SIPLACE D4 规格说明书英文版 - 第23页

23 Digital Vision System Checking the Component Quality Flipped component s Upright compon ents Poor component quality Vision Teach menu at the sta tion SIPLACE vision algorithms help with th e detection of • flippe d co…

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Digital Vision System
The digital SIPLACE vision
system guarantees extremely
fast and reliable component
recognition, while being very
simple to use. The system
identifies each individual
component from its shape
and color. Even complex
component shapes, such as
flip-chip or CCGA are
detected extremely reliably.
The system is not only used
in the placement head cam-
eras; it can also be found in
the PCB camera. As well as
ensuring that components
are detected accurately, it
also ensures reliable recogni-
tion of the ink spots and PCB
fiducials.
The benefits at a glance:
• Extremely fast and reliable
component recognition
• Shortest cycle times
• Robust measurement with
reference to the shape and
color
• Straightforward program-
ming
• Offline programming of
component shapes
• Rapid introduction of new
products (NPI)
• Open architecture allows
you to quickly adapt to
new requirements
• Optimum placement
results through individual
measurement of each
component
Examples of digital vision system analysis times
01005 9 ms
PLC44 17 ms
BGA 225 balls 18 ms
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Digital Vision System
Checking the Component Quality
Flipped components Upright components
Poor component quality
Vision Teach menu at the station
SIPLACE vision algorithms
help with the detection of
• flipped components
•upright components
• poor component quality
The digital SIPLACE vision
system automatically saves
the last 500 images of com-
ponents that were identified
as "bad". SIPLACE users can
then easily demonstrate poor
component quality.
The benefits at a glance:
• Maximum placement
quality
• High first pass yield
• Reduced operating costs
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Vision Sensor Technology
PCB Position Recognition
Description
Different fiducial shapes
prove to be optimal depend-
ing on the condition of the
surface. Particularly advis-
able for bare copper surfaces
with little oxidation is the
single cross. Maximum accur-
acy is achieved due to the
high information content.
Rectangle, square and circle
are less "informative" but
save space and can even be
used when oxidation is at an
advanced stage. Advisable
for tinned structures are
circle or square because in
this case the ratio of the fidu-
cial dimensions to the presol-
der thickness is particularly
favorable.
Fiducial criteria
Locate 2 fiducials
Locate 3 fiducials
X-/Y-position, rotation angle, mean PCB distortion
in addition: shear, distortion in X- and Y-direction separately
Fiducial shapes Synthetic fiducials: circle, cross, square, rectangle, rhombus,
circular, square, and rectangular contours, double cross, any
pattern
Fiducial surface:
copper
tin
Without oxidation and solder resist
Fiducial warp 1/10 of structure width, both with good
contrast to environment
Dimensions of synthetic fiducials
min. X/Y size for circle and rectangle: 0.25 mm
min. X/Y size for annulus and rectangle: 0.3 mm
min. X/Y size for cross: 0.3 mm
min. X/Y size for double-cross: 0.5 mm
min. X/Y size for lozenge: 0.35 mm
min. frame width for annulus and rectangle: 0.1 mm
min. bar width / bar distance for cross, double-cross: 0.1 mm
max. X/Y size for fiducial shapes: 3 mm
max. bar width for cross / double-cross: 1.5 mm
min. tolerances, general: 2% of nominal dimension
max. tolerances, general: 20% of nominal dimension
Dimensions of patterns
min. size
max. size
0.5 mm
3 mm
Fiducial environment Clearance around reference fiducial not necessary if there is
no similar fiducial structure in the search area