00900002-01_UM_ASM-ProcessLens_EN - 第52页
3 Machine description 3.2 Technical data 52 Instruction Guide ASM ProcessLens 02/2017 3.2.3 Electrical Ratings Supply voltage Fuses Main power supply 1/N/PE Current rating: 110 V 1) - 9.1 A, 240 V - 4.2 A, 50/60Hz 2 x 1…
3 Machine description
3.2 Technical data
Instruction Guide ASM ProcessLens 02/2017 51
3.2 Technical data
3.2.1 Dimensions and Setup Conditions
Machine dimension
Length along PCB transport direction 1130 mm
Width 1300 mm
Height at a conveyor height of 950 mm 1600 mm
Machine weight 780 kg
Adjustable monitor and keyboard height range 880 - 1140 mm
Machine ground clearance
(for PCB conveyor height 900 mm) machine height is 1831 mm ± 15 mm
(for PCB conveyor height 930 mm) machine height is 1861 mm ± 15 mm
(for PCB conveyor height 950 mm) machine height is 1881 mm ± 15 mm
Room temperature Between 15°C and 35°C
Atmospheric humidity 30% to 75% (no higher than 45% on average to
prevent any possibility of condensation in the
machine)
Operating temperature range Between 0°C and 50°C
Operating humidity max. 50% at 40°C
Operating altitude max. up to 1000m sea level
Max. noise emissions 78 dB (A)
3.2.2 Center of Gravity
Fig.32: Center of gravity of the ASM ProcessLens solder paste inspection machine
1 550 mm 2 610 mm
3 730 mm
3 Machine description
3.2 Technical data
52 Instruction Guide ASM ProcessLens 02/2017
3.2.3 Electrical Ratings
Supply voltage Fuses
Main power supply 1/N/PE
Current rating: 110 V
1)
- 9.1 A, 240 V - 4.2 A, 50/60Hz
2 x 15 A
Power consumption 1 kW
Power supply 100 ~ 240 VAC, Single Phase 50/60 Hz
Power connector MENNEKES: 32 A 230 V 2 P+E STRAIGHT
3.2.4 Conveyor specifications
Load / unload time Less than 2.5 sec.
Conveyor height SMEMA
Conveyor communication interface Left to right
Right to left
3.2.5 PCB specifications
Minimum PCB size L x W - single conveyor 50 mm x 50 mm
Maximum PCB size L x W - single conveyor 610 mm x 560 mm
PCB thickness range 0.5 mm to 4.5 mm
Minimum PCB edge clearance 3 mm
Maximum PCB weight 3 kg
Underside PCB clearance 25 mm
3.2.6 Inspection capabilities
Pixel size (camera resolution) 15 μm x 15 μm
Inspection speed Up to 30 cm
2
/s
Height resolution 0.37 μm
Height accuracy on calibration target <= 2 μm
X/Y gantry accuracy < ±25 µm at 6 σ
3.2.7 Solder paste inspection capabilities
Measurement Shadow-free
Paste measurement functions Volume, area, height, X-and Y-offset, shape,
bridging, coplanarity
Maximum paste height 1000 μm
Minimum paste size 90 μm x 130 μm
Minimum paste pitch 75 μm
Height repeatability on solder paste <= 1 μm at ± 3 σ
Volume repeatability on solder paste <= 3 % at ± 3 σ
Area repeatability on solder paste <= 3 % at ± 3 σ
Gage Repeatability and Reproducibility (GRR) < 10 %
3.2.8 Program generation specifications
Program generation < 10 min.
Offline programming available
Supported Gerber formats RS-274X
1)
110 V~ as an option
4 Setting up and commissioning
4.1 Transport and delivery configuration
Instruction Guide ASM ProcessLens 02/2017 53
4 Setting up and commissioning
4.1 Transport and delivery configuration
4.1.1 Shipping packaging
The ASM ProcessLens machine will be shipped on a wooden pallet, packaged in plastic film, or in
a wooden crate.
4.1.1.1 Transporting environment condition
Temperature max. 70°C
Humility 60%
4.1.1.2 Shipping packaging dimensions
The dimensions of the pallets and wooden crates are listed in the following table:
Machine (L x W x H)
Wooden pallet 1850mm x 1500mm
Wooden crate 1850mm x 1500mm x 1850mm
Fig.33: Transport crate - dimensions in millimeters
1 Forklift attachment points
4.1.1.3 Weight of machine when ready for dispatch
The following table contains the weights of the machines prepared for dispatch, including pack-
aging.
Machine Dispatch on wooden pallet Dispatch on wooden crate
ASM ProcessLens 840 kg 940 kg