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Test Research, Inc. TR7500 SIII Series User G uide – Soft ware i 目錄 關於這本手冊 __________________________________________________ 1 1 簡介 ______________________________________________________ 2 1.1 關於 TR7500 SIII 系列 ........…

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Test Research, Inc.
TR7500 SIII Series User Guide Software i
目錄
關於這本手冊 __________________________________________________ 1
1 簡介 ______________________________________________________ 2
1.1 關於 TR7500 SIII 系列 .................................................................................... 2
1.2 TRAOI 檔案格式 ............................................................................................. 2
1.3 選配裝置 ......................................................................................................... 2
2 基本程式製作 _______________________________________________ 5
2.1 開啟 TRAOI 主程式......................................................................................... 5
2.2 程式製作流程圖 .............................................................................................. 8
2.3 載入 CAD ................................................................................................... 9
2.4 掃描全圖 ....................................................................................................... 16
2.5 設定參考座標點 ............................................................................................ 17
2.6 產生多板資訊................................................................................................ 21
2.7 設定板子尺寸................................................................................................ 25
2.8 設定對位標記................................................................................................ 27
3 編輯元件資料庫 ____________________________________________ 30
3.1 資料庫編輯介面 ............................................................................................ 30
3.2 製作元件資料庫 ............................................................................................ 31
3.3 檢測的燈光 ................................................................................................... 43
3.4 代料影像影像處理方式 ................................................................................. 45
3.5 檢測框的比對方式 ........................................................................................ 52
3.6 代料顯示編輯區 ............................................................................................ 53
3.7 檢測框原理與參數說明 ................................................................................. 58
3.7.1 錫橋檢測(Brigde) .......................................................................58
3.7.2 平整檢測(Caliper) ......................................................................59
3.7.3 本體檢測(Chip) ..........................................................................61
3.7.4 圓形檢測(Circle) ........................................................................66
3.7.5 色碼檢測(Color Bar) ..................................................................67
3.7.6 逐點匹配(CorMatch) ..................................................................69
3.7.7 邊數計算(Edge) .........................................................................70
3.7.8 浮腳檢測(LiftLead) ....................................................................71
3.7.9 引腳檢測(Lead) .........................................................................72
Test Research, Inc.
ii TR7500 SIII Series User Guide Software
3.7.10 字元辨別(OCR) .........................................................................77
3.7.11 字元驗證(OCV) .........................................................................82
3.7.12 焊盤定位(Pad) ...........................................................................84
3.7.13 焊盤量測(PadMeasure) .............................................................86
3.7.14 特徵匹配(PatMatch) ..................................................................87
3.7.15 極性檢測(PolarPair) ...................................................................88
3.7.16 顏色檢測(Void) ..........................................................................90
3.7.17 輪廓檢測(Contour) ....................................................................95
3.7.18 高度量測(Laser3D) ....................................................................96
3.8 常見元件所需的檢測框 ................................................................................. 99
3.8.1 晶片(Chip) ....................................................................................99
3.8.2 排阻(Array) ................................................................................. 100
3.8.3 三角晶體(SOT) ........................................................................... 101
3.8.4 二極體、鉭質電容 ....................................................................... 102
3.8.5 三極管(TO) ................................................................................. 103
3.8.6 積體電路(IC) ............................................................................... 104
3.8.7 四方平面無引腳封裝(QFN) ......................................................... 105
3.8.8 球閘陣列封裝(BGA) .................................................................... 106
3.8.9 鋁質電容(CAE) ........................................................................... 107
4 開始檢測 _________________________________________________ 108
4.1 生產模式視窗...............................................................................................108
4.2 檢測結果視窗...............................................................................................109
5 使用介面項目說明 _________________________________________ 111
5.1 TRI 按鈕與快捷工具 .................................................................................111
5.2 狀態視窗與程式製作流程頁籤 ......................................................................113
5.3 工具列與相關頁籤 .......................................................................................114
5.3.1 開始 ............................................................................................ 114
5.3.2 系統 ............................................................................................ 122
5.3.3 周邊設備 ..................................................................................... 130
5.3.4 工具 ............................................................................................ 131
5.3.5 掃圖 ............................................................................................ 140
5.3.6 設定 ............................................................................................ 140
5.3.7 對位 ............................................................................................ 141
5.3.8 新增 ............................................................................................ 144
5.3.9 編輯(大圖模式)............................................................................ 159
5.3.10 編輯(原圖模式) 可按 F4 顯示熱鍵 ............................................. 164
5.3.11 編輯資料庫 ................................................................................. 172
5.3.12 結果(僅顯示在生產模) ............................................................. 177
5.4 框屬性 .........................................................................................................178
5.5 模組化資料庫...............................................................................................179