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User Manual HS-50 6 Vision functions Software Version S R.501.xx 12/99 Issue US 6.6 Test Comp onent 289 t I I t 6.6.4.14 Infor mation on Measurement Modes As far as con ventiona l compo nents with lead c onnec tions are …

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6 Vision functions User Manual HS-50
6.6 Test Component Software Version SR.501.xx 12/99 Issue US
288
t IIt
Measuring mode menu 6
Click on the ’Measuring mode’ field to call up the Measuring mode menu. 6
6
Fig. 6.6 - 34 Test component menu, Meas. mode option
– In the left column of the box, the desired measuring method can be activated or deactivated
by clicking with the mouse. A cross indicates that you have activated the measuring method.
The ‘Setting' field for calling up the sub-menu changes from grey to black.
Use the ‘Hex input’ field to call up the ‘Measuring mode 2’ input menu for directly entering hex
values. Please follow the instructions on page 287
.
Å Select ‘Accept’ to close the ‘Measuring mode’ menu. The modified measuring conditions will
be entered into the package form file on the station computer.
Å Select ‘Abort’ to interrupt the operation without transferring the data and to return to the ‘Test
component’ menu.
User Manual HS-50 6 Vision functions
Software Version SR.501.xx 12/99 Issue US 6.6 Test Component
289
t IIt
6.6.4.14 Information on Measurement Modes
As far as conventional components with lead connections are concerned, component centering is
essentially based on four measurement methods used to determine the position (X and Y-coordi-
nates, Φ = skew) of the component and the lead parameters: 6
– Size mode
– Row mode
– Corner mode
– Lead mode
For BGAs (B
all Grid Arrays) and flip-chips new algorithms have been implemented in order to de-
termine the position (X and Y-coordinates, Φ = skew) of the component and the ball parameters
(see Section 6.6.4.4
on page 263 ): 6
– Grid mode
– Ball mode
In accordance with your specifications any measurement method can be omitted from this se-
quence. However, it is not possible to change the way this sequence runs. 6
Definition of the measuring methods 6
– Size
This measurement method has been especially developed for small components. On the basis
of the information on dimension parameters the position and rotation of small components is
determined rapidly and reliably.
This method is very resistant to unwanted intrusive elements such as ink markings.
The size mode also employs profiling. You can have the profile formed along either the width
or
the length of the component. You should make your choice within the options field. The de-
fault selection is for profiling along the longer side.
– Row
This measurement method is based on information from one row of leads.
This method is very fast and supplies approximate values for the coordinates and rotational
angle of the component.
– Corner (Component inspection)
The measurement results provide precise information on the coordinates and rotation of the
component, the number of leads, the pitch and the row offset.
This method is not sensitive to fluctuations in the lead dimensions.
– Lead (Leads inspection)
This method is used to obtain information from an inspection of every single lead.
6 Vision functions User Manual HS-50
6.6 Test Component Software Version SR.501.xx 12/99 Issue US
290
t IIt
The following combinations of measurement methods are used: 6
– Size — corner — lead (see table in Section 6.6.4.15
) or
– Row — corner — lead (see table in Section 6.6.4.15
)
– Grid (component inspection with the 80F
4
or 80F
5
machines)
The measurement results will provide information on the approximate coordinates and approx-
imate rotation of the component. In addition, you will be informed of the quality of measure-
ment.
– The measurement results will provide precise information on the approximate coordinates and
approximate rotation of the component. In addition, you will be informed of the maximum ball
offset and the quality of measurement.
6.6.4.15 Recommendations regarding the Optimum Sequence of Measurement Methods
The following table contains our recommendations for the optimum sequence of measurement
methods for particular components. The following abbreviations are used: 6
B = ball C = corner G = grid
L = lead R = row S = size
*)
L applies to irregularly shaped components with separate windows 6
Component
Measurement sequence
S R G C L B
MELF S L
CHIP S L
SOT S C L
SL
SOJC6 S C
SOJC14 R C
LCC R C L
PLCC R C L
QFP R C L
TAB R C L
*)
BGA, flip-chip S G B
Bare dies S