Release-R17-1-CS_Reporting_en.pdf - 第3页
Softwarev ersion w ith Releas e R17-1 8/8/2017 ASM Assembly Systems Page 3 SIPLACE Pro 14.1 Station Software 710.1 and 709.3© ASM OIS 14.1 ASM OIB 5.1 ASM Setup Center 9.1 ASM T raceability 5.3 ASM EDM (Engineering Data …
8/8/2017 ASM Assembly Systems Page 2
Release R17-1
Additional Information
Station SW Features, JTF-ML2, Shuttle TX,…
Siplace Pro Features, Touchles placement, On Board inspection,…
Features R17-1
Software version
Content
Softwareversion with Release R17-1
8/8/2017 ASM Assembly Systems Page 3
SIPLACE Pro 14.1
Station Software 710.1 and 709.3©
ASM OIS 14.1
ASM OIB 5.1
ASM Setup Center 9.1
ASM Traceability 5.3
ASM EDM (Engineering Data Manager) 3.5
ASM License Manager 4.3
ASM Board Gate Keeper 2.2
ASM Printer Programming 1.0
SIPLACE Wafer System 3.3
E Pro 1.3
SIPLACE Explorer 3.5
SIPLACE Studio 2.3
Please note: Baseline for printer integration with R17-1 is DEK V9 SP17
Feature Release 17-1
8/8/2017 ASM Assembly Systems Page 4
- Improvement TX micron (Verifying Vacuumtooling, CPP M head)
- SIPLACE JTF-ML2 - Tray Feeder
- Providing Process data via OIB
- Shuttle TX extension with PCB Barcode and Stationwise download
- Touchless placement for CPx heads
- PCB-Onboard inspection ( M270)
- ASM Printer programming (SIPLACE pro forDEK) / Monitoring DEK
- Ease of Use 2.1
- Extend option LBO1500mm to LBO 1525mm on SX machine
- SIPLACE Bulkfeeder X in combination with SX- and X-Series S (M270)
Additional Documents, which described new features from the release:
- Manual OSC Package feature from release R16-2 (R90) 00198374-xx
- Manual Onboard PCB inspection
- Manual Touchless placement 00198376-xx
- Upload Machine Configuration described in the Online help of SIPLACE Pro