X-Serie S_705 - 第18页

18 Placement heads Overview Head modularity The SIPLACE placement machines are dis tinguished by maximum flexibility in the production pr ocess. This flexibility is in part due to the head modu larity of the pl ace- ment…

Machine performance

Placement head types SIPLACE SpeedStar (C&P20 P)

SIPLACE MultiStar (CPP)

SIPLACE TwinStar (TH)

SIPLACE X4i S

Placement performance

For a definition of placement performance values, see the note on page 15.

Machine Placement area 1 Placement area 2 IPC value Benchmark

value

Theoretical

value

X4i S-A C&P20 P / C&P20 P C&P20 P / C&P20 P 125,000 150,000 200,000

C&P20 P / C&P20 P CPP_L/CPP_L 102,000 120,000 160,000

C&P20 P / C&P20 P CPP_H / CPP_H 100,300 118,000 157,300

CPP_L/CPP_L CPP_L/CPP_L 79,900 94,000 112,000

CPP_L/CPP_L CPP_H / CPP_H 73,950 87,000 97,800

CPP_H / CPP_H CPP_H / CPP_H 68,000 80,000 90,000

X4i S-B C&P20 P / C&P20 P CPP_H/TH 85,000 99,900 133,200

CPP_L/CPP_L CPP_H/TH 58,150 68,400 77,500

CPP_H / CPP_H CPP_H/TH 52,190 61,400 69,075

X4i S-C C&P20 P / C&P20 P TH / TH 70,900 85,500 114,000

CPP_L/CPP_L TH / TH 49,300 58,000 65,900

CPP_H / CPP_H TH / TH 43,350 51,000 57,300

CPP_H = Multistar CPP in high assembly position

CPP_L = Multistar CPP in low assembly position

Placement heads

Overview

Head modularity

The SIPLACE placement

machines are distinguished

by maximum flexibility in the

production process. This

flexibility is in part due to the

head modularity of the place-

ment machines, which allows

different placement head

variants to be configured to

suit the production require-

ments.

Collect&Place principle

The SIPLACE SpeedStar

operates according to the

Collect&Place principle i.e.

one cycle includes pickup or

"collection" of 20 compo-

nents, their optical centering

on the board and their rota-

tion into the required place-

ment angle and position.

They are then placed gently

and accurately onto the PCB.

This principle is particularly

suitable for high-speed

placement of standard

components.

Pick&Place principle

The high precision SIPLACE

TwinStar, which consists of

two Pick& Place modules of

identical design, coupled to

one another, functions

according to the Pick&Place

principle. Two components

are picked up by the place-

ment head, optically cen-

tered on the way to the

placement position and

rotated into the necessary

placement angle. This princi-

ple is ideally suitable for fast

and precise placement of

special components in the

fine pitch or super fine pitch

field, plus complex and

heavy components which

may need grippers.

Mixed mode

The new SIPLACE MultiStar

uses both the Collect&Place

and the Pick&Place princi-

ple.

Mixed Mode allows com-

bined use of these two

modes, which were previ-

ously separated from one

another, in one placement

cycle.

Control and self-learning

functions

The reliability of the

SIPLACE placement heads

can be enhanced even fur-

ther with various checking

and self-learning functions.

• Component sensor

Checks the presence of

the components on the

nozzle before the pickup

and placement process

• Digital camera

Checks the position of

each component on the

nozzle. This check is per-

formed in a single step,

with no extra time involved

but with optimum scan-

ning of each individual

component.

• Force sensor

Monitors the prescribed

component set-down

force. The sensor stop

procedure enables com-

pensation of height differ-

ences during pickup and

PCB warpage during

placement.

• Vacuum sensor

Checks whether the com-

ponent was correctly

picked up or placed.

Placement heads

Standard functions / options

SIPLACE SpeedStar (C&P20 P) SIPLACE MultiStar (CPP)

Standard-

functions

High-resolution camera, vacuum

sensor, force measurement,

component sensor, integrated

turning station per segment,

PCB warpage check, individual

image of each component

Standard-

functions

High-resolution camera, vac-

uum sensor, force measure-

ment, component sensor,

integrated turning station per

segment, PCB warpage check,

individual image of each com-

ponent

Options Nozzle changer, special nozzles Options Nozzle changer, special noz-

zles, stationary fine-pitch cam-

era

SIPLACE TwinStar (TH)

Standard-

functions

Stationary fine pitch camera,

vacuum sensor, force measure-

ment, nozzle changer, PCB

warpage check, individual image

of each component

Options Stationary flip chip camera, spe-

cial nozzles, grippers