A10011-ASM-T53-EN-Spec-TX-micron-DMS - 第8页

8 Placement heads SIPLACE SpeedStar (C&P20 M2) SIPLACE SpeedS t ar (C&P20 M2) With compone nt camera type 48 (St andard) With compo nent camera type 4 9 (Optional) Component range a a) Please note that the placea…

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Machine performance
Placement head types SIPLACE SpeedStar (C&P20 M2)
SIPLACE MultiStar (CPP M)
Placement performance
The placement performance is influenced by the different head combinations and head positions, plus the con-
veyor configurations. Individual options and customized applications also influence the placement perfor-
mance. On request, ASM can calculate the actual performance of your product on your machine configuration.
IPC value [components/h]
Conducted with 0402 components, in accordance with the layout of the IPC 9850 standard of Association Con-
necting Electronics Industries.
SIPLACE benchmark value [components/h]
The SIPLACE benchmark value is measured during the machine acceptance tests. It corresponds to the condi-
tions set out in the ASM scope of service and supply.
SIPLACE TX2i micron placement
machine
Placement area IPC value Benchmark value
Placement accuracy 25 µm (3σ) C&P20 M2 / C&P20 M2 62,500 78,000
CPP M_L / CPP M_L 43,000 48,000
C&P20 M2 / CPP M_L 52,500 62,500
Placement accuracy 20 µm (3σ) C&P20 M2 / C&P20 M2 56,000 71,000
CPP M_L / CPP M_L 39,500 47,000
C&P20 M2 / CPP M_L 47,500 59,000
Placement accuracy 15 µm (3σ) C&P20 M2 / C&P20 M2 -- 64,000
SIPLACE TX2 micron placement
machine
Placement area IPC value Benchmark value
Placement accuracy 25 µm (3σ) C&P20 M2 / C&P20 M2 61,000 75,000
CPP M_L / CPP M_L 40,000 46,500
CPP M_H / CPP M_H 38,000 44,500
C&P20 M2 / CPP M_L 50,000 60,500
C&P20 M2 / CPP M_H 49,000 59,500
Placement accuracy 20 µm (3σ) C&P20 M2 / C&P20 M2 54,500 68,500
CPP M_L / CPP M_L 36,500 44,000
CPP M_H / CPP M_H 35,000 42,000
C&P20 M2 / CPP M_L 45,500 56,000
C&P20 M2 / CPP M_H 44,500 55,000
Placement accuracy 15 µm (3σ) C&P20 M2 / C&P20 M2 -- 61,500
CPP M_H = Multistar CPP M in high assembly position
CPP M_L = Multistar CPP M in low assembly position
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Placement heads
SIPLACE SpeedStar (C&P20 M2)
SIPLACE SpeedStar (C&P20 M2)
With component
camera type 48
(Standard)
With component
camera type 49
(Optional)
Component range
a
a) Please note that the placeable component range is also affected by the pad geometry, the customer-
specific standards, the component packaging tolerances and the component tolerances.
0.12 mm x 0.12 (0201 metric) to 2220, Melf, SOT, SOD, Bare-
Die, Flip-Chip
Component spec.
Max. height
Min. lead pitch
Min. lead width
Min. ball pitch
Min. ball diameter
Min. dimensions
Max. dimensions
Max. weight
4 mm
70 µm
30 µm
100 µm
50 µm
120 µm x 120 µm
6 mm x 6 mm
1 g
4 mm
b
50 µm
25 µm
50 µm
25 µm
80 µm x 80 µm
6 mm x 6 mm
1 g
b) Due to the small focus area of ±0.3 mm, this camera is only recommended if its specific camera resolu-
tion is required for the components. The nozzle length must be adjusted in accordance with the focus
area and component thickness. The maximum component size which can be used is still 6 mm x 6 mm.
Set-down force Touchless Placement, 0.5 N, 1 N to 4.5 N
Nozzle types 40xx 40xx
X/Y accuracy
c
With "accuracy class"
d
Without "accuracy class"
c) The benchmark and accuracy values are measured during the machine acceptance tests and corre-
spond to the conditions set out in the ASM scope of service and supply.
d) Setting in SIPLACE Pro Component Shape Editor
± 15 µm/3σ
e
± 20 µm/3σ
± 20 µm/3σ
e) Only with SIPLACE TX2i micron 15µm accuracy class
± 15 µm / 3σ
e
± 20 µm/3σ
± 20 µm/3σ
Angular accuracy ± 0.3° / 3σ
f
± 0.2° / 3σ
g
f) For SIPLACE TX micron with accuracy class 25 µm
g) For SIPLACE TX micron with accuracy class 20 µm or SIPLACE TX2i micron 15µm
± 0.3° / 3σ f
± 0.2° / 3σ
g
Illumination levels 5 5
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Placement heads
SIPLACE MultiStar (CPP M)
SIPLACE MultiStar (CPP M)
With component camera type 45
Component range
a
a) Please note that the placeable component range is also affected by the pad geometry, the customer-
specific standards, the component packaging tolerances and the component tolerances.
01005 to 15 mm x 15 mm
Component spec.
Max height
b
Max. height
c
Min. lead pitch
Min. lead width
Min. ball pitch
Min. ball diameter
Min. dimensions
Max. dimensions
Max. weight
b) CPP M head: in low installation position
c) CPP M head: in high installation position
6.0 mm
8.5 mm
250 µm / 120 µm
d
50 µm
140 µm
70 µm
0.11 mm x 0.11 mm
15 mm x 15 mm
4 g
d) Only available for components which are within the camera range of focus: ± 1.3 mm.
Set-down force 1.0 - 15 N
Nozzle types 20xx, 28xx
X/Y accuracy
e
With "accuracy class"
f
Without "accuracy class"
e) The benchmark and accuracy values are measured during the machine acceptance tests and corre-
spond to the conditions set out in the ASM scope of service and supply.
f) Setting in SIPLACE Pro Component Shape Editor
± 20 µm/3σ
± 25 µm/3σ
Angular accuracy ± 0.18° / 3σ
Illumination levels 5