Specification SIPLACE CA-Series2011版 - 第12页

12 Line Concept Description Flexibility, modularity, com- pact dimension s and high power density ar e the hall- marks of the new SIPLACE concept. It allows a pr oduc- tion line to be individually configured from identic…

Machine Description

Technical Data - SWS

Technical data Flip Chip Die Attach

X/Y accuracy

a) Calculated with glass die on glass plate - SIPLACE MAC test

± 10 µm at 3 ± 10 µm at 3

Placement performance (IPC)

b) Calculated with the SIPLACE CP20-CA head

9,000 dies/h

(without flux dipping)

6,000 dies / h

6,000 dies/h

(with flux dipping)

Die sizes

c) Calculated with the SIPLACE CP20 and CP12 head. Alternative SIPLACE placement heads available for

greater component spectrum.

0.8 mm to 18.7 mm 0.8 mm to 18.7 mm

Minimum die thickness (silicium) 50 µm 50 µm

Minimum bump size 50 µm n/a

Minimum bump grid 100 µm n/a

SIPLACE Wafer System SWS Horizontal system, automatic wafer change,

MCM

SWS wafer size 4“ to 12“

Wafer frame 12“/8“

Wafer frame area 0 mm to 8 mm

Die Ejection System Programmable ejection speed

Linear Dipping Unit LDU Individually programmable speed

Flux viscosity 3,000 to 100,000 cPs

Accuracy of flux height ± 5 µm

Programmable set-down force 1.0 N to 5.0N (depends on head)

Substrate types FR4, ceramic, flex, boats, 8"/12" wafer etc.

Substrate thickness 0.3 mm to 4.5 mm

Substrate size 50 mm x 50 mm to 508 mm x 610 mm

Line Concept

Description

Flexibility, modularity, com-

pact dimensions and high

power density are the hall-

marks of the new SIPLACE

concept. It allows a produc-

tion line to be individually

configured from identical and

different modules. If the pro-

duction requirements

change, the individual place-

ment machines are so com-

pact that they can be recom-

bined quickly and easily.

Operated together with the

SIPLACE X series, the

SIPLACE CA machine al-

lows you to individually con-

figure your production line

with both identical and differ-

ing modules. If the produc-

tion requirements change,

the individual placement ma-

chines are so compact and

can be combined with such

flexibility that they can be re-

combined quickly and easily.

The SIPLACE CA family has

the optimum placement sys-

tem for each individual per-

formance requirement.

System SIPLACE Placement lines

Placement

module

SIPLACE CA4/CA3, SIPLACE X series,

SIPLACE SX1/SX2,SX4

Peripheral

modules

Input/output stations, screen printer, sol-

dering furnace, inspection places etc.

available from SIPLACE

PCB conveyor Single and dual conveyor with auto-

matic width adjustment unit;

Dual conveyor in single conveyor mode

"Wide board" mode with "long board"

option and a combination of these for

both PCB conveyors. The maximum

PCB width is determined by the module

with the smallest PCB conveyor width.

Space required 6.7 m² per CA4 module

Placement Heads

Placement Head Configuration

Description

SIPLACE CA machines are

characterized by their excel-

lent flexibility in the produc-

tion process. This flexibility is

partly due to the large selec-

tion of placement head con-

figurations. Different

placement head variants can

be configured to suit individ-

ual production requirements.

The illustrations show the

placement head variants for

the SIPLACE CA3 and CA4

machines.

For a list of the available

placement head configura-

tions, refer to section

„Machine Performance“ from

page 10.

C&P12CA

C&P6CA

C&P20CA/C&P12CA/

C&P6CA/TH

C&P20CA/C&P12CA/

C&P6CA/TH

C&P20CA/C&P12CA/

C&P6/TH

C&P20CA/

C&P12CA/

C&P6CA/TH

C&P20CA

Placement

area 2

SIPLACE CA4

Placement

area 1

Placement

area 2

Placement

area 1

SIPLACE CA3

C&P12CA

C&P20CA/C&P12CA/

C&P6CA/TH

C&P20CA/C&P12CA/

C&P6CA/TH

C&P20CA/C&P12CA/

C&P6CA/TH

C&P6CA

C&P20CA