X-Serie S_705 - 第43页

43 Component feeding SIPLACE JTF-S/JTF-M Technical data SIPLACE JTF-S SIPLACE JTF-M Width 162 mm 177 mm Height 587 mm 587 mm JEDEC waffle pack tray spec- ification JEDEC Standard: 95-1 & IEC 60286-5 Storage capa city…

Component feeding

SIPLACE JTF-S/JTF-M

The SIPLACE JTF-S/JTF-M

is an automatic and fast

changer for standard JEDEC

waffle pack trays. On

SIPLACE X-Series S

machines, a SIPLACE JTF-

S/JTF-M can be installed on

a fixed table instead of a

component trolley. The

SIPLACE JTF-S/JTF-M

occupies a fixed area of

tracks on the fixed table.

The SIPLACE JTF-S/JTF-M

is available in two versions

• SIPLACE JTF-S

• SIPLACE JTF-M

SIPLACE JTF-S

The SIPLACE JTF-S stores

a stack of up to 30 thin or 20

thick JEDEC waffle pack

trays and supplies them in

succession. The placement

machine can be supplied

with one component type at

constant waffle pack tray

changeover time.

SIPLACE JTF-M

Depending on the magazine

type, the SIPLACE JTF-M

stores up to 18 thin or 14

thick JEDEC waffle pack

trays in an exchangeable

cassette and supplies them

as required. The placement

machine can therefore be

supplied with different

component types at variable

waffle pack tray changeover

times.

JTF-S/JTF-M

Fixed component table

Component feeding

SIPLACE JTF-S/JTF-M

Technical data

SIPLACE JTF-S SIPLACE JTF-M

Width

162 mm 177 mm

Height

587 mm 587 mm

JEDEC waffle pack tray spec-

ification

JEDEC Standard: 95-1 & IEC 60286-5

Storage capacity

Waffle pack tray, thin 30 JEDEC waffle pack trays 18 JEDEC waffle pack trays

Waffle pack tray, thick 20 JEDEC waffle pack trays 14 JEDEC waffle pack trays

Waffle pack tray changeover

time

< 5 seconds (depending on

application)

Slot n to n+1 -- 3.5 seconds

Slot 1 to 18 -- 10 seconds

Slot 18 to 1 -- 8.9 seconds

Cassette

Dimensions -- approx. 330 mm x 150 mm x 230

Max. load capacity -- 2.7 kg (150 g each for 18 slots)

Pneumatics

4.1 bar to 5.5 bar 5.2 bar to 9 bar

Compressed air consumption

< 28.3 NL/min. < 28.3 NL/min.

Digital SIPLACE Vision system

The digital Vision system

ensures fast and reliable

component recognition, cou-

pled with user-friendly han-

dling. The system identifies

each individual component

by its geometry and color.

Even complex component

shapes, such as flip chip or

CCGA are detected with high

reliability.

This component recognition

check is performed in a sin-

gle step, with no extra time

involved but with optimum

scanning of each individual

component.

This digital Vision system is

not only used in the compo-

nent cameras but also in the

PCB camera. In addition to

the precise recognition of

components, this also guar-

antees reliable detection of

ínkspots and PCB fiducials.

The benefits at a glance:

• Extremely fast and reliable

component recognition

• Shortest cycle times

• Robust measurement

based on the geometry

and color

• Straightforward program-

ming

• Offline programming of

component shapes

• Rapid introduction of new

products (NPI)

• Open architecture allows

you to quickly adapt to

new requirements

• Optimum placement

results based on individ-

ual measurement of each

component

The SIPLACE Vision sys-

tem offers inspection rou-

tines and functions to

enhance the quality of com-

ponent recognition.

The benefits at a glance:

• Maximum placement

quality

• High first pass yield

• Reduction of operating

costs

Examples of digital vision system analysis times

Evaluation times only play a role in the P&P process.

03015 9 ms

PLC44 17 ms

BGA 225 balls 18 ms

Digital vision cameras

SIPLACE SpeedStar camera, type 23

SIPLACE SpeedStar camera, type 41

SIPLACE MultiStar camera, type 30

SIPLACE TwinStar standard camera, type 33

SIPLACE TwinStar high resolution camera, type 25

SIPLACE PCB camera, type 34