ysm20r_cabpara - 第54页
60 12. General specications YSM20R (SESMK18400-00) v2.001 12.1 5 Recov ery pallet Sticky Sheet Area 332 (sticky area) 246 (sticky area) This pallet is used to collect defective compone nts detected by the image recognit…
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12. General specications
YSM20R (SESMK18400-00) v2.001
Allowable component height <tray + component> (Common cATS10, sATS30 and sATS30NS)
When pallet pitch is 12.5mm => 8.5mm or less
8.5 or Less
12.5
12.5
12.5
Tray
Component
Pallet Pitch
(Step in Rack)
5
When pallet pitch is 25mm => 20mm or less
* Height must be 15mm or less when HM heads are used.
20 or Less
25
Tray
Component
25
15 or Less
Pallet Pitch
(Step in Rack)
5
When pallet pitch is 37.5mm => 32mm or less
* This applies only to FM heads.
37.5
37.5
32.0 or Less
5
Component
Tray
28 or Less
Pallet Pitch
(Step in Rack)
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12. General specications
YSM20R (SESMK18400-00) v2.001
12.15 Recovery pallet
Sticky Sheet Area
332 (sticky area)
246 (sticky area)
This pallet is used to collect defective components detected by the image recognition system without
discarding them. One recovery pallet can be set per magazine rack. Note that this reduces the number of
pallets used for component supply.
An adhesive resin sheet attached on the surface of the recovery pallet temporarily holds the components that
were returned and placed on the recovery pallet.
Default setting for the number of components that can be collected: 18
The components like those shown below will not be collected, because it is difficult to hold them on the
adhesive sheet on the recovery pallet.
PGA
EP-ROM
Protruding part
Center of gravity
Center of gravity >
H
H
2
The graph and table on the next page show a general guide for components that can be collected or not. This
mainly depends on the component weight and the area that makes contact with the adhesive sheet.
Recoverable component size:
⇒
5 x 5mm to 45 x 45mm *
* A setting change is required for components larger than this. A setting to accommodate larger components
will reduce the number of components which can be recovered.
Recoverable component height:
⇒
H8.5mm or less (pallet pitch of 12.5mm)
H15mm or less (pallet pitch of 25mm)
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12. General specications
YSM20R (SESMK18400-00) v2.001
Relationship of component's weight and the amount of area which contacts the sticky sheet
PGA
Connector Relay
EP-ROM
Not recoverable
Recoverable
Component's amount of
area contacting the sticky
sheet
（
mm
2
）
Weight of recovered
component (g)
PLCC
H
X
Y
Y
Y
Y
X
X
X
H
H
H
PGA
5
5
0
10
15
20
25
30
10 15 20
EP-ROM
Relay
Connector
QFP(208-pin)
BGA(292-pin)
QFP(208-pin)
Compatible
component
examples
Component
name
X(mm) Y(mm)
Height H
(mm)
Weight (g)
Contact area
(mm
2
)
Remarks
PLCC 30.0 30.0 4.3 6.8 21.0
Relay 18.8 12.8 14.2 8.7 23.0 See figure above.
QFP208pin 30.6 30.6 4.1 5.5 21.0
BGA292pin 27.0 27.0 2.2 2.7 17.9
Connector 22.5 3.5 5.8 0.8 15.4 See figure above.
QFP100pin 24.7 18.7 2.9 1.7 10.0
Incompatible
component
examples
Component
name
X(mm) Y(mm)
Height H
(mm)
Weight (g)
Contact area
(mm
2
)
Remarks
PGA 25.0 25.0 8.2 5.8 2.4 See figure above.
EP ROM 35.7 14.7 7.1 8.8 3.9 See figure above.