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User Manual SIPLAC E F5 HM 7 Options Software Vers ion SR.408.xx 03/2006 U S Edition 7.5 Ceram ic substrate ce ntering 193 Fig. 7.5 - 1 Ceramic substrate centering (side view) (1) Mech anical c eramic substrate centeri n…
7 Options User Manual SIPLACE F5 HM
7.5 Ceramic substrate centering Software Version SR.408.xx 03/2006 US Edition
192
7.5 Ceramic substrate centering
7.5.1 General
The ceramic substrate can be centered either mechanically or optically.
The position of the fiducials on the ceramic substrates can be detected either with
– the sub-gantry PCB camera with normal lighting that is fitted as standard, or
– using the multi-color PCB camera (option).
7.5.2 Mechanical centering
7.5.2.1 General
Mechanical substrate centering is used to lock ceramic substrates firmly in position in the X and
Y directions in such a way that the material is not damaged. Ceramic substrates can also be
placed right up to the edge.
7.5.2.2 Assembling and dismantling the ceramic substrate centering unit
PLEASE NOTE 7
The ceramic substrate centering unit must only be assembled and dismantled by service engi-
neers. 7
User Manual SIPLACE F5 HM 7 Options
Software Version SR.408.xx 03/2006 US Edition 7.5 Ceramic substrate centering
193
Fig. 7.5 - 1 Ceramic substrate centering (side view)
(1) Mechanical ceramic substrate centering
(2) Stop
(3) Ball bearing
(4) Centering slide
(5) Proximity switch connecting cable
(6) Compressed air connection
7.5.2.3 Maintenance
– Clean and grease the ball race in the X axis centering unit.
– If necessary, check that the pneumatic driving mechanism is running smoothly.
– The conveyor should be maintained as described in the maintenance instructions.
7 Options User Manual SIPLACE F5 HM
7.5 Ceramic substrate centering Software Version SR.408.xx 03/2006 US Edition
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7.5.3 Technical data
7
7
Substrate format 50 x 50 mm² to 100 x 180 mm²
Substrate thickness 0.5 mm to 1.5 mm
Substrate model Unscribed (without problems)
Scribed (requires testing)
Support on the conveyor 2.5 mm
Optical centering: field of view of the PCB vision module
Type of illumination for light pastes:
Type of illumination for dark pastes and close spacing to
adjacent structures (> 1 mm)
5.7 x 5.7 mm²
PCB camera (standard)
Multicolor camera (option)
(4 illumination levels to be selected)
Fiducial criteria See PCB vision module position
detection
Mechanical centering:
X/Y centering accuracy ± 0.07 mm / 4 sigma
PCB underside clearance 12 mm
Compressed air connection 0.55 MPa (5.5 bar)