ysm20r_cabpara - 第36页
42 12. General specications YSM20R (SESMK18400-00) v2.001 12.9.2 Scan camer a (standar d for HM head) Item Remarks System Scan camera (with coaxial lighting) Camera position HM head Bottom side of head Field of vie w 18…
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12. General specications
YSM20R (SESMK18400-00) v2.001
12.9 Vision system (image recognition)
The vision system shown in the table below is used to recognize components and board marks.
The number of vision systems and their arrangement can be set according to the size of components to be
mounted and electrical specifications, etc. Select the setting using Fiducial camera / Multi-view camera in
"1. Machine Configuration".
* Actual component mounting is affected by other factors in addition to the image recognition capability.
Determining whether or not a given component can be mounted requires a test operation with an actual
sample of the component in question.
12.9.1 Fiducial camera
Item Remarks
System Fiducial camera
Camera position
YSM20R-2
Right side of front head
Left side of front head
Right side of rear head
Left side of rear head
YSM20R-1
Right side of head
Left side of head
Fieldof view 8 x 8mm
Application Fiducial mark detection, bad mark detection, teaching
Mark shape
Round mark 0.5 to 2mm dia. (YAMAHA recommended), square 0.5 to 2mm, diamond-shaped
0.5 to 2mm.
The mark surface must not be scratched or soiled.
The contrast between the mark and the background board must be adequate (clear contrast).
Either of the mark and background can be reflective.
Mark surface Copper foil, gold plating, solder leveler
Background material
Glass fiber reinforced epoxy resin boards are ideal.
* When using ceramic or polyimide boards (flexible types), check to see if they are appropriate.
Detection area
The detection area dimensions must be within the field-of-view range, and specified by entering
their numeric values. (This minimizes wasted vision processing time.)
Scan range
Within an area of 0.2mm from the outer edge of the mark, there must be no resist, silk
printing, thru-holes, or any pattern with the same optical characteristics as the mark.
The mark to be scanned must be the only unique shape in the detection area.
* Specify the detection area so that it contains no similar shapes.
Mark layout
2 points or 4 points on board. It is preferable that the marks are located on the diagonal
line.
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12. General specications
YSM20R (SESMK18400-00) v2.001
12.9.2 Scan camera (standard for HM head)
Item Remarks
System Scan camera (with coaxial lighting)
Camera position HM head Bottom side of head
Field of view 18 x 18mm, Width 6mm (Side)
Application Component recognition
Maximum recognizable
size
12 x 12mm * For Type SV, 8 x 8 mm
Minimum recognizable
size
0201 square chip components ("mm" size)
Allowable component
height
6.5mm
Recognizable lead pitch 0.4mm or more
12.9.3 Multi-view camera (standard for FM head / option for HM head)
Item Remarks
System
Multi-view camera
* In addition to detecting whether ball electrodes exist or not, the camera also detects whether
they are good or not by side lighting provided as standard.
Camera position
Front right side of conveyor system
Front right side of rear conveyor system
Field of view 50mm
Application Component recognition
Maximum recognizable
size
55 x 100mm
* Consult us for odd-form components such as long connectors.
* Recognition of components larger than 45mm sq. is available by Split recognition.
Minimum recognizable
size
03015 square chip component ("mm" size)
Allowable component
height
HM head 15mm or less
FM head 28mm or less
Recognizable lead pitch 0.3mm or more
Ball electrode size for
present/absent judgment
φ
0.1mm or more
Ball electrode size for
pass/fail judgment
φ
0.15mm or more
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12. General specications
YSM20R (SESMK18400-00) v2.001
12.9.4 Multi-view camera with coplanarity checker (option)
Item Remarks
System
Multi-view camera with coplanarity checker
* Component recognition performance is the same as that of the multi-view camera
(in 12.9.3) excep for the coplanarity checker function.
Camera position Installed in the multi-view camera for component recognition
Field of view 50mm
Application
Detection of variations in the height direction of multiple row lead electrodes and ball
electrodes, that is, the detection of lead coplanarity and linearity. Also called lead float
inspection.
Maximum recognizable
size
45 x 45mm
Allowable component
height
HM head 15mm or less
FM head 28mm or less
Coplanrity detection
accuracy
± 0.025mm
Recognizable lead pitch 0.3mm or more
Recognizable lead width 0.12mm or more
Recognizable ball
electrode
φ
0.25mm or more
12.9.5 Side-view camera
Item Remarks
System Side-view camera
Camera position
HM head Installed in the scan camera
FM head Bottom side of head
Application
Front and back side check for lead components (mini-mold transistors, two-terminal diodes,
etc.) with 1.2mm or less thickness
Pickup error detection, soiled nozzle detection, component release check
Maximum recognizable
size
3.2 x 3.2mm
Allowable component
height
1.2mm or less