00194614-08 Trainingsdoku. SG X-Serie_X4i SW70x (AL2)_EN - 第303页
Collect, Pick and Place Head (CPP) Settings on the CPP Head Board Descriptions 303 Student Guide SIPLACE X-Serie and X4I SW70x (AL2) Base Ada pter for CPx on SX 4 Machines with HCU 8.5.1.1 Base Adapter for CPx on SX4 Mac…
Collect, Pick and Place Head (CPP)
Standard Mode - Placement: Z Axis Up Settings on the CPP Head
Student Guide SIPLACE X-Serie and X4I SW70x (AL2) 302
Standard Mode - Placement: Z Axis U p
8.4.14 Standard Mode - Placement: Z Axis Up
Optical Nozzle Query
8.4.15 Optical Nozzle Query
▪ After the reference run, the gantries move into the wait position and performs the first nozzle
scanning. During the production, a nozzle scanning run is performed after 350 head cycles (can be
set by SIPLACE service if required) and after the completion of the board currently processed. This
ensures that the nozzle quality is continually checked during the production process:
– All nozzles listed in the scan parameters of the station database will be measured by the
component camera.
– If there is any deviation from the defined size, shape or brightness, the machine will show the
message: Nozzle worn down or contaminated.
▪ Tiny nozzles may touch the solder paste or the glue because of component shift and the minimum
component height.
▪ The number of components per segment (number of head cycles), after the next nozzle query has
been performed, should be adjusted to the customer's process requirements. This check is always
performed after completing PCB processing.
Settings on t he CPP Head
8.5 Settings on the CPP Head
Board D escriptio ns
8.5.1 Board Descriptions
See also
7.5.1.1 Head Adapter for C&P20A on X Machines with A364 [ ➙ 248]
8.5.1.1 Base Adapter for CPx on SX4 Machines with HCU [ ➙ 303]
8.5.1.2 Head Interface on SX4 Machines with HCU [ ➙ 304]
Detailed component placement procedure: Z Axis Up
LB down switches:
▪...
▪ Pickup/placement position; air blast threshold "place
component" reached? Yes
▪ Start signal for upwards movement
Z axis starts:
▪ Z axis positioning upwards
Head firmware:
▪ Digital pressure control valve: switches air blast OFF
▪ Reset "light barrier down" signal
Axis controller:
▪ Z axis measurement value for nozzle "empty" and
▪ Z axis in safe area =
▪ Enable X, Y gantry axes.
Vacuum query:
▪ Vacuum threshold for holding circuit reached? Yes
▪ Star axis starts.
NOTICE
The nozzle quality check can be configured in four different levels, via the station interface.
Collect, Pick and Place Head (CPP)
Settings on the CPP Head Board Descriptions
303 Student Guide SIPLACE X-Serie and X4I SW70x (AL2)
Base Ada pter for CPx on SX 4 Machines with HCU
8.5.1.1 Base Adapter for CPx on SX4 Machines with HCU
Base adapter for CPx [03045647-xx] on SX4 machines with HCU
Legend
Meaning of LEDs H1 - H9
1 X3 Connection to the head interface board
C700
5 Test connector for FPGA
2 X4, X14, X15 – connector for HCU 6 X1-X2 flat ribbon connection for CPP or
C&P20
3 Switch S1 intermediate circuit voltage
Z axis
40V C&P20 (switch top)
150V CPP(switch bottom)
7 X6 Programming connector for FPGA
4 LED H3- H9 8 X7 Test connector HCU
H1 OK Status display for the component sensor
H2 RS232 Shines when the programming connector for the HCU1 is connected (not
designed for Service)
H3 1V5 Voltage monitor 1.5 V, shines red in event of errors
H4 3V3 Voltage monitor 3.3 V, shines red in event of errors
H5 5V Voltage monitor 5 V, shines red in event of errors
H6 15V Voltage monitor 15 V, shines red in event of errors
Collect, Pick and Place Head (CPP)
Board Descriptions Settings on the CPP Head
Student Guide SIPLACE X-Serie and X4I SW70x (AL2) 304
The voltage monitors trigger as soon as the target voltage is exceeded or undershot by 5%.
Head Int erface o n SX4 Machines with HCU
8.5.1.2 Head Interface on SX4 Machines with HCU
The head interface on the SIPLACE SX4 is available in two versions due to the mirrored gantries.
▪ Head interface C700X-L [03055067-xx) for gantry 1 and 3
▪ Head interface C700X-R [03055069-xx] for gantry 2 and 4
Both versions have the same functions, connectors and switches.
The head interface is supplied with a voltage of 40 V via the trailing cable. Further voltages for the
electronics and other subsystems are supplied via a DC/CD converter.
Further voltages and signals are:
▪ Track signals X axis
▪ Temperature sensor
▪ FDB bus / CAN bus
▪ Voltages for the star axis, Z axis and X axis are provided by the power supply and distributed to the
head interface.
H7 DP Voltage monitor DP (currently without function)
H8 24V Voltage monitor 24 V, shines red in event of errors
H9 LOC Voltage monitor local - shines red as soon as one of the voltage monitors
triggers (not for 24 V)