00900160-01_UM_ASM-ProcessLensDualLane_en - 第53页
3 Machine description 3.2 Technical data Instruction Guide ASM ProcessLens Dual-lane 06/2018 53 3.2.5 Conveyor specifications Flexible dual conveyor Dual conveyor in "single conveyor" (optional) mode Minimum PC…
3 Machine description
3.2 Technical data
52 Instruction Guide ASM ProcessLens Dual-lane 06/2018
3.2.3 Center of Gravity
Fig.31: Center of gravity of the ASM ProcessLens Dual-lane solder paste inspection machine
1 550 mm 2 610 mm
3 730 mm
3.2.4 Electrical Ratings
Supply voltage Fuses
Main power supply 1/N/PE
Current rating: 110 V
1)
- 9.1 A, 240 V - 4.2 A, 50/60Hz
2 x 15 A
Power consumption 1 kW
Power supply 100 ~ 240 VAC, Single Phase 50/60 Hz
Short circuit rating of
machine (SCCR)
2)
10 kA
Power connector MENNEKES: 32 A 230 V 2 P+E STRAIGHT
1)
110 V~ as an option
2)
With the original mains connection cable. The marked short circuit rating (SCCR) relates to the beginning of
the original mains cable. In the case of customer modifications, the factory-set length of the mains cable to
the machine may not be shortened nor the factory-set conductor cross-section increased, as this would
have a negative impact on the short circuit rating (SCCR).
3 Machine description
3.2 Technical data
Instruction Guide ASM ProcessLens Dual-lane 06/2018 53
3.2.5 Conveyor specifications
Flexible dual conveyor Dual conveyor in "single
conveyor" (optional) mode
Minimum PCB size L x W 50 mm x 45 mm 50 mm x 45 mm
Maximum PCB size L x W 375 mm x 260 mm 375 mm x 460 mm
PCB thickness range 0.3 mm to 4.5 mm
Maximum PCB weight Max. 3.0 kg
Underside PCB clearance 25 mm
PCB conveyor height
●
Option
●
Standard
●
Option SMEMA
900 mm
930 mm
950 mm
Stationary conveyor side Outside
Right / Right
Left / Left
3.2.6 Inspection capabilities
Pixel size (camera resolution) 15 μm x 15 μm
Inspection speed Up to 30 cm
2
/s
Height resolution 0.37 μm
Height accuracy on calibration target <= 2 μm
X/Y gantry accuracy < ±25 µm at 6 σ
3.2.7 Solder paste inspection capabilities
Measurement Shadow-free
Paste measurement functions Volume, area, height, X-and Y-offset, shape,
bridging, coplanarity
Maximum paste height 1000 μm
Minimum paste size 90 μm x 130 μm
Minimum paste pitch 75 μm
Height repeatability on solder paste <= 1 μm at ± 3 σ
Volume repeatability on solder paste <= 3 % at ± 3 σ
Area repeatability on solder paste <= 3 % at ± 3 σ
Gage Repeatability and Reproducibility (GRR) < 10 %
3.2.8 Program generation specifications
Program generation < 10 min.
Offline programming available
Supported Gerber formats RS-274X
3 Machine description
3.2 Technical data
54 Instruction Guide ASM ProcessLens Dual-lane 06/2018