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3 Technical data User Manual S IPLACE F5 H M 3.9 Placement heads Software Version SR.408.xx 03/2006 US Edition 90 3.9.4 St ructure of the 6-segme nt Col lect&Plac e head 3 Fig. 3.9 - 2 Overview of the 6-segment Colle…
User Manual SIPLACE F5 HM 3 Technical data
Software Version SR.408.xx 03/2006 US Edition 3.9 Placement heads
89
– The component vision camera creates an image of the current component.
– The precise position of the component is also determined.
– The package form of the current component is compared against the programmed package
form in order to identify it. Any components that cannot be identified are rejected.
– The turning station turns the component to the required placement position.
3.9.2 Description of the 12-segment Collect&Place head
– The 12-segment Collect&Place head works using the "collect & place" principle, i.e. the com-
ponents are held by the nozzles with the aid of a vacuum and, after one complete pick-up cycle,
are placed gently and accurately on the PCB with the aid of forced air. The vacuum in the noz-
zles is also checked several times to determine whether the components were picked up and
set down correctly.
– The "adaptive" sensor stop mode of the z axis compensates for any irregularity of the PCB sur-
face when the components are set down.
– Defective components are rejected and are picked up again during a repair run.
3.9.3 Technical data for the 12-segment Collect&Place head
3
Range of components 0201
a)
to 18.7 x 18.7 mm² including BGA, µBGA,
flip-chip, TSOP, QFP, PLCC, SO to SO32, DRAM
Max. height 6 mm
Min. lead pitch 0.5 mm
Min. bump pitch 0.35 mm
Min. ball/bump diameter 0.2 mm
Min. dimensions 0.6 x 0.3 mm²
Max. dimensions 18.7 x 18.7 mm²
Max. weight 2 g
Placement rate 11,000 comp/h
Programmable set-down force 2.4 to 5.0 N
Nozzle types 9 xx
Angular accuracy ± 0.525° / 3 σ, ± 0.70° / 4 σ, ± 1.05° / 6 σ
Placement accuracy ± 67.5 µm / 3 σ, ± 90 µm / 4 σ, ± 135 µm / 6 σ
a) With special 0201 kit
3 Technical data User Manual SIPLACE F5 HM
3.9 Placement heads Software Version SR.408.xx 03/2006 US Edition
90
3.9.4 Structure of the 6-segment Collect&Place head
3
Fig. 3.9 - 2 Overview of the 6-segment Collect&Place head with standard component vision module
(1) Star with 6 sleeves
(2) Motor for "Reject" valve adjustment drive
(3) Turning station
(4) Standard component vision module
(5) Z axis drive
(6) Star motor
User Manual SIPLACE F5 HM 3 Technical data
Software Version SR.408.xx 03/2006 US Edition 3.9 Placement heads
91
3.9.5 Description of the 6-segment Collect&Place head
The functionality of the 6-segment revolver head is similar to that of the 12-segment revolver
head. With its standard vision module, the 6-segment Collect&Place head can quickly and accu-
rately place ICs with an edge length of up to 32 x 32 mm². It really comes into its own when there
is a very high proportion of ICs in the placement process. The cycle time of the 6-segment Col-
lect&Place head depends on the dimensions and number of component leads or bumps. 3
3.9.6 Technical data for the 6-segment Collect&Place head with
standard component vision module
3
Range of components 0603 to 32 x 32 mm²
Max. height 8.5 mm
Min. lead pitch 0.5 mm
Min. bump pitch 0.56 mm
Min. ball/bump diameter 0.32 mm
Min. dimensions 1.6 x 0.8 mm²
Max. dimensions 32 x 32 mm²
Max. weight 5 g
Programmable set-down force 2.4 to 5.0 N
Placement rate 8,500 comp/h
Nozzle types 8 xx, 9 xx
Angular accuracy ± 0.225° / 3 σ, ± 0.30° / 4 σ, ± 0.45° / 6 σ
Placement accuracy with standard vision
module
± 52.5 µm / 3 σ, ± 70 µm / 4 σ, ± 105 µm / 6 σ