A10011-ASM-T53-EN-Spec-TX-micron-DMS - 第23页

23 SIPLACE Vision Cracked Die and Chipping Inspection Crack Die Detection The cracked die inspection can detect breaks befo re removal from the tape, if the crack runs between tw o outer edge s of the die. Inspection is …

SIPLACE Vision

OnBoard Inspection and Pattern Matching

OnBoard Inspection

The OnBoard PCB Inspec-

tion (SW option) uses the

PCB camera to inspect criti-

cal areas of the board, spec-

ified by the user, e.g. under

BGA or shields just before or

after placement, to make

sure that all components

were placed or to make sure

that there are no objects in

the way of the placement

process.

It is also possible to inspect

the solder paste to make

sure that it is present. How-

ever, this must always be

performed at the first place-

ment machine, before place-

ment begins.

A requirement for all inspec-

tion tasks is that a "good pat-

tern" has been saved before

starting.

Pattern Matching

Pattern matching can be

used for components with

very fine contact pads, which

can not be detected with the

existing component camera

resolution. Searching and

detection is performed over a

larger area, which contains

unique structures (patterns).

Once the specified area has

been detected, the compo-

nent is aligned and placed

according to the position of

this area and in relation to the

substrate.

SIPLACE Vision

Cracked Die and Chipping Inspection

Crack Die Detection

The cracked die inspection

can detect breaks before

removal from the tape, if the

crack runs between two

outer edges of the die.

Inspection is performed

with the PCB camera. A

prerequisite for detection is

that the two parts of the die

are slightly inclined towards

one another. Detection is

possible via the differing

reflection angles of the two

surfaces which are inclined

towards one another.

Chipping Detection

Chipping detection allows

you to recognize chipped

areas on semiconductor

components.

Good

Bad

SIPLACE Vision

PCB position recognition

Fiducial criteria

Locate 2 fiducials

Locate 3 fiducials

X-/Y-position, rotation angle, mean PCB distortion

Additional: shearing, distortion separately in X and Y direc-

tion

Fiducial shapes Synthetic fiducials: circle, cross, square, rectangle, dia-

mond, circular, square and rectangular contours, double

cross, pattern: any

Dimensions of patterns

Min. size

Max. size

0.5 mm

3 mm

Fiducial environment Clearance around reference fiducial not necessary if there

is no similar fiducial structure in the search area

Dimensions of synthetic fiducials

Min. X/Y size for circle

and rectangle 0.25 mm

Min. X/Y size for annulus and rectangle 0.3 mm

Min. X/Y size for cross 0.3 mm

Min. X/Y size for double cross 0.5 mm

Min. X/Y size for diamond 0.35 mm

Min. frame width for annulus and rectangle 0.1 mm

Min. bar width / bar distance for cross, double-cross 0.1 mm

Max. X/Y size for all fiducial shapes 3 mm

Max. bar width for cross/double-cross 1.5 mm

Minimum tolerances generally 2% of nominal dimension

Max. tolerances generally 20% of nominal dimension

a) To ensure high production quality of printed circuit boards, a minimum x/y size of 0.075 mm is permitted

for circular fiducials under the following conditions:

There are no other objects with a size of + 0.2 mm which are visible in the rectangular fiducial search

area. Example: Circular fiducials with an x/y size of 0.075 mm need a search area without visible objects

of: 0.075 mm + 0.2 mm = 0.275 mm.