X-Serie S_705 - 第7页

7 Overview of technical data Maximum values Placement pe rformanc e a IPC value Benchmark value Theoretical value a) Definition of performance values see page 15. 125,000 comp./h 150,000 comp./h 200,000 comp./h Component…

SIPLACE X-Serie

Content

Overview of technical data

Maximum values

Placement performance

IPC value

Benchmark value

Theoretical value

a) Definition of performance values see page 15.

125,000 comp./h

150,000 comp./h

200,000 comp./h

Component range 03015 - 200 mm x 125 mm

Placement accuracy

/ angular accuracy

b) The SIPLACE benchmark value is measured during the machine acceptance tests. It corresponds to the

conditions set out in the SIPLACE scope of service and supply.

± 22 µm, ± 0.05° / (3),

± 30 µm, ± 0.07° / (4

)

Feeder module types Tape feeder modules, linear vibratory feeders,

dip modules, application-specific OEM feeder

modules

Feeding capacity (component trolley X) 160 feeder modules 8 mm X

Board format (length x width) 850 mm

x 560 mm

c) With license for "Long Board Option" and input/output conveyor extension.

PCB thickness 0.3 - 6.5 mm

PCB weight up to 3.0 kg

Camera 6 illumination levels

Machine protection:

Telegray (RAL 7047)

Machine colors

Covers: Telegray

(RAL 7047)

Covers: Pearl dark gray

(RAL 9023)

SIPLACE X-Series

Machine description

The X-Series placement

machines are available in

four different variants

•SIPLACE X2S

•SIPLACE X3 S

•SIPLACE X4 S

• SIPLACE X4i S

The numbers in the type

name indicate the number of

gantries used. Each gantry

has one placement head.

Intelligent placement solu-

tions for maximum stan-

dards

Maximum flexibility, top per-

formance or placement qual-

ity: the SIPLACE X-Series

has state-of-the-art technol-

ogy to master any challenge

arising in SMT production. It

offers all the innovations and

features to ensure efficient

electronics production today

and in the future, and pro-

vides previously unavailable

ways to increase both effi-

ciency and productivity.

Maximum modularity for

every need

The compact design of the

SIPLACE X-Series forms the

ideal basis for new, future-

oriented production concepts

which keep pace with

dynamically developing cus-

tomer requirements, without

the need for time-consuming

conversion as in traditional

SMT production lines.

The SIPLACE X-Series cov-

ers the entire range of com-

mon components with only

three placement heads. The

ideal addition to the proven

SIPLACE TwinStar and the

high speed SIPLACE

SpeedStar 20 segment C&P

placement head is the new

SIPLACE Multistar head.

Due to the patented CPP

technology (Col-

lect&Pick&Place), the

SIPLACE Multistar is the

first placement head world-

wide which can not only

switch between Pick&Place

and rapid Collect&Place

placement but can also com-

bine both modes in one

placement cycle (mixed

mode). Software-controlled

changeover of placement

modes in a flash enables you

to easily and perfectly bal-

ance out your production line

in the event of rapidly chang-

ing requirements. Compared

to conventional solutions,

head changes are no longer

needed and the overall pro-

ductivity of the line increases

significantly.

During placement, the place-

ment heads pick up the com-

ponents from the waiting

supply and place these on

the board waiting.

This established SIPLACE

principle ensures reliable

pickup of even the smallest

components, prevents com-

ponents sliding on the board

and enables minimized travel

paths.

The user also benefits from

different PCB conveyors:

The single conveyor and

the flexible dual conveyor.

SIPLACE MultiStar