Specification SIPLACE CA-Series2011版 - 第21页

21 Placement heads TwinHead for High-Precision IC Placement Technical Data for the TwinHead Optical centering with digital Fine pitch camera (component camera type 33) Flip chip camera (option) (component camera type 25)…

Placement heads

TwinHead for High-Precision IC Placement

Description

This sophisticated placement

head consists of two place-

ment heads of the same type

coupled together -(twin

head). Both heads work

using the Pick&Place prin-

ciple. The TwinHead is suit-

able for processing

particularly difficult or large

components. Two compo-

nents are picked up by the

placement head, optically

centered on the way to the

placement position and

rotated into the necessary

placement angle. They are

then set down gently and

accurately on the board.

In addition to the new noz-

zles recently developed for

the Twin Head, the place-

ment head can also use the

nozzles for the Pick&Place

head - used on the F5 HM.

Collect& Place head nozzles

can also be used.

Checking and self-learning

functions

The TwinHead's reliability

can be further increased with

various checking and self-

learning functions.

• For example, vacuum

checks at the nozzles indi-

cate whether the compo-

nent was picked up or set

down correctly.

• High-resolution, digital

component vision camer-

as such as the fine-pitch

and flip-chip vision camer-

as (optional) identify the

smallest deviations in the

component position. The

digital vision system cor-

rects such deviations, thus

guaranteeing a correct

placement position. The

digital component camer-

as are permanently fixed

to the machine frame.

• The component package

form is also checked, and

the component is not

placed if the geometric

data thus determined dif-

fers from the programmed

data.

• A force sensor measures

and monitors the specified

component placement

forces.

Z axis

DP axis

How the TwinHead works

Placement heads

TwinHead for High-Precision IC Placement

Technical Data for the TwinHead

Optical centering with digital Fine pitch camera

(component camera type 33)

Flip chip camera (option)

(component camera type 25)

Component range

0402 to SO, PLCC, QFP, BGA, special

component, bare die, flip chip

0201 to SO, PLCC, QFP, sock-

ets, plugs, BGA, special compo-

nents, bare dies, flip-chips,

shields

Component spec.

max. height

Min. lead pitch

Min. lead width

min. ball pitch

min. ball diameter

min. dimensions

max. dimensions

max. weight

25 mm (larger heights on request)

0.3 mm

0.15 mm

0.35 mm

0.2 mm

1.0 mm x 0.5 mm

55 mm x 45 mm

(single measurement)

For use with two nozzles

50 mm x 50 mm or

69 mm x 10 mm

For use with one nozzle:

85 mm x 85 mm or

125 mm x 10 mm

max. 200 mm x 125 mm (with restric-

tions)

100 g

25 mm (larger heights on

request)

0.25 mm

0.1 mm

0,14 mm

0.08 mm

1.0 mm x 0.5 mm

16 mm x 16 mm

(single measurement)

100 g

Programmable set-down force 1.0 N - 15 N

2.0 N - 30 N

1.0 N - 15 N

2.0 N - 30 N

Nozzle types 5 xx (standard)

4 xx + adapter

8 xx + adapter

9 xx + adapter

5 xx (standard)

4 xx + adapter

8 xx + adapter

9 xx + adapter

Nozzle distance of the two

Pick&Place heads

70.8 mm 70.8 mm

X/Y accuracy ± 26 µm/3

± 35 µm/4

± 22 µm/3

± 30 µm/4

Angular accuracy ± 0.05° / 3

± 0.07°/4

± 0.05° / 3

± 0.07° / 4

a) Please note that the range of components that can be placed is also affected by the pad geometry, customer-specific stan-

dards, component packaging tolerances and component tolerances.

b) If standard nozzles are used

c) SIPLACE high force head

Placement heads

TwinHead for High-Precision IC Placement

IC and FC Cameras on the CA4 Machines

33 and 25

25 and 33

25 or 33

25 or 33 33 or 25

33 or 25

25 or 33

C&P C&P20CA or C&P12 or C&P6

C&P6/12 6 segment Collect&Place head or

12 segment Collect&Place head

TH TwinHead

25 FC camera, type 25

33 IC camera, type 33

G1, G2, G3, G4 Gantry 1, Gantry 2, Gantry 3, Gantry 4

G3 G3

G2 G2