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User Manual SIPLAC E HS-50 1 Introduction Software Vers ion SR.50x.xx 01/2006 US Edition 1.8 Description of the m achine 17 The con cept behind t he autom atic pla cement s ystem 1 – wi th its st ation ary feeder modules…
1 Introduction User Manual SIPLACE HS-50
1.8 Description of the machine Software Version SR.50x.xx 01/2006 US Edition
16
1.8 Description of the machine
1.8.1 Functional description
The automatic placement system is a high-performance placement system with four gantry axis
systems. A PCB vision module and a star-shaped 12-segment collect&place head are mounted
on each gantry. Collect&place heads equipped with a component vision module pick up the com-
ponents from stationary feeder modules and insert them into the PCB clamped in the PCB con-
veyor. 1
1
Fig. 1.8 - 1 Functional description of the placement system
(1) 12-segment collect&place head/DLM1 with component vision module
(2) Gantry axis system with PCB vision module
(3) Stationary component feeder
(4) Clamped printed circuit board (PCB)
(5) PCB conveyor (dual conveyor option)
1
User Manual SIPLACE HS-50 1 Introduction
Software Version SR.50x.xx 01/2006 US Edition 1.8 Description of the machine
17
The concept behind the automatic placement system 1
– with its stationary feeder modules,
– PCBs that do not move during placement
– and positionable placement heads
has a number of significant benefits: 1
– For example, the flexible 12-segment collect&place heads combined with automatic nozzle
changers enable the nozzle configuration to be changed temporarily and automatically
adapted to receive different component sizes. You can also optimize the traversing paths and
the placement sequence.
– With stationary feeder modules, even the tiniest components are picked up reliably.
– The components cannot slip on the PCB during placement (as is often the case with moving
PCBs) since the PCB does not move.
– Sophisticated optical centering systems (vision modules) for components and PCBs also en-
sure high component positioning accuracy.
– Components can be topped up and tapes can be spliced without stopping the machine.
– Prepared component tables enable the placement system to be retooled without long stop-
pages.
1 Introduction User Manual SIPLACE HS-50
1.8 Description of the machine Software Version SR.50x.xx 01/2006 US Edition
18
1.8.2 Technical data - machine overview
1
* The SIPLACE HS-50 can be equipped to place 0201 components.
(Please contact the factory for details).
Procedure Collect &Place
Range of components *
12-segment collect&place head from 0402 to PLCC44, SO32, DRAM
Max. placement rate for: 50,000 components/h
12-segment collect&place head
Angular accuracy
Placement accuracy
± 0.70°/ 4 σ
90µm / 4 σ
PCB format
Single conveyor system (length x width)
Dual conveyor system (length x width)
50 mm x 50 mm to 368 mm x 460 mm
(2" x 2" to 14.5" x 18")
50 mm x 50 mm to 368 mm x 216 mm
(2" x 2" to 14.5" x 8,5")
Feeder capacity 48 locations for feeders
Component supply
Types of feeder
Component changeover table (see chapter 4
)
Component tapes, stick magazines, bulk-cases
(see chapter 4
)
Operating system Microsoft Windows NT / RMOS
Connection Inline or stand alone
Space required 4 m² / module