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7 Options User Manual SIP LACE F5 HM 7.9 Coplanarity laser module Software Version SR.408.xx 03/2006 US Edition 204 7.9 Coplanarity laser module 7.9.1 Description of the functions The coplana rity laser mod ule is us ed …
User Manual SIPLACE F5 HM 7 Options
Software Version SR.408.xx 03/2006 US Edition 7.8 Flip-chip vision module for the Pick&Place head
203
7.8.1 Description of the functions
The flip-chip vision module increases the capability for processing fine-pitch and flip-chip compo-
nents with extremely fine lead pitches. This add-on module for the fine-pitch vision module
increases the resolution many times. The lighting layout is fundamentally different. At optimal illu-
mination, the images of bumps are as large as possible, and disruptive orthogonal structures (as
can occur on chip printed conductor tracks, for example) are suppressed. With less pronounced
disruptive structures, enhanced illumination intensity can be achieved by combining lighting fix-
tures resulting in high recognition reliability, even with the generally square connection surfaces
of ‘bumped’ flip-chips as used in conductive adhesive technology. Special search algorithms are
used to recognize the bumps in environments subject to disruption.
7.8.2 Technical data
Flip-chip size
with single measurement
with multiple measurement
1 x 1 mm²
up to 7 x 9 mm²
up to 20 x 20 mm²
Dimensions < 3mmx6mm Special nozzle, feeding tolerance < 0.2 mm edge
length
Min. bump diameter 80µm
Placement cycle minimum 2 sec (depending on the number of bumps)
IC pitch:
Lead pitch
Bump pitch
0.25 mm
0.15 mm
Field of vision 9 x 11.5 mm²
Method of illumination Front lighting (three levels, programmable as
required)
7 Options User Manual SIPLACE F5 HM
7.9 Coplanarity laser module Software Version SR.408.xx 03/2006 US Edition
204
7.9 Coplanarity laser module
7.9.1 Description of the functions
The coplanarity laser module is used to measure vertical bending of the leads. The lead length is
measured without contact using the laser triangulation principle.
The placement head picks up the component to be checked, centers it optically using the IC
camera and moves all four sides one after another over the fixed laser beam of the coplanarity
laser module. In this way, every lead is scanned from below by the laser beam. The laser light
scattered by the underside of the lead is recorded by a sensor, and is then used to calculate the
exact position of the lead with respect to the PCB. The position values thus calculated are com-
pared against the limit value specified by the user. If they exceed this value, the component is
disposed of or returned.
Fig. 7.9 - 1 Laser triangulation measurement principle
(1) Receiver lens (2) Detector
(3) Measuring signal (4) Time t
(5) Laser (6) Transmitter lens
(7) Travel direction
User Manual SIPLACE F5 HM 7 Options
Software Version SR.408.xx 03/2006 US Edition 7.9 Coplanarity laser module
205
The coplanarity laser module is combined with optical component centering, and is used in a
vision module. Components with bent or missing leads are detected and disposed of, if neces-
sary.
7.9.2 Technical data
Component range: Can be used for ’gull wing’ package forms, spacing > 0.3 mm
and maximum component size 55 x 55 mm². Other restric-
tions are associated with the machine configuration.
Measuring principle: Contact-free measurement by laser triangulation
Algorithm functions: JEDEC standard - calculation of the placement plane; all
deviations are determined in relation to this plane. If the com-
ponent is angled with respect to the vacuum nozzle, as can
happen if an adapter is used, then it will have no influence
over the choice between ‘good’ and ‘bad’.
Measuring range: 3 mm
Start of measuring range (SMR) 24 mm
Reference distance
Middle of measuring range (MMR) 25.5 mm
End of measuring range (EMR) 27 mm
Linearity ± 1.5 µm
Resolution: 0.15 µm
Measuring rate 10 kHz
Wave length 670 nm, red
Max. output 1 mW
Laser class 2
Permissible ambient light: 30,000 lx
Light spot diameter SMR 80 µm, MMR 35 µm, EMR 80 µm
Operating temperature: 0°C ... + 50°C
Storage temperature - 20°C ... + 70°C
Sensor protection class IP 65
Supply voltage 24 VDC (± 15%, max. 500 mA)
Output, digital RS 422, 687.5 kBaud
Electromagnetic
compatibility (EMC)EN 50081-1 and EN 61000-6-2
Vibration 2 g / 20 ... 500 Hz
Mechanical shock 15 g / 6 ms
Weight of sensor approx. 0.5 kg