Release-R17-1-CS_Reporting_en.pdf - 第9页
T ouchless placement 8/8/2017 ASM Assembly Systems Page 9 Precondition/Settings in SIPLACE Pro - Defined height measurement point on the board, min.3 point s . - Choose in the Component Shape Ed itor „T ouchless P laceme…
Touchless placement
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The placement process „Touchless placement“ is introduced to place very thin, breakable and sensitive components.
This process need a vacuum tooling or an chuck, so basically to use with the SIPLACE CA and SIPLACE TX micron machine.
Preconditions:
- R17-1 with 710.1 and SIPLACE Pro 14.1
- Planarity of the PCB < 20µm
- Chuck/ Vacuum-Tooling
- Stable quality of the component (thickness)
- Touchless placement mode for C&P 20 A/M/P/M2 heads possible
Recommendation: Execute the head maintenance include the test „Head Verification“
No license for this Feature!
Touchless placement
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Precondition/Settings in SIPLACE Pro
- Defined height measurement point
on the board, min.3 points.
- Choose in the Component Shape Editor „Touchless Placement”.
- All settings will be generate automatically, without the „Z-Height“ – Tolerance
Sequence on the station
- Input the PCB and recognize the fiducial.
- Measurement the „height measurement points“ with the Z-axis and check the level with the defined tolerance
- New errormessages are possible:
32438 „Z position out of range…“
32439 „Slope detection…“
Touchless Placement Process
ASM Assembly Systems
Zero Placement force
Application for very fragile
component
Accurate process control of
placement into the flux/solder
etc.
Vacuum tooling to make sure
PCB is flat positioned and supported
1
2
Height measurement for
PCB leveling prior to placement
3
Place component with accurate Z axis
height control based on PCB leveling
∆ Controlled
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