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User Manual SIPLACE HS-50 5 Station extensions Software Version SR.50x.xx 01/2006 US Edition 5.9 Vacuum tooling 173 5.9 V acuum tooling V acuu m tool ing is an other mod ule that i s used to inc rease the place ment acc …

5 Station extensions User Manual SIPLACE HS-50

5.8 Fine calibration Software Version SR.50x.xx 01/2006 US Edition

172

The following parts may be ordered if required:

– Magazine with 48 glass components

– Magazine with 196 ceramic components

5.8.4 Functional description

First select the placement program for fine calibration by selecting the ‘Cluster for fine calibration’

option from the ‘Options’ pull-down menu. Then process the mapping plate with the glass

components from a magazine on the manual tray.

After placement, start the SITEST program and run the ‘Fine calibration’ measuring program.

The placement head (Collect&Place head or Pick&Place head) will measure the current

placement positions of the glass and/or ceramic components and compare these positions with

the circular fiducials on the mapping plate.

The 48 glass components are used to calculate the offset values in the X and Y directions and the

angular deviation.

The 196 ceramic components are used to verify and confirm the measured offset values. Ceramic

component cannot be used for angle correction.

The offset values are used to determine the corrected values, which are then entered in the

machine’s machine data.

User Manual SIPLACE HS-50 5 Station extensions

Software Version SR.50x.xx 01/2006 US Edition 5.9 Vacuum tooling

173

5.9 Vacuum tooling

Vacuum tooling is another module that is used to increase the placement accuracy for concave

PCBs. The vacuum surface of this device picks up concave PCBs during processing and aligns

them so they are flat. 5

The vacuum tooling module can be used on both single and dual conveyors, and is fitted to the

lifting tables. 5

5.9.1 Description of the functions

The PCB is fed to the processing belt, where it is stopped. The lifting table moves up and the vac-

uum circuit for the vacuum tooling device is opened. The PCB is then held in place by the vacuum

tooling device, which is pressed with a spring action against the PCB by the lifting table. This

causes the suction cups of the tooling device to press against the PCB and hold it firmly in posi-

tion. 5

The vacuum channels are vented after placement. The lifting table is lowered, the PCB is re-

leased, and can then be moved on. 5

5 Station extensions User Manual SIPLACE HS-50

5.9 Vacuum tooling Software Version SR.50x.xx 01/2006 US Edition

174