Specification SIPLACE CA-Series2011版 - 第8页

8 Machine Description Technical Data - SMT Placement head types – 20 segment Collect&Place CA head (C&P20CA) – 12 segment Collect&Place CA head (C&P12A) – 6 segment Collect&Place CA head (C&P6) – …

Machine Description

SIPLACE Wafer System

Description

The SIPLACE Wafer System

(SWS) makes the compo-

nents available to the place-

ment head, directly from the

wafer. The SWS therefore

extends the component

spectrum of the established

SIPLACE X machines, by

enabling placement of bare

dies from wafers.

The wafers are supplied fully

automatically out of the wafer

cassette and the dies inside

can be processed in the

established placement pro-

cedures.

Flip chip process - func-

tion

The wafer is fully automati-

cally pulled out of the wafer

cassette and is then trans-

ported to the wafer table. The

wafer table positions the die

above the ejection system

that releases the die from the

wafer foil. After this release

procedure, the flip unit noz-

zle takes the die, rotates it by

180° and makes it available

to the placement head for

pickup.

Options

The process spectrum is

supplemented by the follow-

ing options:

– Die Attach Unit:

The die attach unit takes

the die from the flip unit

nozzle and turns it, so that

it has the same top-bottom

orientation on the board

as it had on the wafer.

– Linear Dipping Unit

The Linear Dipping Unit

distributes precise layers

of flux for the flip chip pro-

cess. After the dies have

been taken over from the

flip unit, the placement

head dips the dies into the

layer of flux.

Machine Description

Technical Data - SMT

Placement head

types

– 20 segment Collect&Place CA head (C&P20CA)

– 12 segment Collect&Place CA head (C&P12A)

– 6 segment Collect&Place CA head (C&P6)

– SIPLACE TwinHead (TH)

(only possible in a placement area without SWS).

Number of gan-

tries

CA4: 4 gantries

CA3: 3 gantries

Placement posi-

tion

6,000 / gantry for the Collect&Place heads

2,000 / gantry for the TwinHead

Component spec-

trum

a) The range of components depends on which head configuration is selected.

0.4 mm x 0.2 mm (01005), 0.6 mm x 0.3 mm (0201)

to 85 mm x 85 mm / 125 mm x 10 mm,

max. 200 mm x 125 mm (with restrictions)

Component

height

C&P20CA: 4 mm

C&P12: 6 mm

C&P6: 8.5 mm

TH: 25 mm

(higher heights on request)

b) The specified component height for TwinHead might be reduced in placement areas with two gantries and a combination

of Collect&Place head and TwinHead.

Placement accu-

racy

(Standard criteria

for SMD)

C&P20CA

C&P12

C&P6

± 41 µm (3), ± 55 µm (4)

± 45 µm (3), ± 60 µm (4)

± 26 µm (3), ± 35 µm (4)

± 22 µm (3), ± 30 µm (4)

Component camera, type 41 (6 x 6)

Component camera, type 29 (27 x 27)

Component camera, type 33 (55 x 45)

Component camera, type 25 (16 x 16)

Placement accu-

racy

(Advanced crite-

ria for SWS)

C&P20CA

C&P12

C&P6

± 25 µm (3), ± 33 µm (4)

± 35 µm (3), ± 47 µm (4)

± 26 µm (3), ± 35 µm (4)

± 22 µm (3), ± 30 µm (4)

Component camera, type 41 (6 x 6)

Component camera, type 29 (27 x 27)

Component camera, type 33 (55 x 45)

Component camera, type 25 (16 x 16)

Angular accuracy C&P20CA

C&P12

C&P6

± 0.5° (3), ± 0.7° (4)

± 0.2° (3), ± 0.3° (4)

± 0.05° (3), ± 0.07° (4)

± 0.05° (3), ± 0.07° (4

)

Component camera, type 41 (6 x 6)

Component camera, type 29 (27 x 27)

Component camera, type 33 (55 x 45)

Component camera, type 25 (16 x 16)

Machine Description

Technical Data - SMT

Component supply – SIPLACE CA4: Up to four SWS

possible in placement area 1 and 2

– SIPLACE CA3: Two SWS

possible in placement area 1

– Component trolley (X series)

(with tape reel holder and integrated waste tape bin,

40 locations, each with 8 mm X feeders per component trolley)

– Matrix Tray Changer

(on request)

Feeder module types – X series component trolley: tapes, waffle pack trays

Supply capacity

(component

trolley

X series)

160 tracks Width: 8 mm 8 mm X feeder modules

80 tracks Width: 12 mm 12 mm X feeder modules

52 tracks Width: 16 mm 16 mm X feeder modules

52 tracks Width: 24 mm 24 mm X feeder modules

40 tracks Width: 32 mm 32 mm X feeder modules

32 tracks Width: 44 mm 44 mm X feeder modules

24 tracks Width: 56 mm 56 mm X feeder modules

20 tracks Width: 72 mm 72 mm X feeder modules

16 tracks Width: 88 mm 88 mm X feeder modules

Board format

(LxW)

Single conveyor

50 mm x 50 mm to 450 mm x 508 mm

50 mm x 80 mm to 610 mm x 508 mm ("Long board" option)

Dual conveyor

50 mm x 50 mm to 450 mm x 250 mm

50 mm x 80 mm to 610 mm x 250 mm ("Long board" option)

Dual conveyor in single conveyor mode

50 mm x 50 mm to 450 mm x 450 mm

50 mm x 80 mm to 610 mm x 450 mm ("Long board" option)

PCB thickness 0.3 - 4.5 mm (standard, thicker boards on request)

Vacuum tooling on request

Thin PCBs on a carrier

a) No combination of SWS and TwinHead possible

b) The Matrix Tray Changer can only be used at locations 2 and 4.