CM602 - 第4页
Comp onen t T ypes: Up to 2 16 ( 8 mm dou ble tap e fe eder ) © Copyright 2005, 2008 Panasonic Corporation of North America. All rights reserved. Changes may be made without notice to specifications and appearance for pro…
Head Options
High-speed 12 nozzle head
• Measures actual chip thickness
• Maintains constant placement force,
preventing chip
cracking
• Verifies chip
placement
Compact Feeder Cart
• 200 mm feeder cart
size decrease
• Compact cart
compatible with existing
feeder carts. Both cart
types can be used at
the same time.
*Installed high-speed software. NM-EJM8A is standard. NM-EJM4A is optional.
Maximum Speed (Type A-2)
0.036 s/chip 100,000 cph*
• New high-speed head (12 nozzles) provides
super high-speed placement of microchips
• Main body has space-saving small footprint
• 166% higher productivity than previous
generations
High-flexibility 8 nozzle head
• Measures actual chip thickness
• Updates part
library with
measured
thickness
• Allows for
multiple vendors
of the same
components
Area Productivity (Type A-2)
• 15,800 to 18,500 cph/m
2
Highly productive
and compact
Compact feeder cart increases
area productivity 17%
(optional)
Chip thickness
measuring sensor
(optional)
one platform
solution
for
world-class
manufacturing
A wide range
of options
400 mm
2,690 mm
2,290 mm
CM602-L with CM602-L with
existing feeder cart compact type
Placement Quality
Enhancement
High-speed POP placement
using transfer units (optional)
High-speed POP Placement
• Placement speed 0.65 s/chip
Mid-sized Large
Micro-chips Components Components
High-speed Head High-flexibility Head Multi-functional Head
(12 nozzles) (8 nozzles) (3 nozzles)
Board Warp Sensing
• The optimum placement height is controlled by
measuring board warp.
3D Sensor
• Detects all leads of components; i.e., QFP,
SOP, SOJ
• High-speed detection via batch scanning
• Detects solder ball position and measures ball
height
Ball lacking CSP
BGA.CSP
Batch transfer for 8 components by
high-flexibility heads (8 nozzles)
Transfer unit
Easy Maintenance
• Install and remove
squeegee and scraper
without tools
Machine Configuration
The most suitable module can be selected to place components from microchips to
odd-shaped components—depending on the products and production volume.
Board warp
measuring sensor
(optional)
3D sensor for high-quality
IC package placement
(optional)
CONFIGURATION TYPE 12 NOZZLES/12 NOZZLES 12 NOZZLES/8 NOZZLES 8 NOZZLES/8 NOZZLES 12 NOZZLES/3 NOZZLES 8 NOZZLES/3 NOZZLES 3 NOZZLES/3 NOZZLES
HEAD
COMBINATION
A TYPE A-2 TYPE A-1 TYPE A-0 — — —
B — — — — — TYPE B-0
C — — — TYPE C-1 TYPE C-0 —
TRAY
SUPPORT
ONE
SIDE
D — TYPE D-3 TYPE D-2 TYPE D-1 TYPE D-0 —
E — — — — — TYPE E-0
BOTH
SIDES
F — — TYPE F-2 — TYPE F-1 TYPE F-0
A wide range
of options
Tray Support
(optional)
Direct Tray
Feeder DT502-20
• JEDEC trays are supported.
• Up to 20 types of trays can be
stocked.
• Components can be supplied
from trays during operation.
Changeable Film Thickness
• Squeegee gap is programmable for each
component
TRANSFER TYPE MAX. DIMENSION
8 NOZZLES
4 COMPONENTS x TWO-TIME
BATCH TRANSFER
12 mm
3 NOZZLES
3 COMPONENTS BATCH
TRANSFER
15 mm
Component Types: Up to 216 (8 mm double tape feeder)
© Copyright 2005, 2008 Panasonic Corporation of North America. All rights reserved. Changes may be made without notice to specifications and appearance for product improvement. EAG013.02
Panasonic Factory Solutions Company of America
1-847-495-6100
PFSAmarketing@us.panasonic.com
panasonicfa.com
Safety Caution: To ensure safety when using this equipment,
all work should be performed in accordance with the
supplied operating instructions. Thoroughly read your
operating instructions manual.
CM602-L
GHG Factor 1.6
Resource Factor 2.1
(Ref. Product CM202-DH)
It may not conform to Machinery Directive and
EMC Directive in case of optional configuration and
custom-made specification.
Matsushita Group builds Environmental Management
System in the factories of the world and acquires the
International Environmental Standard ISO 14001:2004
Matsushita Group products are built with the
environment in mind.
http://panasonic.co.ip/eco/en/
platform
solution
one
Quick changeover
Modular and
highly compatible
Quick Changeover Capabilities
Include:
• Feeder carts
• Intelligent tape feeders
• Tape splicing (component
supplied during operation)
• Optimized software
Common Nozzles
Tape Feeder Bulk Feeder Stick Feeder
(8 mm to 104 mm)
Feeder Cart
Tape Splicing
• Our modular manufacturing concept ensures
high compatibility with the CM series.
Feeder Cart
Feeder
Ceramic Nozzles
Placement Data
Touch Panel Operation
Shuttle Tray Feeder
All data as of February 1, 2008