ysm20r_cabpara - 第23页

29 1 1. Specications YSM20R (SESMK18400-00) v2.001 1 1 .5 Component height & mounting r estric tions 1 1.5.1 Height of mountable component s The following describes the height of the compone nts that can be mounted …

11. Specications

YSM20R (SESMK18400-00) v2.001

11.2 Mounting capability

YSM20R-2 (2Head) High-speed multi- purpose (HM) head x 2

Type PV : 95,000CPH (0.038 sec / CHIP) * YAMAHA optimal conditions

* Compatibility with sATS30NS, Nonstop feeder exchange system. 0201 or more component

correspondence. Scan camera □ 12 mm specification.

Type SV : 90,000CPH (0.040 sec / CHIP) * YAMAHA optimal conditions

* Not compatibility with sATS30NS, Nonstop feeder exchange system. 03015 or more component

correspondence. Scan camera □ 8 mm specification.

The mounting capability when using the customer's boards and components can be estimated (calculated) by

using the following tools. Consult with YAMAHA for details.

-1- Simple tact simulation program

-2- YAMAHA SMT line support software Y.FacT / P-Tool

11.3 Mounting accuracy

When using YAMAHA standard components for evaluation, test board, and two-faced adhesive tape.

CHIP components ± 0.035mm (± 0.025mm) Cpk

≧

1.0 (3σ)

QFP components ± 0.035mm (± 0.025mm) Cpk

≧

1.0 (3σ)

11.4 Applicable components

Components for which normal mounting can be expected when all conditions are good

The mounting capability of this machine is significantly affected not only by the machine performance, but

also by various conditions such as the components and boards. Determining whether or not a given

component can be mounted requires a test operation with an actual sample of the component in question.

Some guidelines for Applicable components are given in the table below.

(Factors which determine whether or not a component can be used include the following: electrode lead's

bend, lift and optical surface condition, ball electrode's deformation and height variations, background color,

glossiness condition, component's weight, pickup nozzle's contact surface condition, and board warp, etc.)

Component type Typical component size Remarks

Square chip components

Cylindrical chip components

Mini-mold transistors

Power transistors

Aluminum electrolytic capacitors,

etc.

0.2 x 0.1mm to 12 x 12mm

* For Type SV, 0.3 x 0.15 mm or more component

correspondence.

Lead electrode components

(SOP, SOJ, QFP, etc.)

5 x 4.5mm to 20 x 20mm

Minimum lead pitch : 0.4mm or less

(0.22mm gap for a reference lead width of 0.18mm)

20 x 20mm to 32 x 32mm

Minimum lead pitch : 0.5mm or less

(0.28mm gap for a reference lead width of 0.22mm)

32 x 32mm to 55 x 55mm

Minimum lead pitch : 0.65mm or less

(0.35mm gap for a reference lead width of 0.30mm)

Ball electrode components (BGA,

etc.)

* Consult us for CSP with micro-ball

electrodes.

Up to 20 x 20mm

Reference : Minimum ball diameter is 0.18mm or larger

Reference : Minimum ball pitch is 0.3mm or larger

20 x 20mm to 32 x 32mm

Reference : Minimum ball diameter is 0.22mm or larger

Reference : Minimum ball pitch is 0.37mm or larger

32 x 32mm to 55 x 55mm

Reference : Minimum ball diameter is 0.30mm or larger

Reference : Minimum ball pitch is 0.5mm or larger

Odd-form components such as

connectors, etc.

Up to 55 x 100mm Consult us for each component.

* When handling components with a size exceeding 12 x 12mm and a thickness exceeding 6.5mm, the HM

head requires a multi-view camera (option).

* The FM head can be used with a multi-view camera (standard).

11. Specications

YSM20R (SESMK18400-00) v2.001

11.5 Component height & mounting restrictions

11.5.1 Height of mountable components

The following describes the height of the components that can be mounted (on the upper side of the board).

High-seed multi (HM) head : 15mm or less

Flexible multi (FM) head : 28mm or less

11.5.2 Mounting restrictions

The correct mounting may not be established according to the relationship between the component size /

height and the nozzle shape.

* In the figure below, since the virtual component (L) is located on the outside of the range I, the correct

mounting is established. If this component is located on the inside of the range, interference may occur.

* In the figure below, since the virtual component (T) is located on the outside of the range II, the correct

mounting is established. If this component is located on the inside of the range, interference may occur.

* An area where any component cannot be mounted may arise around the components that have already

been mounted before carrying into this machine in the same manner as described in the figure below.

* The component presence is not permitted in an area of 3mm from both ends in the transport direction.

support system, programming tool "P-Tool", is prepared to take measures against restrictions on

mounting, such as possibility of interference as described above. Please order this tool. See "3.

Arrangements / -4- Support systems".

HM Head

Range II (Zone where interference may occur)

Range II Diameter of 8mm

Range II : Height of 7.5mm

Range I : Height of 3mm

Max. buffing stroke of 1.5mm

Range I (Zone where interference may occur)

Range I Diameter of 4mm

Head shaft

Nozzle

type 301A

type 302A

type 303A

type 310A

type 311A

type 312A

type 313A

Board face

15mm or less

Virtual component (T)

Mounting

component

Virtual

component (L)

(Max. permissible component height)

type 314A

11. Specications

YSM20R (SESMK18400-00) v2.001

FM Head

Max. buffing stroke of 1.5mm

Range II Diameter of 19mm

Range I Diameter of 8mm

Range I : Height of 6.5mm

Range II : Height of 10mm

Diameter of 5mm

3mm

28mm or less

Virtual

component（L)

Virtual component（T)

Mounting

component

（

Max. permissible component heigh

）

Board face

Head shaft

Nozzle

type 311A

type 312A

type 313A

type 314A

type 301A

type 302A

type 303A

type 310A

11.6 Component mounting restrictions

W (width) direction

L (length) direction

Spacing between

adjacent components

Mountable components

("mm" size)

Spacing between adjacent components

Standard 30X nozzles Standard 31X nozzles

0603 square chips

(L0.6 x W0.3mm)

301A nozzle 0.35mm or more

311A nozzles W-direction 0.15mm or more

1005 square chips

(L1.0 x W0.5mm)

312A nozzles W-direction 0.15mm or more

* The above values apply under YAMAHA standard conditions

(when using YAMAHA standard evaluation test board, standard components, and two-faced adhesive

tape).

* The above values may not be obtained depending on the shapes and dimensions of tape reels and

components.

* A mounting space smaller than those shown above requires a custom nozzle (consult us).