ysm20r_cabpara - 第22页

28 1 1. Specications YSM20R (SESMK18400-00) v2.001 1 1 .2 Moun ting c apabilit y YSM20R-2 (2Head) High-speed multi- purpose (HM) head x 2 T ype PV : 95,000CPH (0.038 sec / CHIP) * Y AMAHA optimal conditions * Compatibil…

11. Specications

YSM20R (SESMK18400-00) v2.001

Environmental

conditions

Temperature Function assurance : 15 to 35°C

Accuracy assurance : 20 to 28°C

Humidity Allowable range : 20 to 80% (No condensation)

Optimal range : 50 to 60%

* Keep a humidity of approx. 40% or more as static electricity prevention measures.

* When using an industrial humidifier, use water equivalent to DI water.

Transient voltage

category

category III

Pollution degree

degree 2

Atmosphere There shall be no dirt and dust.

There shall be no organic solvent vapor, sulfurous acid gas, chlorine gas, and flammable

gas.

Altitude 1,000 m or less above sea level

* This avoids that the air pressure or cosmic ray adversely affects the insulation

performance.

Installation floor

conditions

The floor withstanding load capacity shall be approx. 850kg / m

* For the floor withstanding load capacity, consult the specialists who know the installation

place well with the information on equipment weight, floor sharing area, and adjuster foot

positions.

* The floor shall be flat and have sufficient strength so that it does not vibrate during

operation. The floor shall have the concrete strength or its equivalent.

In particular, wooden floor, office floor, and grating are not allowed to use.

* If the floor is not concrete, consult the specialists who know the installation place well and

construct the reinforcement work for the portions where the equipment adjuster feet are

placed.

* When the feeder exchange carriage is shared by different machine models, a flatness of

10mm or less is required for the floor installation areas of all target equipment.

Ambient noise There shall be no significant noise.

Equipment warning beep should be heard without fail.

Ambient light Strong light such as sunlight does not enter the vision system

(optical image processing system).

Noise immunity See "10.7 CE marking".

Noise emission See "10.7 CE marking".

Board

transport

height

900mm ± 10mm (From the floor surface to the upper surface of the conveyor belt)

Input data Number of

mounting points

12,800 points (Note that the number of mounting points decreases depending on the

number of boards, the number of blocks, or the number of fiducial marks.)

Component

types

255 types / board

Board data 100 MB / unit

Number of

fiducial marks

128 sets / board

Data entry

method

Data entry unit supplied with the machine main unit

Positioning

resolution

X-axis / Y-axis /

Z-axis

0.001mm

R-axis 0.001°

External

interface

LAN*, 1 port (See "7.5 Network" and "7.6 Anti-virus measures".)

Internal

memory

Built-in 4GB flash card *, 1 pc.

* For storage of files, such as OS, mounter application software, board data, component data,

vision data, machine information, and production history information, etc.

External

memory

USB flash memory with a capacity of 8GB or more *, 1 pc.

(Supplied as standard accessory : For data backup)

11. Specications

YSM20R (SESMK18400-00) v2.001

11.2 Mounting capability

YSM20R-2 (2Head) High-speed multi- purpose (HM) head x 2

Type PV : 95,000CPH (0.038 sec / CHIP) * YAMAHA optimal conditions

* Compatibility with sATS30NS, Nonstop feeder exchange system. 0201 or more component

correspondence. Scan camera □ 12 mm specification.

Type SV : 90,000CPH (0.040 sec / CHIP) * YAMAHA optimal conditions

* Not compatibility with sATS30NS, Nonstop feeder exchange system. 03015 or more component

correspondence. Scan camera □ 8 mm specification.

The mounting capability when using the customer's boards and components can be estimated (calculated) by

using the following tools. Consult with YAMAHA for details.

-1- Simple tact simulation program

-2- YAMAHA SMT line support software Y.FacT / P-Tool

11.3 Mounting accuracy

When using YAMAHA standard components for evaluation, test board, and two-faced adhesive tape.

CHIP components ± 0.035mm (± 0.025mm) Cpk

≧

1.0 (3σ)

QFP components ± 0.035mm (± 0.025mm) Cpk

≧

1.0 (3σ)

11.4 Applicable components

Components for which normal mounting can be expected when all conditions are good

The mounting capability of this machine is significantly affected not only by the machine performance, but

also by various conditions such as the components and boards. Determining whether or not a given

component can be mounted requires a test operation with an actual sample of the component in question.

Some guidelines for Applicable components are given in the table below.

(Factors which determine whether or not a component can be used include the following: electrode lead's

bend, lift and optical surface condition, ball electrode's deformation and height variations, background color,

glossiness condition, component's weight, pickup nozzle's contact surface condition, and board warp, etc.)

Component type Typical component size Remarks

Square chip components

Cylindrical chip components

Mini-mold transistors

Power transistors

Aluminum electrolytic capacitors,

etc.

0.2 x 0.1mm to 12 x 12mm

* For Type SV, 0.3 x 0.15 mm or more component

correspondence.

Lead electrode components

(SOP, SOJ, QFP, etc.)

5 x 4.5mm to 20 x 20mm

Minimum lead pitch : 0.4mm or less

(0.22mm gap for a reference lead width of 0.18mm)

20 x 20mm to 32 x 32mm

Minimum lead pitch : 0.5mm or less

(0.28mm gap for a reference lead width of 0.22mm)

32 x 32mm to 55 x 55mm

Minimum lead pitch : 0.65mm or less

(0.35mm gap for a reference lead width of 0.30mm)

Ball electrode components (BGA,

etc.)

* Consult us for CSP with micro-ball

electrodes.

Up to 20 x 20mm

Reference : Minimum ball diameter is 0.18mm or larger

Reference : Minimum ball pitch is 0.3mm or larger

20 x 20mm to 32 x 32mm

Reference : Minimum ball diameter is 0.22mm or larger

Reference : Minimum ball pitch is 0.37mm or larger

32 x 32mm to 55 x 55mm

Reference : Minimum ball diameter is 0.30mm or larger

Reference : Minimum ball pitch is 0.5mm or larger

Odd-form components such as

connectors, etc.

Up to 55 x 100mm Consult us for each component.

* When handling components with a size exceeding 12 x 12mm and a thickness exceeding 6.5mm, the HM

head requires a multi-view camera (option).

* The FM head can be used with a multi-view camera (standard).

11. Specications

YSM20R (SESMK18400-00) v2.001

11.5 Component height & mounting restrictions

11.5.1 Height of mountable components

The following describes the height of the components that can be mounted (on the upper side of the board).

High-seed multi (HM) head : 15mm or less

Flexible multi (FM) head : 28mm or less

11.5.2 Mounting restrictions

The correct mounting may not be established according to the relationship between the component size /

height and the nozzle shape.

* In the figure below, since the virtual component (L) is located on the outside of the range I, the correct

mounting is established. If this component is located on the inside of the range, interference may occur.

* In the figure below, since the virtual component (T) is located on the outside of the range II, the correct

mounting is established. If this component is located on the inside of the range, interference may occur.

* An area where any component cannot be mounted may arise around the components that have already

been mounted before carrying into this machine in the same manner as described in the figure below.

* The component presence is not permitted in an area of 3mm from both ends in the transport direction.

support system, programming tool "P-Tool", is prepared to take measures against restrictions on

mounting, such as possibility of interference as described above. Please order this tool. See "3.

Arrangements / -4- Support systems".

HM Head

Range II (Zone where interference may occur)

Range II Diameter of 8mm

Range II : Height of 7.5mm

Range I : Height of 3mm

Max. buffing stroke of 1.5mm

Range I (Zone where interference may occur)

Range I Diameter of 4mm

Head shaft

Nozzle

type 301A

type 302A

type 303A

type 310A

type 311A

type 312A

type 313A

Board face

15mm or less

Virtual component (T)

Mounting

component

Virtual

component (L)

(Max. permissible component height)

type 314A