X-Serie S_705 - 第17页

17 Machine performance Placement head types SIPLACE SpeedStar (C&P20 P) SIPLACE MultiStar (CPP) SIPLACE TwinStar (TH) SIPLACE X4i S Placement performa nce For a definition of placement performance values, see the not…

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Machine performance
Placement head types SIPLACE SpeedStar (C&P20 P)
SIPLACE MultiStar (CPP)
SIPLACE TwinStar (TH)
SIPLACE X3 S
Placement performance
For a definition of placement performance values, see the note on page 15.
Machine Placement area 1 Placement area 2 IPC value Benchmark
value
Theoretical
value
X3 S-A C&P20 P / C&P20 P C&P20 P 78,100 93,750 127,875
C&P20 P / C&P20 P CPP_L 73,200 86,150 117,500
C&P20 P / C&P20 P CPP_H 70,100 82,500 112,530
CPP_L/CPP_L CPP_L 57,500 67,650 92,400
CPP_H / CPP_H CPP_H 49,750 58,500 78,250
CPP_L/CPP_L CPP_H 54,000 63,500 85,000
X3 S-B C&P20 P / C&P20 P TH 57,000 67,500 92,070
CPP_L/CPP_L TH 41,650 49,000 68,750
CPP_H / CPP_H TH 37,400 44,000 60,200
X3 S-C CPP_H/TH TH 25,500 29,100 41,250
X3 S-D TH / TH TH 11,900 14,000 21,450
SIPLACE X4 S
Placement performance
For a definition of placement performance values, see the note on page 15.
Placement area 1 Placement area 2 IPC value Benchmark
value
Theoretical
value
X4 S-A C&P20 P / C&P20 P C&P20 P / C&P20 P 105,000 125,000 170,500
C&P20 P / C&P20 P CPP_L/CPP_L 90,500 106,500 145,250
C&P20 P / C&P20 P CPP_H / CPP_H 86,250 101,500 138,450
CPP_L/CPP_L CPP_L/CPP_L 74,800 88,000 123,200
CPP_L/CPP_L CPP_H / CPP_H 70,550 83,000 112,500
CPP_H / CPP_H CPP_H / CPP_H 66,300 78,000 106,000
X4 S-B C&P20 P / C&P20 P CPP_H/TH 68,500 81,000 110,480
CPP_L/CPP_L CPP_H/TH 57,800 68,000 95,700
CPP_H / CPP_H CPP_H/TH 53,550 63,000 85,650
X4 S-C C&P20 P / C&P20 P TH / TH 60,500 71,500 97,520
CPP_L/CPP_L TH / TH 45,050 53,000 75,900
CPP_H / CPP_H TH / TH 40,800 48,000 65,250
X4 S-D CPP_H/TH TH / TH 28,050 33,000 48,400
X4 S-E TH / TH TH / TH 15,300 18,000 28,600
CPP_H = Multistar CPP in high assembly position
CPP_L = Multistar CPP in low assembly position
17
Machine performance
Placement head types SIPLACE SpeedStar (C&P20 P)
SIPLACE MultiStar (CPP)
SIPLACE TwinStar (TH)
SIPLACE X4i S
Placement performance
For a definition of placement performance values, see the note on page 15.
Machine Placement area 1 Placement area 2 IPC value Benchmark
value
Theoretical
value
X4i S-A C&P20 P / C&P20 P C&P20 P / C&P20 P 125,000 150,000 200,000
C&P20 P / C&P20 P CPP_L/CPP_L 102,000 120,000 160,000
C&P20 P / C&P20 P CPP_H / CPP_H 100,300 118,000 157,300
CPP_L/CPP_L CPP_L/CPP_L 79,900 94,000 112,000
CPP_L/CPP_L CPP_H / CPP_H 73,950 87,000 97,800
CPP_H / CPP_H CPP_H / CPP_H 68,000 80,000 90,000
X4i S-B C&P20 P / C&P20 P CPP_H/TH 85,000 99,900 133,200
CPP_L/CPP_L CPP_H/TH 58,150 68,400 77,500
CPP_H / CPP_H CPP_H/TH 52,190 61,400 69,075
X4i S-C C&P20 P / C&P20 P TH / TH 70,900 85,500 114,000
CPP_L/CPP_L TH / TH 49,300 58,000 65,900
CPP_H / CPP_H TH / TH 43,350 51,000 57,300
CPP_H = Multistar CPP in high assembly position
CPP_L = Multistar CPP in low assembly position
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Placement heads
Overview
Head modularity
The SIPLACE placement
machines are distinguished
by maximum flexibility in the
production process. This
flexibility is in part due to the
head modularity of the place-
ment machines, which allows
different placement head
variants to be configured to
suit the production require-
ments.
Collect&Place principle
The SIPLACE SpeedStar
operates according to the
Collect&Place principle i.e.
one cycle includes pickup or
"collection" of 20 compo-
nents, their optical centering
on the board and their rota-
tion into the required place-
ment angle and position.
They are then placed gently
and accurately onto the PCB.
This principle is particularly
suitable for high-speed
placement of standard
components.
Pick&Place principle
The high precision SIPLACE
TwinStar, which consists of
two Pick& Place modules of
identical design, coupled to
one another, functions
according to the Pick&Place
principle. Two components
are picked up by the place-
ment head, optically cen-
tered on the way to the
placement position and
rotated into the necessary
placement angle. This princi-
ple is ideally suitable for fast
and precise placement of
special components in the
fine pitch or super fine pitch
field, plus complex and
heavy components which
may need grippers.
Mixed mode
The new SIPLACE MultiStar
uses both the Collect&Place
and the Pick&Place princi-
ple.
Mixed Mode allows com-
bined use of these two
modes, which were previ-
ously separated from one
another, in one placement
cycle.
Control and self-learning
functions
The reliability of the
SIPLACE placement heads
can be enhanced even fur-
ther with various checking
and self-learning functions.
• Component sensor
Checks the presence of
the components on the
nozzle before the pickup
and placement process
• Digital camera
Checks the position of
each component on the
nozzle. This check is per-
formed in a single step,
with no extra time involved
but with optimum scan-
ning of each individual
component.
• Force sensor
Monitors the prescribed
component set-down
force. The sensor stop
procedure enables com-
pensation of height differ-
ences during pickup and
PCB warpage during
placement.
• Vacuum sensor
Checks whether the com-
ponent was correctly
picked up or placed.