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User Manual SIPLACE HS-50 5 Station extensions Software Version SR.50x.xx 01/2006 US Edition 5.5 Ceramic substrate centering 161 Fig. 5.5 - 1 Ceramic substrate c entering structure (1) Mechani cal c eramic s ubstrate cen…
5 Station extensions User Manual SIPLACE HS-50
5.5 Ceramic substrate centering Software Version SR.50x.xx 01/2006 US Edition
160
5.5 Ceramic substrate centering
5.5.1 General
Ceramic substrates can be mechanically and optically centered.
The position of the fiducials on the ceramic substrates can be determined
– with the integral sub-gantry PCB camera supplied as standard, with normal or optional oblique
lighting, or
– with the optional multicolor PCB camera.
5.5.2 Possible centering types
The following centering types for ceramic substrates can be entered in the transport type machine
data (REAL.MA).
5.5.3 Mechanical centering
5.5.3.1 General
Mechanical substrate centering is used to lock ceramic substrates firmly in position in the X and
Y directions in such a way that the material is not damaged. Ceramic substrates can also be
placed right up to the edge.
5.5.3.2 Assembling and dismantling the ceramic substrate centering unit
PLEASE NOTE
The ceramic substrate centering unit must only be assembled and dismantled by Service
engineers. 5
Transport type Centering
4 Mechanical substrate centering with normal lighting
5 Oblique lighting only with Y axis PCB clamping unit
6 Mechanical substrate centering with oblique lighting
User Manual SIPLACE HS-50 5 Station extensions
Software Version SR.50x.xx 01/2006 US Edition 5.5 Ceramic substrate centering
161
Fig. 5.5 - 1 Ceramic substrate centering structure
(1) Mechanical ceramic substrate centering
(2) Centering slots
(3) Ball bearing
(4) Stop
(5) Compressed air connection
(6) Proximity switch connecting cable
(7) Lifting table
5.5.3.3 Maintenance
– Clean and grease the ball bearings in the X-axis centering unit.
– If necessary, check that the pneumatic driving mechanism is running smoothly.
– The conveyor should be maintained as described in the maintenance instructions.
5 Station extensions User Manual SIPLACE HS-50
5.5 Ceramic substrate centering Software Version SR.50x.xx 01/2006 US Edition
162
5.5.4 Technical data
Substrate format 50 mm x 50 mm to 100 mm x 180 mm
Substrate thickness 0.5 mm to 1.5 mm
Substrate model unscribed (without problems)
scribed (requires testing)
Support on the conveyor 2.5 mm
Optical centering with PCB vision module:
Type of illumination for light pastes:
Type of illumination for dark pastes and close spacing to
adjacent structures (> 1 mm)
with multi-color camera
PCB vision module (standard)
Oblique lighting (option)
4 illumination levels to be selected
Fiducial criteria See PCB vision module position recog-
nition
PCB underside clearance 12 mm
Compressed air connection 5.5 bar