AQ-2 spec book LR - 第38页
Placement output Co mponent placement 0 .68 sec./ comp or 5300 U PH uBGA, CSP , F lip Chip 1.02 sec./ comp or 3530 UPH IC placement 1.07 sec./ comp or 3350 UPH QFP placement 1.07 sec./ comp or 3350 UPH Odds & connect…
Placement accuracy & reliability
Placement process capacibility Cpk >1.33
Accuracy X,Y 25 µm @ 4 Sigma
Placement reliability < 3 ppm
Component pick performance > 99.9%
Machine stops < 500 ppm
Technical uptime > 99.5%
Average lifetime nozzle 2 million components
Average lifetime placement head 25 million components
4.0 Technical
specifications
4.1 Placement
accuracy &
reliability
Table 25
4.2 Flexibility
Table 26
Technical specifications
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Flexibility
Feeder set-up change over < 3 min.
Exchange nozzle Manual < 30 sec.
Automatic via toolbit exchange < 1.5 sec.
Average time for generation placement programs
(can be done off-line) < 30 min.
Reconfiguring the system Toolbit exchange unit < 5 min.
Components vision unit < 5 min.
Amount of feeder positions max. 48 tape feeder
positions or max. 188
JEDEC trays
Note: Accuracy testing with glass plate, using the component vision (CV SFOV) and a CSP
of 6mm square (n=30) with process specification limit of 25 µm; all values are X, Y and
combined.
Placement output
Component placement 0.68 sec./comp or 5300 UPH
uBGA, CSP, Flip Chip 1.02 sec./comp or 3530 UPH
IC placement 1.07 sec./comp or 3350 UPH
QFP placement 1.07 sec./comp or 3350 UPH
Odds & connectors 1.07 sec./comp or 3350 UPH
Note: AQ-2 output is calculated at best conditions. This excludes board transfer, board
alignment and badmark sense times.
Circuit boards
Board size (max) (L x W) 508 x 460 mm
Board size (min) (L x W) 50 x 50 mm
Board thickness 0.4 - 7 mm for PCB transport
0.4 - 11 mm for Auer boat transport
Pre mounted components Top side: < 25 mm
Bottom side: < 45 mm
Typical board exchange time < 1.9 sec transport;
< 1.5 sec alignment (3 fiducials)
Tolerances L/W ±0.5mm
Maximum L/W-ratio 1/3
Flatness Topside: bow max 0.6% of diagonal to max 1 mm,
bottom side: sag max 5 mm
Mass < 3 kg
Clearance 3mm free of SMD’s at two sides parallel at
direction of transportation for PCB transport
5 mm free of SMD’s at two sides parallel at
direction of transportation for Auer boat transport
4.3 Placement
output
Table 27
4.4 Circuit
boards
Table 28
Technical specifications
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Standards
98/37/EC CE Machine directive
89/336/EEC CE EMC directive
73/23/EEC CE Low voltage directive
SEMI S2 Safety standard
SEMI S8 Ergonomics standard
SEMI E95 Human Interfaces standard
IPC 9850 Accuracy & speed testing standard
Cleanroom class 1000 (1k)
CAMX / XML interface
SECS / GEM interface (if software option is installed)
SMEMA compliant
4.5 Standards
Table 29
4.6 Components
Table 30
Technical specifications
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Note: maximum component height without pre-mounted components
Components
SMD components 0201 up to QFP 45mm
Fine pitch components up to QFP 45mm (pitch > 0.3mm)
Odd components < 66 x 23mm (pitch > 0.3mm)
< 165 x 45mm
Grid arrays (BGA, MCM, etc.) up to 45mm (pitch > 0.5mm)
CSPs, uBGA, Flip Chips > 0.16mm pitch, > 0.08mm ball size,
Maximum number of balls: 3500
Component height up to 50mm