RAPID-NX-LINE-UK - 第5页

m Single side 4 heads m Up to 4500 hits/min m Automatic / Manual loading m Automatic test generation for embedded components m ICT test R,L,C, Junction m Soft land to minimize pad impact m Soft touch probe RAPID H 4 A / …

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m Double side 8 heads (4+4)
m Automated loading
m MTBH conveyer
m 9000 hits/min
m Ultrafast capacitive test
m Stretch fixture system built-in
m Kelvin/Barrel
m ICT (embedded components)
m Automatic marker system
m Laser warpage calculation
m Medium volumes
m Soft touch probe
m Soft land
RAPID V8/V
4
NEXT>RAPID V8
A
NEXT>
m Manual loading
m Double side 8 heads (4+4) / 4 heads (2+2)
m 9000 hits/min / 4500 hits/min
m Laser warpage calculation
m Small volumes and prototypes (V4)
m Medium/Low volumes (V8)
m Ultrafast capacitive test
m Kelvin/Barrel
m ICT (embedded components)
m Soft touch probe
m Soft land
m Double side 8 heads (4+4)
m Automated
m In-line conveyor
m Pass / Fail magazine
m 9000 hits/min
m Automatic marker system
m Kelvin Barrel Test
m Laser warpage calculation
m Medium volumes
m ICT (embedded components)
m Soft touch probe
m Soft land
RAPID H8 NEXT>
RAPID NEXT> is SEICA’s line of Flying Probe testers for
printed circuit boards with the highest performance available
on the market. It meets the requirements of industry segments
through models with horizontal or vertical architecture, 4 or 8
independent flying probes and a complete range of
measurement techniques.
Through Seica architecture flexibility all unique market
segments can be easily addressed due to the advanced
hardware and software integration.
Hori
Z
ontal Systems
RAPID NEXT>
FLYING PROBE TEST PLATFORM FOR PCBS
V
ertical Systems
m Single side 4 heads
m Up to 4500 hits/min
m Automatic / Manual loading
m Automatic test generation for embedded components
m ICT test R,L,C, Junction
m Soft land to minimize pad impact
m Soft touch probe
RAPID H
4A/
H
4
NEXT>
m Vacuum table
m Unwinder, rewinder
m Integrated ionizer
m Single side 4 heads
m Up to 4500 hits/min
m Automatic / Manual loading
m Automatic test generation for embedded components
m ICT test R,L,C, Junction
m Soft land to minimize pad impact
m Soft touch probe
RAPID H
4 FLEX
NEXT>
SOLUTIONS FOR CERAMIC AND FLE
XI
BLE CIRCUITS
Different architectures for di
V
erse solutions
Rapid NEXT> V8
A
V8 V
4
H
8 A
H
4 A H4
Architecture Vertical Vertical Vertical Horizontal Horizontal Horizontal
Max Mobile Resources 4+4 4+4 2+2 4+4 4
1
4
1
Loading Aut/Man Manual Manual Aut/Man Aut/Man Manual
Trace parameter test ül l l ül l l
Test of passive components ül l l ül l l
Test of active components ül l m ül l l
Kelvin test ül l m ül l l
Barrel test ül l l ül m m
Multipanel Test ül l l ül l l
Barcode reading ül l l ül l l
Stamper ül l l ül l l
Repair station ül l l ül l l
Programming Station ül l l ül l l
Vacuum table m m m ül l l
Best for Med. Med/Low. volumes Low volumes. Med. Ceramics Ceramics/Flex
volumes and prototypes & prototypes volumes med./low volumes low volumes
& prototypes & prototypes
l= available m= not possible
1
probes on TOP side only -
2
H4 Flex
TEST Tools for Substrates
HIGH ACCURACY TESTS
The capability of each probe to contact precisely any
point of the PCB independently of the location, enables
the even the most sophisticated tests to verify the circuit.
Trace Parameter Test: checks the continuity and isolation
between the PCB tracks through a resistive test.
Micro Short Identifier: checks for the presence of a short
circuit between tracks due to the manufacturing process.
100 GΩ isolation: isolation test up to 100 GΩ, applying
1000 Volts (optional).
Trace Capacitance Test: autolearns and tests the
capacitance between tracks and ground planes of the
PCB.
Kelvin Test: thanks to its architecture, Seica can perform
Kelvin measurements using strandard probes, and
positioning two probes on the same pad.
Barrel Test: performs continuity and parametric tests
on the vias of the PCB, by simultaneously positioning
two probes on each side.
Component Test: The RAPID NEXT>
systems can generate and perform all of the
parametrical and functional tests of passive and active
embedded components, thanks to Seica’s decades of
experience and technology developed for full, loaded
board tests.
Link to Grid Test: enables retesting of boards, or sections
of boards previously tested on a bed of nails system.
Flexible Circuits: Seica has designed a new mechanical
locking system for flex circuits and inner layers with a
unique clamping device to minimize board warpage,
and for testing the extremely thin flex circuits, a vacuum
table, insertable in the test area, is available to simplify
testing.
PROBE
The RAPID NEXT> test system are equipped with
test probes designed specifically to enable the fast,
accurate testing of all types of board layouts: even the
most critical layouts and the smallest-sized pads can be
probed, thanks to the geometry, accuracy and
repeatability intrinsic to Seica systems. The innovative
design of the latest probe pins guarantees an extended life
with no maintenance (over 8 million hits). Particular
attention has been dedicated to minimize the electric noise
which can affect measurements, so it is possible to verify
even very small value parameters on tracks in a constant
and repeatable manner. The new generation of Soft Touch
Probes allows the testing of the PCB almost leaving witness
marks on the pad surface.
CAMERAS AND OPTICAL INSPECTION
All of the RAPID NEXT> line systems are
equipped with high-definition, color mobile cameras,
one on each side, allowing the automated optical
centering of the PCB and the visual inspection of the
probes during the test. In addition to simplifying the
execution and debug operations of test programs,
VIVA software includes the capability to utilize the
cameras for the automatic acquisition of barcodes.