Release-R17-1-CS_Reporting_en.pdf - 第8页
T ouchless placement 8/8/2017 ASM Assembly Systems Page 8 The placement p rocess „T ouchless placement“ is introduced to place very th in, breakable and sensitive components. This process need a vacuum tooling or an chuc…
OIS for DEK Printer
08.08.2017 Page 7 ASM Assembly Systems
OIS Main View for Printer
OIS client installation at DEK printer.
If DEK printer is part of SIPLACE Pro line configuration,
it appears in OIS, can be selected and shows details.
PCB Overview for Printer
Each board is listed, similar to SIPLACE machines.
Info about recipe, setup, transport conveyor, build time, etc
Machine availability for Printer
Machine states as pie chart and in percentage
Detailed listing of events and duration
Events: PCB start, printing, kneading, cleaning, waiting
Touchless placement
8/8/2017 ASM Assembly Systems Page 8
The placement process „Touchless placement“ is introduced to place very thin, breakable and sensitive components.
This process need a vacuum tooling or an chuck, so basically to use with the SIPLACE CA and SIPLACE TX micron machine.
Preconditions:
- R17-1 with 710.1 and SIPLACE Pro 14.1
- Planarity of the PCB < 20µm
- Chuck/ Vacuum-Tooling
- Stable quality of the component (thickness)
- Touchless placement mode for C&P 20 A/M/P/M2 heads possible
Recommendation: Execute the head maintenance include the test „Head Verification“
No license for this Feature!
Touchless placement
8/8/2017 ASM Assembly Systems Page 9
Precondition/Settings in SIPLACE Pro
- Defined height measurement point
on the board, min.3 points.
- Choose in the Component Shape Editor „Touchless Placement”.
- All settings will be generate automatically, without the „Z-Height“ – Tolerance
Sequence on the station
- Input the PCB and recognize the fiducial.
- Measurement the „height measurement points“ with the Z-axis and check the level with the defined tolerance
- New errormessages are possible:
32438 „Z position out of range…“
32439 „Slope detection…“