Machine
Machine
Machine
Co.,
Co.,
Co.,
Co.,
Ltd
Ltd
Ltd
Ltd
.
.
.
.
- 45 -
附 1
1
1
1
： 推荐使用的网框尺寸 Appendix
Appendix
Appendix
Appendix
1
1
1
1
the
the
the
the
recommended
recommended
recommended
recommended
size
size
size
size
of
of
of
of
scree
scree
scree
scree
n
n
n
n
frame
frame
frame
frame
网板开口以网框的中心对中分布
The opening of mesh plate is laid out by aimi ng the center of mesh frame at the middle position
德森精密机械设备有限公司
Shenzhen
Shenzhen
Shenzhen
Shenzhen
DeSen
DeSen
DeSen
DeSen
Precision
Precision
Precision
Precision
Machine
Machine
Machine
Machine
Co.,
Co.,
Co.,
Co.,
Ltd
Ltd
Ltd
Ltd
.
.
.
.
- 46 -
附 2
2
2
2
：印刷缺陷及原因分析表
Appendix
Appendix
Appendix
Appendix
2:
2:
2:
2:
Table
Table
Table
Table
of
of
of
of
printing
printing
printing
printing
defects
defects
defects
defects
and
and
and
and
causes
causes
causes
causes
序号
series
No .
印 刷 缺 陷
Printing
Defects
产 生 原 因 Causes
防 止 或 解 决 办 法
Prevention and Solutions
1
印刷不完整
Printing is not
complete
1)
模板孔隙堵塞或模板与 PCB 间
距太大； template void plugged or
space between template and PCB
2)
范本上焊膏涂布不均； solder
paste is not coated even on sample
3)
焊膏中不规则的大金属粉粒比
例太大， 堵塞、 孔隙。
There is a big
ratio of irregular big metal particles
in solder paste, they block mesh
holes.
1)
清洗窗孔和范本底部；
clean the window and the bottom of
sample;
2)
选择粘度合适的焊膏，并使焊膏
印刷能有效，覆盖整个印刷区域
；
choose solder paste of proper
viscosity to ensure the printing
effects by solder paste and cover
the whole printing area;
3)
选择金属粉末颗粒尺寸与窗
口尺寸相对应的焊膏。 Choose
the solder paste whose size of metal
powder particle is corresponding to
the window.
2
坍塌、桥连
Collapse and
Bridging
1)
刮刀压力太大； too big pressur e
on squeegee;
2)
范本底面残留焊膏太多；
Too
much solder paste is left as
residual on the bottom of sample
3)
焊膏粘度太低或金属含量太少，
以致无法维持焊膏的站立。 Th e
viscosity or metal content of
solder paste is too low to maintain
the standing of solder paste.
1)
调整压力； adjust the pressure ;
2)
重新固定印制板； re-fix the
printing board;
3)
选择合适粘度的焊膏；印刷 时
保持适宜的环境温度。 Choose
the solder paste with proper
viscosity; and keep a suitable
environmental temperature on
printing.
3
厚度不均匀
Unevenness
1)
范本与 PCB 未能很好的平行 吻
合；
The model is not parallel to PC B;
2)
PCB 焊盘镀层不平、 厚度不均
；
1)
调整模板与印制板的相对位
置； adjust the relative place of
template to printing board;