YSM10安装调整(eng) - 第87页

For Ser v ice E n gineer Service Information SI1610004E -000= YSM10_Proced ures for the adjustmen ts required after installing a machine 87/107 1 1.2 Workflow for when “AMF Index 1“ fal ls below 1.000 After check ing the…

For Service Engineer

Service Information

SI1610004E-000= YSM10_Procedures for the adjustments required after installing a machine

86/107

11. Basic adjustments required when “AMF index 1” falls below 1.000

In the ACP-Chip accuracy check, if the “AMF index 1” value falls below 1.000 even after feeding

back the correction values twice, analyze the measured data on the “VgChart” and perform the

necessary adjustments.

If the mounting is unstable, the AMF index cannot be improved no matter how many times the

adjustment by the ACP-Chip is performed. Check the cause of the problem referring to the

analysis result, and perform the related basic adjustments again.

In case the cause of the problem cannot be identified, perform the “󴥬󴫐” adjustment for all the

fiducial cameras and the component recognition cameras.

When “AMF Index 1” falls below 1.000 only for the multi camera, perform the “󴥬󴫐” adjustment

for the multi camera.

11.1 Flow of the basic adjustment

Figure 129

The result does not fall within the spec even after feeding

back the correction values twice or more in ACP-Chip

Check the VgChart

“Fiducial camera” – “Lightness” adjustment

“Scan camera” – “Lightness” adjustment

整

“Fiducial camera” – “󴥬󴫐” adjustment

(Option) “Multi Camera” –

“󴥬󴫐” & “Dual Rec Offset” adjustments

(Option) “Multi Camera” –

“Lightness” adjustment

・ Does the deviation occur to the specific

head?

・ Does the deviation occur repeatedly?

 Check the related parts.

When the result does not fall

within the spec. only in the

multi camera, perform the

basic adjustments only for the

multi camera.

“Head Offset Z” adjustment

“PCB Height” adjustment

“Scan camera (Main)” – “󴥬󴫐” &

“Dual Rec Offset” adjustment

Mounting adjustment

(ACP-Chip)

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11.2 Workflow for when “AMF Index 1“ falls below 1.000

After checking the VgChart and finding the problem, identify the cause of the problem and take

appropriate measures. And then perform the ACP-Chip adjustment again.

If the cause of the problem cannot be identified, perform the adjustment of all the items in “11.3

Adjustments related to the mounting accuracy” a g a i n .

After readjusting the basic adjustments, perform the ACP-Chip adjustment again.

1. Identify the cause of the problem on the VgChart.

Check the tendency of the deviation of the mounting positions on the VgChart.

・ Does the deviation occur repeatedly?

・ Does the deviation occur to all the heads in the same way?

2. Check the following possible causes of the problems assumed by the mounting result on

the VgChart.

・ Is the machine installed properly?

・ Is the board clamped properly?

・ Is the 󳬹󳴵 attached to the head properly?

・ Are the components and the mark recognized properly?

・ Any abnormality found in the recognition unit?

(Is the camera installed properly? Are the lenses clean?)

・ Others

3. Readjust the basic data.

If the cause of the problem can be identified, readjust the related basic data.

See “11.3 Adjustments related to the mounting accuracy” for the adjustment items.

 When any error occurs in the ACP-Chip adjustment by the main camera

 Perform the adjustment for all the cameras.

 When any error occurs in the ACP-Chip adjustment by the sub camera

 Perform the adjustment only for the sub camera.

 When any error occurs in the ACP-Station adjustment by the sub camera.

Feedback the correction values instead of readjusting the basic data.

4. Check the mounting accuracy after feeding back the correction values.

After saving the correction values in the machine data, perform the ACP-Chip accuracy check

again.

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11.3 Adjustments related to the mounting accuracy

When performing the basic adjustments for the machine, read the board data for adjustment

“MCH_SETUP” beforehand.

11.3.1 Fiducial camera - “󴥬󴫐” adjustment

Perform the “󴥬󴫐” adjustment by recognizing the



0.5mm mark on the 󵪼󵮄 board.

1. Set the board for the adjustment on the conveyor.

2. Trace the “Board offset” position (



0.5mm mark on the 󵪼󵮄 board).

Caution:

If the machine is equipped with the optional sub camera, the camera closer to the mark is automatically

selected. Check the camera that has moved to the mark position.

[007 Fiducial camera] on the CalibSm main menu, and select “󴥬󴫐” from

“Adjust Item”.

Figure 130

4. Select the camera.

Select the camera that has moved to above the



0.5mm mark (“Board offset” position).

[Rec Test] .

After the mark is recognized, the camera moves to the center of the mark.

[Execute] .

The camera moves 1.5mm to the X and to the Y directions, and the 󴥬󴫐 and the camera angle

are measured.

7. Check the measurement results and save the data.

Make sure that the values meet the specification and save them.

Item

Specified value

Fiducial Camera 󴥬󴫐 X, Y

10.280 ~ 10.880



Camera Angle

0.000 +/- 0.500 degrees

Table 39

8. If the machine is equipped with the optional sub camera, perform the adjustment for both

the cameras.

1) [Switch Camera] .

The other camera moves to above the



0.5mm mark and the setting of the Camera type is

switched automatically.

[Rec. Test] .

[Execute] .

4) Check the measurement results and save the data.

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